Abstract:
Lithographic apparatus includes a substrate table and a motion control system for controlling a movement of the substrate table. The motion control system includes at least 3 position detectors constructed for detecting a position of the substrate table. For measuring a position and orientation of the substrate table, each position detector comprises an optical encoder of a single dimensional or multi dimensional type, the optical encoders being arranged for providing together at least 6 position values, at least one position value being provided for each of the 3 dimensions. 3 or more of the at least 3 optical encoders being connected to the substrate table at different locations in the 3 dimensional coordinate system. The motion control system is arranged to calculate the position of the substrate table in the 3 dimensional coordinate system from a subset of at least 3 of the 6 position values and to calculate an orientation of the substrate table with respect to the coordinate system from another subset of at least 3 of the 6 position values. Further, a method for calibrating the position detectors is described.
Abstract:
A measurement system configured to measure a position of an object in a lithographic apparatus, includes at least three position detectors configured to detect the position of the object, the at least three position detectors each including a single or multi-dimensional optical encoder to provide at least six position values, the optical encoders being coupled to the object at different locations within a three dimensional coordinate system, wherein at least one position value is provided for each dimension of the three dimensional coordinate system, and wherein the measurement system is configured to calculate the position of the object within the three dimensional coordinate system from a subset of at least three of the six position values and to calculate an orientation of the object with respect to the three dimensional coordinate system from another subset of at least three of the six position values.
Abstract:
A method for calibrating an encoder in a lithographic apparatus, the encoder including a sensor and a grating, the encoder configured to measure a position of a moveable support of the lithographic apparatus, the method including measuring a position of the moveable support using an interferometer; and calibrating the encoder based on the position of the moveable support measured by the interferometer.
Abstract:
A measurement system configured to measure a position of an object in a lithographic apparatus, includes at least three position detectors configured to detect the position of the object, the at least three position detectors each including a single or multi-dimensional optical encoder to provide at least six position values, the optical encoders being coupled to the object at different locations within a three dimensional coordinate system, wherein at least one position value is provided for each dimension of the three dimensional coordinate system, and wherein the measurement system is configured to calculate the position of the object within the three dimensional coordinate system from a subset of at least three of the six position values and to calculate an orientation of the object with respect to the three dimensional coordinate system from another subset of at least three of the six position values.
Abstract:
The invention relates to a lithographic system that includes an illumination system for providing a projection beam of radiation, a mask table for supporting a mask, the mask serving to impart the projection beam with a pattern in its cross-section, a substrate table for holding a substrate, and a projection system for projecting the patterned beam onto a target portion of the substrate. The system also comprises a processor arranged to calculate overlay corrections using a reference height map representing a surface of the substrate table or the mask table. The invention allows feed forward correction of non-flatness induced wafer grid distortion during alignment and during exposure, thereby reducing overlay errors caused by differences in flatness characteristics. It provides an indirect qualification method for overlay accuracy related to exposure chuck flatness based on height map information.
Abstract:
A method for calibrating an encoder in a lithographic apparatus, the encoder including a sensor and a grating, the encoder configured to measure a position of a moveable support of the lithographic apparatus, the method including measuring a position of the moveable support using an interferometer; and calibrating the encoder based on the position of the moveable support measured by the interferometer.
Abstract:
A method for calibrating an encoder in a lithographic apparatus, the encoder including a sensor and a grating, the encoder configured to measure a position of a moveable support of the lithographic apparatus, the method including measuring a position of the moveable support using an interferometer; and calibrating the encoder based on the position of the moveable support measured by the interferometer.
Abstract:
A system and method are provided for qualifying or calibrating lithographic apparatus or parts therefor, using a predetermined objective criterion such as Chauvenet's criterion is used to reject measurement points, individually, by field or by substrate.
Abstract:
A system and method are provided for qualifying or calibrating lithographic apparatus or parts therefor, using a predetermined objective criterion such as Chauvenet's criterion is used to reject measurement points, individually, by field or by substrate.
Abstract:
A method for calibrating an encoder in a lithographic apparatus, the encoder including a sensor and a grating, the encoder configured to measure a position of a moveable support of the lithographic apparatus, the method including measuring a position of the moveable support using an interferometer; and calibrating the encoder based on the position of the moveable support measured by the interferometer.