公开(公告)号：US08209862B2

公开(公告)日：2012-07-03

申请号：US13137935

申请日：2011-09-21

申请人： Jong-Seok Song

发明人： Jong-Seok Song

IPC分类号： H01K3/10

CPC分类号： H05K1/0346 ,  H05K1/0366 ,  H05K3/381 ,  H05K3/426 ,  H05K3/4644 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49227 ,  Y10T442/20

摘要： An insulating material formed by impregnating a base material with a liquid composition and curing the liquid composition, the liquid composition being 20 to 50 parts by weight of a PMDA-ODA mixture, the PMDA-ODA mixture including pyromellitic dianhydride (PMDA) and oxydianiline (ODA) mixed in a weight ratio of 40:60 to 60:40; 50 to 80 parts by weight of a triazine derivative; and 300 to 600 parts by weight of an organic solvent. A printed circuit board includes an insulator formed of the above insulating material; a circuit pattern formed on one or either side of the insulator; and a via penetrating the insulator.

摘要翻译： 通过用液体组合物浸渍基材并固化液体组合物形成的绝缘材料，液体组合物为20至50重量份的PMDA-ODA混合物，PMDA-ODA混合物包括均苯四酸二酐（PMDA）和氧化二苯胺（ ODA）以40:60至60:40的重量比混合; 50〜80重量份的三嗪衍生物; 和300〜600重量份的有机溶剂。 印刷电路板包括由上述绝缘材料形成的绝缘体; 形成在绝缘体的一侧或两侧的电路图案; 以及穿过绝缘体的通孔。

公开(公告)号：US07794820B2

公开(公告)日：2010-09-14

申请号：US11878165

申请日：2007-07-20

申请人： Dong Sun Kim ,  Taehoon Kim ,  Jong Seok Song ,  Sam Jin Her ,  Jun Heyoung Park

发明人： Dong Sun Kim ,  Taehoon Kim ,  Jong Seok Song ,  Sam Jin Her ,  Jun Heyoung Park

IPC分类号： B32B15/00

CPC分类号： H05K3/381 ,  H05K1/0346 ,  H05K3/108 ,  H05K3/146 ,  H05K3/426 ,  H05K3/4644 ,  H05K2201/0154 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/092 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/24917

摘要： Disclosed herein are a printed circuit board and a fabrication method thereof, which can improve electrical properties, shorten processing time, and reduce the thickness of a chip package by achieving an ultra-thin fine circuit pattern. The printed circuit board includes an insulating material; a via-hole formed in a given location of the insulating material; a copper seed layer formed through ion beam surface treatment and vacuum deposition on the surface of the insulating material having the via-hole formed therein; and a copper pattern plating layer formed on a given region of the insulating material, which has the copper seed layer formed thereon, and in the via-hole.

摘要翻译： 这里公开了一种印刷电路板及其制造方法，其可以通过实现超薄精细电路图案来改善电性能，缩短处理时间并减小芯片封装的厚度。 印刷电路板包括绝缘材料; 形成在绝缘材料的给定位置的通孔; 通过离子束表面处理形成的铜籽晶层，并且在其中形成有通孔的绝缘材料的表面上真空沉积; 以及形成在其上形成有铜种子层的绝缘材料的给定区域上的铜图案镀层和通孔。

公开(公告)号：US20090188231A1

公开(公告)日：2009-07-30

申请号：US12092546

申请日：2006-11-13

申请人： Jong Seok Song

发明人： Jong Seok Song

IPC分类号： D01H1/14 ,  H05B3/00

CPC分类号： H05B3/56 ,  Y10T29/49083

摘要： Disclosed herein is an electric heating cable which is used in an electric heating apparatus and minimizes an electromagnetic field. The electric heating cable is manufactured by twisting first and second electric heating strands in three axes. Each electric heating strand includes a core wire comprising a stranded wire of a resistor, and an insulating sheath made of fluorine resin. According to the invention, the electric heating cable does not come untwisted in a free state even if no adhering means is used, and is compactly twisted, so that the electric heating cable maintains a state of closer contact and has superior flexibility, thus reducing leakage flux, and the electric heating cable has a small in outer diameter and is light, so that it is useful for a thin electric heating apparatus, and incurs a low manufacturing cost.

