Semiconductor light-emitting element

    公开(公告)号:US11309457B2

    公开(公告)日:2022-04-19

    申请号:US16068081

    申请日:2017-01-05

    摘要: Disclosed is a semiconductor light emitting device characterized by being a flip chip including: a plurality of semiconductor layers, which includes a first semiconductor layer having a first conductivity, a second semiconductor layer having a second conductivity different from the first conductivity type, and an active layer interpositioned between the first and second semiconductor layers and adapted to generate light by electron-hole recombination; an insulating layer, which is formed on the plurality of semiconductor layers and has openings; and an electrode formed on the insulating layer and electrically connected to the plurality of semiconductor layers through the opening, wherein the electrode has a top face and a bottom face, with the top face having a smaller area than the bottom face.

    Semiconlight Light Emitting Diode

    公开(公告)号:US20210265539A1

    公开(公告)日:2021-08-26

    申请号:US16984766

    申请日:2020-08-04

    摘要: Disclosed is a semiconductor light emitting device comprising: an external substrate; a first semiconductor light emitting device chip provided on the external substrate, comprising a first plurality of semiconductor layers including a first active layer for generating ultraviolet light by recombination of electrons and holes, and a first electrode electrically connected to the first plurality of semiconductor layers; a lens configured to surround the first semiconductor light emitting device chip, the lens serving to refract the ultraviolet light from the first semiconductor light emitting device chip and forming an orientation angle within a predefined range; and, a second semiconductor light emitting device chip provided on the external substrate, the second semiconductor light emitting device comprising a second plurality of semiconductor layers including a second active layer for generating visible light by recombination of electrons and holes, and a second electrode electrically connected to the second plurality of semiconductor layers.

    Semiconductor light emitting device

    公开(公告)号:US10205060B2

    公开(公告)日:2019-02-12

    申请号:US15118235

    申请日:2015-02-11

    发明人: Soo Kun Jeon

    摘要: Disclosed is a semiconductor light emitting device, including: a plurality of semiconductor layers; a non-conductive reflective film coupled to the plurality of the semiconductor layers; and one or more electrodes formed on the non-conductive reflective film and electrically connected to the plurality of semiconductor layers, in which the one or more electrodes respectively include a lower electrode layer for reflecting light generated in the active layer and then passed the non-conductive reflective film, and an upper electrode layer arranged on the lower electrode layer for preventing a foreign material from penetrating into the lower electrode layer.

    Semiconductor light emitting device
    8.
    发明授权
    Semiconductor light emitting device 有权
    半导体发光器件

    公开(公告)号:US09530941B2

    公开(公告)日:2016-12-27

    申请号:US14118602

    申请日:2013-07-18

    摘要: The present disclosure relates to a semiconductor light emitting device, comprising: a plurality of semiconductor layers, including an active layer, generating light via electron-hole recombination; a first electrode; a non-conductive distributed bragg reflector coupled to the plurality of semiconductor layers, reflecting the light from the active layer; and a first light-transmitting film coupled to the distributed bragg reflector from a side opposite to the plurality of semiconductor layers with respect to the non-conductive distributed bragg reflector, with the first light-transmitting film having a refractive index lower than an effective refractive index of the distributed bragg reflector.

    摘要翻译: 本公开涉及一种半导体发光器件,包括:多个半导体层,包括有源层,通过电子 - 空穴复合产生光; 第一电极; 耦合到所述多个半导体层的非导电分布式布拉格反射器,反射来自所述有源层的光; 以及第一透光膜,其相对于所述非导电分布布拉格反射器从与所述多个半导体层相反的一侧耦合到所述分布式布拉格反射器,其中所述第一透光膜的折射率低于有效折射率 分布式布拉格反射器的折射率。

    Method of Manufacturing Semiconductor Light Emitting Device
    9.
    发明申请
    Method of Manufacturing Semiconductor Light Emitting Device 有权
    制造半导体发光装置的方法

    公开(公告)号:US20150155426A1

    公开(公告)日:2015-06-04

    申请号:US14118597

    申请日:2013-07-18

    IPC分类号: H01L33/00

    摘要: The present disclosure relates to a method of manufacturing a semiconductor light emitting device, comprising: forming a finger electrode in electrical communication with a second semiconductor layer; forming, on the finger electrode, a non-conductive reflective layer made up of a multi-layer dielectric film, for reflecting light from the active layer towards a first semiconductor layer on the side of a growth substrate, with the non-conductive reflective layer including a bottom layer formed by chemical vapor deposition and at least two layers formed by physical vapor deposition; and forming an electrical connection, passing through the non-conductive reflective film and being connected the finger electrode.

    摘要翻译: 本公开涉及一种制造半导体发光器件的方法,包括:形成与第二半导体层电连通的指状电极; 在指状电极上形成由多层电介质膜构成的非导电性反射层,用于将来自有源层的光朝向生长衬底侧的第一半导体层反射,使非导电性反射层 包括通过化学气相沉积形成的底层和通过物理气相沉积形成的至少两层; 并形成电连接,穿过非导电反射膜并连接指状电极。

    Semiconductor light-emitting device and manufacturing method therefor

    公开(公告)号:US11600755B2

    公开(公告)日:2023-03-07

    申请号:US16964091

    申请日:2019-04-23

    IPC分类号: H01L33/62 H01L33/24 H01L33/38

    摘要: Disclosed is a semiconductor light emitting device comprising: a substrate; a first semiconductor layer, which is provided on the substrate and has a first conductivity; an active layer, which is provided on the first semiconductor layer and generates ultraviolet light by electron-hole recombination; a second semiconductor layer, which is provided on the active layer and has a second conductivity different from the first conductivity; a first electrode electrically connected to the first semiconductor layer; a second electrode electrically connected to the second semiconductor layer; a second region that includes a plurality of protruded parts of the active layer and the second semiconductor layer protruded from the first semiconductor layer as seen in cross-sectional view and recesses between the protruded parts; and a first region surrounding the second region.