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公开(公告)号：US5635266A
公开(公告)日：1997-06-03
申请号：US976533
申请日：1992-11-16
CPC分类号： B29C67/0007 , B29C65/125 , B29C66/73921 , E04F15/02016 , E04F15/10 , B29C66/1142 , B29C66/43 , B29C66/71 , B29K2027/06 , B29K2995/0021 , B29L2031/732 , Y10T428/16 , Y10T428/19 , Y10T428/25 , Y10T428/254 , Y10T428/2913
摘要： Vinyl heat welding rod for seam sealing vinyl resilient flooring, whether in sheet or tile form, are used to obtain a homogeneous, monolithic appearing surface. This rod is specifically made to duplicate the appearance of the flooring material. For a chip-image flooring structure, a sheet of multicolored chips having a similar, but different formulation from that of the flooring material is prepared and the sheet is cut into suitable strips, heat pressed in a rod mold, end adhered or further molded to form the desired length, and used as a vinyl heat welding rod for sealing seams in flooring. Thus, the chip pattern is evident in the seam area and does not appear different when compared to the adjacent surface.
摘要翻译： 用于接缝密封的乙烯基热焊条乙烯基弹性地板，无论是以片状或瓦片形式，用于获得均匀的单片出现表面。 该杆专门用于复制地板材料的外观。 对于芯片图像地板结构，制备具有与地板材料相似但不同配方的多色切片的片材，并将片材切割成合适的条带，在棒模具中热压，端部粘合或进一步模制成 形成所需的长度，并用作用于密封地板中的接缝的乙烯基热焊条。 因此，芯片图案在接缝区域是明显的，并且与相邻表面相比并不显示不同。
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公开(公告)号：US4791015A
公开(公告)日：1988-12-13
申请号：US144965
申请日：1988-01-19
CPC分类号： D06N7/001 , B29C44/321 , B29C59/026 , B29C67/205 , D06N3/0095 , D06N7/0057 , B29C2791/001 , B29K2105/04 , B29L2009/00 , B29L2031/732 , Y10T428/24479 , Y10T428/24612 , Y10T428/249971 , Y10T428/249973 , Y10T428/249974
摘要： The process for making a dimensionally stable, embossed, ornamented surface covering suitable for use as a floor or wall tile, involving, inter alia, laminating and embossing a resinous thermoplastic top layer having a plurality of openings extending through its thickness to allow the escape of air and extending to base material or substrate of pre-formed, low-density, reinforced, porous thermoplastic material. The base material may include hollow non-thermoplastic particles. The composite structure is subjected to heat and pressure in a flatbed press to emboss the structure without deformation, fuse the resins and render the top layer substantially impermeable. The improvement comprises the use of a rigid vinyl wear layer in a two step embossing operation involving a first embossing step in a heated press and immediately thereafter a second embossing step in a cooled press. The improvement also comprises partly providing a second resinous thermoplastic layer between the top layer and the base material, the second layer being capable of allowing passage of air through its thickness during the embossing and fusion step, and being adapted to soften and flow before the top layer does, thereby assuring complete closure of all openings in the top layers of the product.
摘要翻译： 制造适于用作地板或墙砖的尺寸稳定的，压花的，装饰的表面覆盖物的方法，其特别涉及层压和压花树脂的热塑性顶层，其具有延伸穿过其厚度的多个开口，以允许 空气并延伸到预先形成的低密度，增强的多孔热塑性材料的基材或基材。 基材可以包括中空非热塑性颗粒。 复合结构在平板压机中受到热和压力的压制，不会变形，使树脂熔化并使顶层基本上不可渗透。 改进之处在于在两步压花操作中使用刚性乙烯基耐磨层，其中包括加热压机中的第一压花步骤，此后在冷压机中立即进行第二压花步骤。 该改进还包括在顶层和基材之间部分地提供第二树脂热塑性层，第二层能够在压花和熔融步骤期间允许空气通过其厚度，并且适于在顶部和顶部之前软化和流动 从而确保完全封闭产品顶层中的所有开口。
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公开(公告)号：US4462853A
公开(公告)日：1984-07-31
申请号：US424757
申请日：1982-09-27
申请人： Richard M. Ringer
发明人： Richard M. Ringer
CPC分类号： B44C1/1712 , B44C1/17 , B41M5/025 , Y10T156/1093
摘要： The invention is directed to a process for printing floor tile. The transfer sheet containing the design to be placed upon the floor tile is utilized as the carrier for the floor tile as it passes through the processing operation. The floor tile is positioned upon the transfer sheet in register with the design on the transfer sheet. The tile is held in position on the transfer sheet by static electricity and is fed between laminated rolls which laminate the transfer sheet to the floor tile. Subsequent removal of the transfer sheet from the floor tile leaves the design of the transfer sheet on the surface of the floor tile.