摘要翻译： 这里公开了一种电加热电缆，其用于电加热装置并使电磁场最小化。 电加热电缆通过将第一和第二电加热线绞合在三个轴上来制造。 每个电加热线包括包括电阻器的绞线的芯线和由氟树脂制成的绝缘护套。 根据本发明，即使没有使用粘合手段，电加热电缆也不会在自由状态下解捻并且紧密地扭曲，使得电加热电缆保持更接近的状态并具有优异的柔性，从而减少泄漏 磁通，电加热电缆的外径小，重量轻，因此对于薄型电加热装置是有用的，并且制造成本低。

公开(公告)号：US20070261234A1

公开(公告)日：2007-11-15

申请号：US11709215

申请日：2007-02-22

申请人： Jong Seok Song ,  Taehoon Kim ,  Dong Sun Kim ,  Hye Yeon Cha

发明人： Jong Seok Song ,  Taehoon Kim ,  Dong Sun Kim ,  Hye Yeon Cha

IPC分类号： H01K3/10 ,  H05K3/10 ,  H05K3/02

CPC分类号： H05K3/381 ,  H05K3/108 ,  H05K3/146 ,  H05K3/4069 ,  H05K3/426 ,  H05K3/4602 ,  H05K2201/0959 ,  H05K2203/092 ,  H05K2203/1152 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

摘要： Disclosed is a method of manufacturing a build-up printed circuit board, in which the circuit of a build-up printed circuit board including a core layer and an outer layer is realized by forming the metal seed layer of the core layer using a dry process, consisting of ion beam surface treatment and vacuum deposition, instead of a conventional wet process, including a wet surface roughening process and electroless plating. When the wet process is replaced with the dry process in the method of the invention, the circuit layer can be formed in an environmentally friendly manner, and as well, all circuit layers of the substrate including the core layer and the outer layer can be manufactured through a semi-additive process. Further, the peel strength between the resin substrate and the metal layer can be increased, thus realizing a highly reliable fine circuit.

摘要翻译： 公开了一种积层印刷电路板的制造方法，其中通过使用干法形成芯层的金属种子层来实现包括芯层和外层的积层印刷电路板的电路 ，由离子束表面处理和真空沉积组成，代替常规的湿法，包括湿表面粗糙化处理和无电镀。 当在本发明的方法中用干法代替湿法时，电路层可以以环境友好的方式形成，并且可以制造包括芯层和外层的基片的所有电路层 通过半加成过程。 此外，可以提高树脂基板和金属层之间的剥离强度，从而实现高可靠性的精细电路。

公开(公告)号：US08141244B2

公开(公告)日：2012-03-27

申请号：US12285318

申请日：2008-10-01

申请人： Jong-Seok Song

发明人： Jong-Seok Song

IPC分类号： H01K3/10

CPC分类号： H05K1/0346 ,  H05K1/0366 ,  H05K3/381 ,  H05K3/426 ,  H05K3/4644 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49227 ,  Y10T442/20

摘要： An insulating material, a printed circuit board that utilizes the insulating material, and a method of manufacturing the printed circuit board. The method includes perforating at least one through-hole corresponding with the at least one, which is in correspondence with the via, in a first insulator; applying a surface treatment on the first insulator by irradiating an ion beam; forming a first seed layer over an inner wall of the through-hole and over one or either side of the first insulator; forming a first plating resist over one or either side of the first insulator on which the first seed layer is formed; performing electroplating in correspondence with the circuit pattern and the via; removing the first plating resist; and removing a portion of the first seed layer by flash etching. This method can improve adhesion between the insulator and the circuit patterns to allow fine-line circuit patterns.

摘要翻译： 绝缘材料，利用绝缘材料的印刷电路板，以及印刷电路板的制造方法。 该方法包括在与第一绝缘体相对应的至少一个与通孔对应的至少一个通孔中穿孔; 通过照射离子束对第一绝缘体进行表面处理; 在所述通孔的内壁上并在所述第一绝缘体的一侧或任一侧上形成第一籽晶层; 在其上形成有第一种子层的第一绝缘体的一侧或任一侧上形成第一电镀抗蚀剂; 对应于电路图案和通孔进行电镀; 去除第一电镀抗蚀剂; 以及通过闪光蚀刻去除所述第一籽晶层的一部分。 这种方法可以提高绝缘体和电路图案之间的粘附性，以允许细线电路图案。

