公开(公告)号：US20110099807A1

公开(公告)日：2011-05-05

申请号：US12805293

申请日：2010-07-22

申请人： Dong Sun Kim ,  Taehoon Kim ,  Jong Seok Song ,  Sam Jin Her ,  Jun Heyoung Park

发明人： Dong Sun Kim ,  Taehoon Kim ,  Jong Seok Song ,  Sam Jin Her ,  Jun Heyoung Park

IPC分类号： H05K3/10 ,  H05K3/42

CPC分类号： H05K3/381 ,  H05K1/0346 ,  H05K3/108 ,  H05K3/146 ,  H05K3/426 ,  H05K3/4644 ,  H05K2201/0154 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/092 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/24917

摘要： A fabrication method which can improve electrical properties, shorten processing time, and reduce the thickness of a chip package by achieving an ultra-thin fine circuit pattern. The method for fabricating a printed circuit board includes: providing an insulating material; forming in the insulating material at least one via-hole for interlayer electrical connection; ion beam treating the surface of the insulating material having the via-hole formed therein; forming a copper seed layer on the surface-treated insulating material using a vacuum deposition process; and plating a copper pattern on the copper seed layer to form a circuit pattern.

摘要翻译： 通过实现超薄精细电路图案，能够提高电性能，缩短加工时间，减小芯片封装的厚度的制造方法。 制造印刷电路板的方法包括：提供绝缘材料; 在所述绝缘材料中形成至少一个用于层间电连接的通孔; 离子束处理其中形成有通孔的绝缘材料的表面; 使用真空沉积工艺在表面处理的绝缘材料上形成铜种子层; 并在铜籽晶层上镀铜图案以形成电路图案。

公开(公告)号：US08065798B2

公开(公告)日：2011-11-29

申请号：US12805293

申请日：2010-07-22

申请人： Dong Sun Kim ,  Taehoon Kim ,  Jong Seok Song ,  Sam Jin Her ,  Jun Heyoung Park

发明人： Dong Sun Kim ,  Taehoon Kim ,  Jong Seok Song ,  Sam Jin Her ,  Jun Heyoung Park

IPC分类号： H01K13/00 ,  H01B13/00

CPC分类号： H05K3/381 ,  H05K1/0346 ,  H05K3/108 ,  H05K3/146 ,  H05K3/426 ,  H05K3/4644 ,  H05K2201/0154 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/092 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/24917

摘要： A fabrication method which can improve electrical properties, shorten processing time, and reduce the thickness of a chip package by achieving an ultra-thin fine circuit pattern. The method for fabricating a printed circuit board includes: providing an insulating material; forming in the insulating material at least one via-hole for interlayer electrical connection; ion beam treating the surface of the insulating material having the via-hole formed therein; forming a copper seed layer on the surface-treated insulating material using a vacuum deposition process; and plating a copper pattern on the copper seed layer to form a circuit pattern.

公开(公告)号：US08039174B2

公开(公告)日：2011-10-18

申请号：US11641716

申请日：2006-12-20

申请人： Hye Yeon Cha ,  Tae Hoon Kim ,  Chang Sup Ryu ,  Sam Jin Her ,  Sung Han Kim

发明人： Hye Yeon Cha ,  Tae Hoon Kim ,  Chang Sup Ryu ,  Sam Jin Her ,  Sung Han Kim

IPC分类号： H01M8/02 ,  H01M4/88

CPC分类号： H01M8/1011 ,  H01M4/8657 ,  H01M4/8803 ,  H01M4/92 ,  H01M8/0239 ,  H01M8/0245 ,  H01M8/1004 ,  H01M8/1097 ,  H01M2250/30 ,  Y02B90/18 ,  Y02E60/523 ,  Y02P70/56

摘要： Through holes for flow paths of the fuel cell are formed in a thermoplastic polymer film by a process selected from a group consisting of laser drilling, etching and lithography, an inner side surface of the thermoplastic polymer film is coated with a metal layer, and the through holes are filled with a fuel diffusion material and a catalyst to provide an anode. The procedure is repeated to provide a cathode. Then, the anode and the cathode are placed to oppose each other. A cation conducting polymer membrane is disposed, between the anode and the cathode, and the anode, the cation conducting polymer membrane and the cathode are hot-pressed.

摘要翻译： 通过选自激光钻孔，蚀刻和光刻的方法，在热塑性聚合物膜中形成用于燃料电池的流路的通孔，热塑性聚合物膜的内侧表面涂覆有金属层，并且 通孔填充有燃料扩散材料和催化剂以提供阳极。 重复该过程以提供阴极。 然后，阳极和阴极彼此相对放置。 在阳极和阴极之间设置阳离子导电聚合物膜，并且阳极，阳离子导电聚合物膜和阴极被热压。

公开(公告)号：US07794820B2

公开(公告)日：2010-09-14

申请号：US11878165

申请日：2007-07-20

申请人： Dong Sun Kim ,  Taehoon Kim ,  Jong Seok Song ,  Sam Jin Her ,  Jun Heyoung Park

发明人： Dong Sun Kim ,  Taehoon Kim ,  Jong Seok Song ,  Sam Jin Her ,  Jun Heyoung Park

IPC分类号： B32B15/00

CPC分类号： H05K3/381 ,  H05K1/0346 ,  H05K3/108 ,  H05K3/146 ,  H05K3/426 ,  H05K3/4644 ,  H05K2201/0154 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/092 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/24917

摘要： Disclosed herein are a printed circuit board and a fabrication method thereof, which can improve electrical properties, shorten processing time, and reduce the thickness of a chip package by achieving an ultra-thin fine circuit pattern. The printed circuit board includes an insulating material; a via-hole formed in a given location of the insulating material; a copper seed layer formed through ion beam surface treatment and vacuum deposition on the surface of the insulating material having the via-hole formed therein; and a copper pattern plating layer formed on a given region of the insulating material, which has the copper seed layer formed thereon, and in the via-hole.

摘要翻译： 这里公开了一种印刷电路板及其制造方法，其可以通过实现超薄精细电路图案来改善电性能，缩短处理时间并减小芯片封装的厚度。 印刷电路板包括绝缘材料; 形成在绝缘材料的给定位置的通孔; 通过离子束表面处理形成的铜籽晶层，并且在其中形成有通孔的绝缘材料的表面上真空沉积; 以及形成在其上形成有铜种子层的绝缘材料的给定区域上的铜图案镀层和通孔。