公开(公告)号：US20120091594A1

公开(公告)日：2012-04-19

申请号：US13275988

申请日：2011-10-18

申请人： Christof LANDESBERGER ,  Robert FAUL

发明人： Christof LANDESBERGER ,  Robert FAUL

IPC分类号： H01L23/498 ,  H01L21/78

CPC分类号： H01L24/19 ,  H01L23/3121 ,  H01L23/4985 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/564 ,  H01L24/13 ,  H01L24/20 ,  H01L24/27 ,  H01L24/83 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/21 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/2731 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/83132 ,  H01L2224/83143 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/92244 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15321 ,  H05K1/185 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/00014 ,  H01L2224/13099

摘要： A method of producing a chip package includes providing a substrate comprising a first recess having a recess bottom and recess side walls. A chip comprising a chip backside is introduced into the recess such that the chip does not protrude from the recess and such that a gap remains between the recess side walls and the chip, the chip backside being attached to the recess bottom. The gap is filled with a filler material.

摘要翻译： 制造芯片封装的方法包括提供包括具有凹陷底部和凹陷侧壁的第一凹部的基板。 包括芯片背面的芯片被引入到凹部中，使得芯片不从凹部突出，并且在凹部侧壁和芯片之间留有间隙，芯片背面附接到凹部底部。 间隙填充有填料。

公开(公告)号：US08563358B2

公开(公告)日：2013-10-22

申请号：US13275988

申请日：2011-10-18

申请人： Christof Landesberger ,  Robert Faul

发明人： Christof Landesberger ,  Robert Faul

IPC分类号： H01L21/00 ,  H01L23/52

CPC分类号： H01L24/19 ,  H01L23/3121 ,  H01L23/4985 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/564 ,  H01L24/13 ,  H01L24/20 ,  H01L24/27 ,  H01L24/83 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/21 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/2731 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/83132 ,  H01L2224/83143 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/92244 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15321 ,  H05K1/185 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/00014 ,  H01L2224/13099

摘要： A method of producing a chip package includes providing a substrate comprising a first recess having a recess bottom and recess side walls. A chip comprising a chip backside is introduced into the recess such that the chip does not protrude from the recess and such that a gap remains between the recess side walls and the chip, the chip backside being attached to the recess bottom. The gap is filled with a filler material.

摘要翻译： 制造芯片封装的方法包括提供包括具有凹陷底部和凹陷侧壁的第一凹部的基板。 包括芯片背面的芯片被引入到凹部中，使得芯片不从凹部突出，并且在凹部侧壁和芯片之间留有间隙，芯片背面附接到凹部底部。 间隙填充有填料。