SURFACE MOUNT INTERCONNECTION SYSTEM FOR MODULAR CIRCUIT BOARD AND METHOD
    2.
    发明申请
    SURFACE MOUNT INTERCONNECTION SYSTEM FOR MODULAR CIRCUIT BOARD AND METHOD 审中-公开
    用于模块化电路板的表面安装互连系统和方法

    公开(公告)号:US20130335931A1

    公开(公告)日:2013-12-19

    申请号:US13524197

    申请日:2012-06-15

    IPC分类号: H01R12/73 H05K3/36 H01R12/79

    摘要: A surface mount interconnection system provides a method and apparatus for mounting an auxiliary printed circuit board assembly directly to a main printed circuit board assembly without the use of leaded surface mount devices. A linear array of spaced-apart solder pads is arranged on an exposed surface of the substrate of both assemblies, with at least one of solder pad arrays being located adjacent an edge of its associated substrate. A selected plurality of aligned cooperating pairs of solder pads are electrically and mechanically interconnected by a solder ball reflowed to form a joint there between. The solder balls comprise a high melting temperature inner core and a low melting temperature outer solder core.

    摘要翻译: 表面安装互连系统提供了一种用于将辅助印刷电路板组件直接安装到主印刷电路板组件而不使用有铅表面安装装置的方法和装置。 间隔开的焊盘的线性阵列布置在两个组件的衬底的暴露表面上,其中至少一个焊盘阵列位于其相关衬底的边缘附近。 所选择的多个对准的配对的焊盘对通过回流的焊球电连接和机械地互连,以在其间形成接头。 焊球包括高熔点内芯和低熔点外部焊料芯。

    MACHINE PLACEABLE CIRCUIT BOARD INTERPOSER
    3.
    发明申请
    MACHINE PLACEABLE CIRCUIT BOARD INTERPOSER 审中-公开
    机器电路板插座

    公开(公告)号:US20130003336A1

    公开(公告)日:2013-01-03

    申请号:US13170959

    申请日:2011-06-28

    IPC分类号: H05K1/14

    摘要: An interposer for connecting two or more circuit boards is a circuit carrying substrate with two or more solder pads on each of two sides. Each of the solder pads are connected to an electrically conductive via in the substrate, providing electrical interconnection from one side to the other side. One or more solder pads have a solder ball on it. The interposer has a contact area suitable for the interposer to be picked up and placed by an automated part placement machine. An electrical assembly is made by soldering the solder balls on one side of the interposer to corresponding solder pads on a circuit board. The solder balls on the other side of the interposer are likewise soldered to the corresponding solder pads of a second circuit board.

    摘要翻译: 用于连接两个或更多个电路板的插入器是在两侧上的每一侧上具有两个或更多个焊盘的电路承载衬底。 每个焊盘连接到衬底中的导电通孔,提供从一侧到另一侧的电互连。 一个或多个焊盘在其上具有焊球。 插入器具有适合于通过自动化部件放置机器拾取和放置的插入件的接触区域。 通过将插入件的一侧上的焊球焊接到电路板上的对应焊盘来制造电气组件。 插入器另一侧的焊球同样被焊接到第二电路板的对应的焊盘上。