公开(公告)号：US20070141310A1

公开(公告)日：2007-06-21

申请号：US11585276

申请日：2006-10-24

申请人： Jong Seok Song ,  Taehoon Kim

发明人： Jong Seok Song ,  Taehoon Kim

IPC分类号： B05D5/12 ,  B32B3/00

CPC分类号： H05K1/036 ,  B32B3/266 ,  B32B27/08 ,  B32B27/16 ,  B32B27/28 ,  B32B27/281 ,  B32B27/304 ,  B32B27/322 ,  B32B27/38 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2307/728 ,  B32B2457/08 ,  C08J7/045 ,  H05K1/034 ,  H05K3/108 ,  H05K3/381 ,  H05K3/426 ,  H05K2201/015 ,  H05K2203/092 ,  Y10T428/24917

摘要： Disclosed are a printed circuit board and a method of manufacturing the same, in which a fluorine resin coating layer is formed on a resin substrate, and then a copper layer is formed using a dry process including ion beam surface treatment and vacuum deposition instead of a conventional wet process including surface roughening and electroless copper plating. According to this invention, the interfacial adhesion of the substrate material may be increased without changing the surface roughness thereof, thus realizing a highly reliable fine circuit. As well, a low dielectric constant and a low loss coefficient may be obtained thanks to the formation of the fluorine resin layer. Further, a wet process is replaced with a dry process, whereby the copper plating layer may be formed in an environmentally friendly manner.

摘要翻译： 公开了一种印刷电路板及其制造方法，其中在树脂基板上形成氟树脂涂层，然后使用包括离子束表面处理和真空沉积的干法形成铜层，而不是形成铜层 常规湿法包括表面粗糙化和无电镀铜。 根据本发明，可以在不改变其表面粗糙度的情况下增加基板材料的界面粘合性，从而实现高可靠性的精细电路。 同样，由于氟树脂层的形成，可以获得低介电常数和低损耗系数。 此外，用干法代替湿法，由此可以以环境友好的方式形成铜镀层。

公开(公告)号：US20110099807A1

公开(公告)日：2011-05-05

申请号：US12805293

申请日：2010-07-22

申请人： Dong Sun Kim ,  Taehoon Kim ,  Jong Seok Song ,  Sam Jin Her ,  Jun Heyoung Park

发明人： Dong Sun Kim ,  Taehoon Kim ,  Jong Seok Song ,  Sam Jin Her ,  Jun Heyoung Park

IPC分类号： H05K3/10 ,  H05K3/42

CPC分类号： H05K3/381 ,  H05K1/0346 ,  H05K3/108 ,  H05K3/146 ,  H05K3/426 ,  H05K3/4644 ,  H05K2201/0154 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/092 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/24917

摘要： A fabrication method which can improve electrical properties, shorten processing time, and reduce the thickness of a chip package by achieving an ultra-thin fine circuit pattern. The method for fabricating a printed circuit board includes: providing an insulating material; forming in the insulating material at least one via-hole for interlayer electrical connection; ion beam treating the surface of the insulating material having the via-hole formed therein; forming a copper seed layer on the surface-treated insulating material using a vacuum deposition process; and plating a copper pattern on the copper seed layer to form a circuit pattern.

摘要翻译： 通过实现超薄精细电路图案，能够提高电性能，缩短加工时间，减小芯片封装的厚度的制造方法。 制造印刷电路板的方法包括：提供绝缘材料; 在所述绝缘材料中形成至少一个用于层间电连接的通孔; 离子束处理其中形成有通孔的绝缘材料的表面; 使用真空沉积工艺在表面处理的绝缘材料上形成铜种子层; 并在铜籽晶层上镀铜图案以形成电路图案。

公开(公告)号：US20100021649A1

公开(公告)日：2010-01-28

申请号：US12461960

申请日：2009-08-28

申请人： Jong Seok Song ,  Taehoon Kim

发明人： Jong Seok Song ,  Taehoon Kim

IPC分类号： B05D3/06 ,  C23C14/34

CPC分类号： H05K1/036 ,  B32B3/266 ,  B32B27/08 ,  B32B27/16 ,  B32B27/28 ,  B32B27/281 ,  B32B27/304 ,  B32B27/322 ,  B32B27/38 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2307/728 ,  B32B2457/08 ,  C08J7/045 ,  H05K1/034 ,  H05K3/108 ,  H05K3/381 ,  H05K3/426 ,  H05K2201/015 ,  H05K2203/092 ,  Y10T428/24917

摘要： A method of manufacturing the same, in which a fluorine resin coating layer is formed on a resin substrate, and then a copper layer is formed using a dry process including ion beam surface treatment and vacuum deposition instead of a conventional wet process including surface roughening and electroless copper plating. The interfacial adhesion of the substrate material may be increased without changing the surface roughness thereof, thus realizing a highly reliable fine circuit. As well, a low dielectric constant and a low loss coefficient may be obtained thanks to the formation of the fluorine resin layer. Further, a wet process is replaced with a dry process, whereby the copper plating layer may be formed in an environmentally friendly manner.