摘要翻译： 本发明涉及印刷地砖的方法。 包含放置在地板砖上的设计的转印纸在通过处理操作时用作地板砖的承载件。 地板砖位于转印纸上，与转印纸上的设计对准。 瓷砖通过静电保持在转印纸上的适当位置，并且将转印纸层压到层压砖之间的层压辊之间进料。 随后从地板砖上取下转印纸将转印纸的设计留在地砖的表面上。
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公开(公告)号：USRE36458E
公开(公告)日：1999-12-21
申请号：US911622
申请日：1997-08-15
CPC分类号： B29C67/0007 , B29C65/125 , B29C66/73921 , B29C66/1142 , B29C66/43 , B29C66/71 , B29K2027/06 , B29K2995/0021 , B29L2031/732 , Y10T428/16 , Y10T428/19 , Y10T428/25 , Y10T428/254 , Y10T428/2913
摘要： Vinyl heat welding rod for seam sealing vinyl resilient flooring, whether in sheet or tile form, are used to obtain a homogeneous, monolithic appearing surface. This rod is specifically made to duplicate the appearance of the flooring material. For a chip-image flooring structure, a sheet of multicolored chips having a similar, but different formulation from that of the flooring material is prepared and the sheet is cut into suitable strips, heat pressed in a rod mold, end adhered or further molded to form the desired length, and used as a vinyl heat welding rod for sealing seams in flooring. Thus, the chip pattern is evident in the seam area and does not appear different when compared to the adjacent surface.
摘要翻译： 用于接缝密封的乙烯基热焊条乙烯基弹性地板，无论是以片状或瓦片形式，用于获得均匀的单片出现表面。 该杆专门用于复制地板材料的外观。 对于芯片图像地板结构，制备具有与地板材料相似但不同配方的多色切片的片材，并将片材切割成合适的条带，在棒模具中热压，端部粘合或进一步模制成 形成所需的长度，并用作用于密封地板中的接缝的乙烯基热焊条。 因此，芯片图案在接缝区域是明显的，并且与相邻表面相比并不显示不同。
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5.发明授权
公开(公告)号：US4747901A
公开(公告)日：1988-05-31
申请号：US806829
申请日：1985-12-10
IPC分类号： B32B27/08 , B29C59/02 , B29C67/20 , B29L9/00 , B32B3/26 , B32B3/30 , B32B5/18 , B32B7/04 , B32B27/20 , B32B27/30 , B32B33/00 , B32B37/10 , B32B37/24 , D06N3/00 , D06N7/00 , D06N7/02 , D06N7/04 , B31F1/00 , B28B11/08 , B29C59/00 , B32B3/00
CPC分类号： D06N7/0057 , B29C44/321 , B29C59/026 , B29C67/205 , D06N3/0095 , D06N7/001 , B29C2791/001 , B29K2105/04 , B29L2009/00 , B29L2031/732 , Y10T156/1041 , Y10T156/1044 , Y10T428/163 , Y10T428/24612
摘要： The process for making a dimensionally stable, embossed, ornamented surface covering suitable for use as a floor or wall tile, involving, laminating and embossing a resinous thermoplastic top layer having a plurality of openings extending through its thickness to allow the escape of air and extending to a base material or substrate of pre-formed, low-density, reinforced, porous thermoplastic material. The composite structure is subjected to heat and pressure in a flatbed press to emboss the structure without deformation, fuse the resins and render the top layer substantially impermeable. The improvement comprises the use of a rigid vinyl wear layer in a two step embossing operation involving a first embossing step in a heated press and immediately thereafter a second embossing step in a cooled press. The improvement also comprises partly providing a second resinous thermoplastic layer between the top layer and the base material, the second layer being capable of allowing passage of air through its thickness during the embossing and fusion step, and being adapted to soften and flow before the top layer does, thereby assuring complete closure of all openings in the top layers of the product.
摘要翻译： 制造适合用作地板或墙砖的尺寸稳定的，压花的，装饰的表面覆盖物的方法，涉及，层压和压花树脂的热塑性顶层，其具有延伸穿过其厚度的多个开口，以允许空气逸出并延伸 到预成形的低密度，增强的多孔热塑性材料的基材或基材。 复合结构在平板压机中受到热和压力的压制，不会变形，使树脂熔化并使顶层基本上不可渗透。 改进之处在于在两步压花操作中使用刚性乙烯基耐磨层，其中包括加热压机中的第一压花步骤，此后在冷压机中立即进行第二压花步骤。 该改进还包括在顶层和基材之间部分地提供第二树脂热塑性层，第二层能够在压花和熔融步骤期间允许空气通过其厚度，并且适于在顶部和顶部之前软化和流动 从而确保完全封闭产品顶层中的所有开口。
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6.发明授权Stress-free, embossed, ornamented tile surface covering and process for making the same 失效无压力，压花，装饰瓷砖表面覆盖和制作相同的工艺
公开(公告)号：US4604312A
公开(公告)日：1986-08-05
申请号：US619318
申请日：1984-06-11
申请人： Thomas C. Creighton , William C. Dorsey , Walter J. Lewicki, Jr. , Harry F. Long , Richard M. Ringer
发明人： Thomas C. Creighton , William C. Dorsey , Walter J. Lewicki, Jr. , Harry F. Long , Richard M. Ringer
CPC分类号： D06N7/0055 , D06N3/0022 , D06N3/0097 , D06N7/0002 , D06N7/0007 , D06N7/0039 , D06N7/0092 , D06N2209/128 , D06N2209/1628 , Y10T156/1056 , Y10T428/24868 , Y10T428/24876
摘要： A stress-free embossed, ornamented surface covering, suitable for use as a floor or wall tile, is made by: providing a decorated resinous film on a release carrier, with the decorated surface of the film facing away from the carrier; providing on a release carrier a pre-formed, low-density, reinforced, porous thermoplastic base material, which may include hollow, non-thermoplastic particles; interfacing the decorated surface of the film with the top surface of the base material; perforating the film, after removal of the release carriers; and, subjecting the structure to high frequency electrical energy and pressure in a flatbed press having a cooled embossing plate and a cooled back-up plate, to emboss the structure, fuse the resins and render the film substantially impermeable. The film may be die cut in register with the decoration thereon while it is on the release carrier, without cutting the carrier, prior to lamination of the film to similarly cut and shaped pieces of the base material or, the base material and the decorated film thereon may be simultaneously cut in register with the decoration after removal of the release carriers. An adhesive coating and a releasable paper may be applied to the back of the product to facilitate installation thereof on a surface upon removal of the paper.
