High-throughput, low-temperature process for depositing oxides
    1.
    发明授权
    High-throughput, low-temperature process for depositing oxides 失效
    用于沉积氧化物的高温低温工艺

    公开(公告)号:US5190792A

    公开(公告)日:1993-03-02

    申请号:US413357

    申请日:1989-09-27

    CPC分类号: C23C16/402 C23C16/0227

    摘要: The present invention relates to a low-pressure chemical vapor deposition (LPCVD) process for depositing silicon dioxide. In particular, the present invention describes a process involving a pre-cleaning step in which all impurities are removed from the substrate followed by a LPCVD step performed at temperatures of between 200.degree. C. and 300.degree. C. The process of the present invention is intended to replace higher temperature LPCVD and thermal processes for depositing silicon dioxide.More particularly, the present invention involves a process in which a substrate is washed using a predetermined cleaning process. The substrate is then exposed to a dilute hydrofluoric acid solution which removes native oxide and contaminants from the surface. Next, the substrate is rinsed with, for example, de-ionized water or ultra-clean water to remove any hydrofluoric acid or other residue from the previous process steps. A layer of material, for example, silicon dioxide, is then deposited using a low-pressure chemical vapor deposition process in which the gas flow comprises silane, oxygen and nitrogen at temperatures below 300.degree. C. Oxide qualities approaching those of thermally grown oxides having been achieved.