摘要翻译： 其制造方法是在树脂基板上形成氟树脂涂层，然后使用包括离子束表面处理和真空沉积的干法形成铜层，而不是常规的包括表面粗糙化的湿法， 化学镀铜。 可以增加基板材料的界面粘附性而不改变其表面粗糙度，从而实现高可靠性的精细电路。 同样，由于氟树脂层的形成，可以获得低介电常数和低损耗系数。 此外，用干法代替湿法，由此可以以环境友好的方式形成铜镀层。

公开(公告)号：US07601419B2

公开(公告)日：2009-10-13

申请号：US11585276

申请日：2006-10-24

申请人： Jong Seok Song ,  Taehoon Kim

发明人： Jong Seok Song ,  Taehoon Kim

IPC分类号： B32B15/00

CPC分类号： H05K1/036 ,  B32B3/266 ,  B32B27/08 ,  B32B27/16 ,  B32B27/28 ,  B32B27/281 ,  B32B27/304 ,  B32B27/322 ,  B32B27/38 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2307/728 ,  B32B2457/08 ,  C08J7/045 ,  H05K1/034 ,  H05K3/108 ,  H05K3/381 ,  H05K3/426 ,  H05K2201/015 ,  H05K2203/092 ,  Y10T428/24917

摘要： Disclosed are a printed circuit board and a method of manufacturing the same, in which a fluorine resin coating layer is formed on a resin substrate, and then a copper layer is formed using a dry process including ion beam surface treatment and vacuum deposition instead of a conventional wet process including surface roughening and electroless copper plating. According to this invention, the interfacial adhesion of the substrate material may be increased without changing the surface roughness thereof, thus realizing a highly reliable fine circuit. As well, a low dielectric constant and a low loss coefficient may be obtained thanks to the formation of the fluorine resin layer. Further, a wet process is replaced with a dry process, whereby the copper plating layer may be formed in an environmentally friendly manner.

摘要翻译： 公开了一种印刷电路板及其制造方法，其中在树脂基板上形成氟树脂涂层，然后使用包括离子束表面处理和真空沉积的干法形成铜层，而不是形成铜层 常规湿法包括表面粗糙化和无电镀铜。 根据本发明，可以在不改变其表面粗糙度的情况下增加基板材料的界面粘合性，从而实现高可靠性的精细电路。 同样，由于形成氟树脂层，可以获得低介电常数和低损耗系数。 此外，用干法代替湿法，由此可以以环境友好的方式形成铜镀层。

公开(公告)号：US07987659B2

公开(公告)日：2011-08-02

申请号：US12092546

申请日：2006-11-13

申请人： Jong Seok Song

发明人： Jong Seok Song

IPC分类号： D02G3/02

CPC分类号： H05B3/56 ,  Y10T29/49083

摘要： Disclosed herein is an electric heating cable which is used in an electric heating apparatus and minimizes an electromagnetic field effect. The electric heating cable is manufactured by twisting first and second electric heating strands in three axial directions. Each electric heating strand includes a core wire comprising a stranded wire of a resistor, and an insulating sheath made of fluorine resin. According to the invention, the electric heating cable is resistive to untwisting in a free state even if no adhering means is used, and is compactly twisted, so that the electric heating cable maintains a secured state and has superior flexibility, while reducing leakage flux, and the electric heating cable has a reduced outer diameter and is light, so that it is useful for a thin electric heating apparatus, and incurs a low manufacturing cost.

摘要翻译： 这里公开了一种电加热电缆，其用于电加热装置中并使电磁场效应最小化。 电加热电缆是通过在第一和第二电加热线在三个轴向上扭转制造的。 每个电加热线包括包括电阻器的绞线的芯线和由氟树脂制成的绝缘护套。 根据本发明，即使没有使用粘合手段，电加热电缆在自由状态下具有解捻性，并且紧凑扭曲，使得电加热电缆保持固定状态并具有优异的柔性，同时减少漏磁通， 并且电加热电缆具有减小的外径并且较轻，使得其对于薄的电加热装置是有用的，并且导致低的制造成本。