摘要翻译： 通过以下方式制造适合用作地板或墙砖的无压花的装饰表面覆盖物：在释放载体上提供装饰的树脂膜，其中膜的装饰表面背离载体; 在释放载体上提供预先形成的低密度，增强的多孔热塑性基材，其可以包括中空的非热塑性颗粒; 将膜的装饰表面与基材的顶表面接合; 在去除载体后穿孔膜; 并且在具有冷却压花板和冷却的备用板的平板压机中对结构进行高频电能和压力，以压印该结构，使树脂熔化并使膜基本上不可渗透。 在将薄膜层压成类似的切割和成形的基材之前，可以将薄膜在其上放置在其上，同时在其上放置在释放载体上而不切割载体，或者基材和装饰膜 在移除释放载体之后，其上可以同时切割与装饰对准的装置。 可以将粘合剂涂层和可释放的纸张施加到产品的背面以便于在移除纸张时将其安装在表面上。
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公开(公告)号：US4070435A
公开(公告)日：1978-01-24
申请号：US766941
申请日：1977-02-09
CPC分类号： D06N7/001 , B29C59/046 , B32B5/18 , B41M1/24 , B44C1/24 , Y10T156/1041
摘要： The process herein is used for achieving multilevel mechanical embossing of a fused or cured wear layer in register with a print on an expanded foam thereunder. The expansion of the decorative foam and fusion of the wear layer are carried out and then the back of the foam is cooled by wetting and liquid evaporation. The wear layer is maintained at a high temperature for embossing and is embossed with registry between the embossed pattern and the printed pattern on the foam. Just prior to embossing, the decorative foam-wear layer web is wrapped around the backup roll of the embossing apparatus, and after embossing, is wrapped partially around the embossing roll of the embossing apparatus.
摘要翻译： 本文的方法用于实现熔融或固化的耐磨层的多层机械压花，其与其上的膨胀泡沫上的印刷对准。 进行装饰泡沫的膨胀和耐磨层的融合，然后通过润湿和液体蒸发冷却泡沫的背面。 将耐磨层保持在高温以进行压花，并且在浮雕图案和泡沫上的印刷图案之间被压花成对。 在压花之前，将装饰性泡沫 - 耐磨层纤维网卷绕在压花装置的支承辊上，并且在压花之后，部分地包裹在压花装置的压纹辊周围。
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公开(公告)号：US4142849A
公开(公告)日：1979-03-06
申请号：US823468
申请日：1977-08-10
CPC分类号： D06N7/001 , B29C59/046 , Y10S264/82 , Y10S425/235
摘要： The process and apparatus herein is used for achieving multilevel mechanical embossing of a fused or cured wear layer in register with a print on an expanded foam thereunder. The expansion of the decorative foam and fusion of the wear layer are carried out and then the back of the foam is cooled by wetting and liquid evaporation. The wear layer is maintained at a high temperature for embossing and is embossed with registry between the embossed pattern and the printed pattern on the foam. Just prior to embossing, the decorative foam-wear layer web is wrapped around the backup roll of the embossing apparatus, and after embossing, is wrapped partially around the embossing roll of the embossing apparatus.
摘要翻译： 本发明的方法和装置用于实现熔融或固化的耐磨层的多层机械压花，其与其上的膨胀泡沫上的印刷对准。 进行装饰泡沫的膨胀和耐磨层的融合，然后通过润湿和液体蒸发冷却泡沫的背面。 将耐磨层保持在高温以进行压花，并且在浮雕图案和泡沫上的印刷图案之间被压花成对。 在压花之前，将装饰性泡沫 - 耐磨层纤维网卷绕在压花装置的支承辊上，并且在压花之后，部分地包裹在压花装置的压纹辊周围。
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