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公开(公告)号：US06999494B2
公开(公告)日：2006-02-14
申请号：US10464121
申请日：2003-06-18
CPC分类号： G02B6/4221 , G02B6/4204 , G02B6/423
摘要： A planar wafer-level packaging method is provided for a laser and a microlens. Light from the laser is directed and shaped by the microlens to couple into an external light guide. A plurality of such assemblies, each comprising a laser and a microlens may be assembled on a single planar substrate. A tapered surface is formed on the microlens. The microlens may be formed from a silicon substrate. The angle of the tapered surface causes an accurate cone or pyramid shape. The tapered surface is formed such that the axis of the cone or pyramid is aligned with the optical axis of the lens. The lens may then be aligned with the optical axis of the laser. A light guide receptacle is formed with a tapered surface that matches the tapered surface of the microlens. The tapered surface of the receptacle is formed such that the axis of the cone or pyramid is aligned with the optical axis of the receptacle. The receptacle may then be passively aligned with the microlens by mating the tapered surfaces.
摘要翻译： 提供了一种用于激光和微透镜的平面晶片级封装方法。 来自激光器的光由微透镜引导和成形，以耦合到外部光导中。 每个包括激光器和微透镜的多个这样的组件可以组装在单个平面衬底上。 在微透镜上形成锥形表面。 微透镜可以由硅衬底形成。 锥形表面的角度产生精确的锥形或金字塔形状。 锥形表面形成为使得锥体或金字塔的轴线与透镜的光轴对准。 然后可以将透镜与激光的光轴对准。 导光容器形成有与微透镜的锥形表面相匹配的锥形表面。 容器的锥形表面形成为使得锥体或金字塔的轴线与容器的光轴对准。 然后可以通过配合锥形表面将容器与微透镜无源对准。
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2.发明授权Method and structure for heatspreader attachment in high thermal performance IC packages 有权散热器附件在高热性能IC封装中的方法和结构公开(公告)号：US06351032B1
公开(公告)日：2002-02-26
申请号：US09488153
申请日：2000-01-20
申请人： Bernard K H Lee , Ben T C Tan , Emillo F. Mallare, Jr. , Sarvotham M. Bhandarkar , Subodh Mhaisalkar , Ai Min Tan
发明人： Bernard K H Lee , Ben T C Tan , Emillo F. Mallare, Jr. , Sarvotham M. Bhandarkar , Subodh Mhaisalkar , Ai Min Tan
IPC分类号： H01L2348
CPC分类号： H01L21/563 , H01L23/36 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/01019 , H01L2924/10253 , H01L2924/00 , H01L2224/0401
摘要： Improved structures for and methods for assembling heatspreader attachments in integrated circuit packages permit attachment of a relatively low cost heatspreader having a high coefficient of thermal expansion directly to the back of a die while maximizing thermal performance, mechanical integrity and reliability of the assembly. The improvements are realized through the use of specific adhesive materials to attach the heatspreader to the die, heatspreader geometries, adhesive geometries, assembly techniques and underfill geometries.
摘要翻译： 在集成电路封装中组装散热器附件的改进的结构和方法允许将具有高热膨胀系数的相对低成本的散热器直接附接到模具的背面，同时最大化组件的热性能，机械完整性和可靠性。 通过使用特定的粘合剂材料将散热器附接到模具，散热器几何形状，粘合剂几何形状，组装技术和底部填充几何来实现改进。
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公开(公告)号：US5773878A
公开(公告)日：1998-06-30
申请号：US582643
申请日：1996-01-04
IPC分类号： H01L21/56 , H01L23/31 , H01L23/495
CPC分类号： H01L23/3121 , H01L21/56 , H01L23/49503 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01039 , H01L2924/01079 , H01L2924/01087 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/1815 , H01L2924/3511
摘要： The present invention relates to a lead frame design for IC packaging to reduce chip stress and deformation and to improve mold filling. The die-pad is split into several sections which are jointed together by flexible expansion joints. The split die-pad allows relative motion between the pad and the chip during die attach cure. It also breaks down the total die pad area (and length) that is rigidly attached to the chip into smaller sections. These two factors reduce the magnitude of coefficient-of-thermal expansion (CTE) mismatch and out of plane deformation of the assembly, resulting in lower chip stress and deformation and improved package moldability.
摘要翻译： 本发明涉及一种用于IC封装的引线框架设计，以减少芯片的应力和变形并改善模具填充。 模片分为几段，通过柔性膨胀节接合在一起。 分开的模片垫允许在芯片附着固化期间焊盘和芯片之间的相对运动。 它还将刚性连接到芯片的总芯片焊盘面积（和长度）分解成更小的部分。 这两个因素降低了组件的热膨胀系数（CTE）失配和平面外变形的大小，从而降低了芯片的应力和变形，提高了封装成型性。
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4.发明授权Planar and wafer level packaging of semiconductor lasers and photo detectors for transmitter optical sub-assemblies 失效用于发射机光学子组件的半导体激光器和光电检测器的平面和晶片级封装公开(公告)号：US06970491B2
公开(公告)日：2005-11-29
申请号：US10283730
申请日：2002-10-30
IPC分类号： G01B11/00 , G01R31/26 , G02B6/42 , H01L21/66 , H01L29/22 , H01S3/08 , H01S5/00 , H01S5/02 , H01S5/022 , H01S5/0683 , H01S5/187 , H01S5/42
CPC分类号： G02B6/4214 , G02B6/4206 , G02B6/421 , H01L2224/16225 , H01L2224/48091 , H01L2224/48247 , H01L2224/73253 , H01L2224/73265 , H01L2924/15192 , H01L2924/16152 , H01L2924/1815 , H01S5/02252 , H01S5/02272 , H01S5/02284 , H01S5/02288 , H01S5/02296 , H01S5/0683 , H01S5/187 , H01S5/42 , H01L2924/00014
摘要： A planar wafer-level packaging method is provided for a laser and a monitor photo detector. The laser and photo detector are affixed to a planar substrate. The planar substrate provides electrical connections to the components. A lens cap with a microlens is formed and affixed to the substrate with a seal. The lens cap forms a hermetically sealed cavity enclosing the laser and photo detector. The inside surface of the lens cap has a reflective coating with a central opening over the emitting aperture of the laser. The central opening has an anti-reflective coating. Light from the laser is directed and shaped by the lens cap to couple into an external light guide. Residual light from the edge of the laser reflects off the inside surface of the lens cap and is incident upon the photo detector. In an alternate method, the laser may be packaged using flip-chip assembly.
摘要翻译： 提供了一种用于激光和监视器光电检测器的平面晶片级封装方法。 激光和光电检测器固定在平面基板上。 平面衬底提供与组件的电连接。 形成具有微透镜的透镜盖并用密封件固定到基板上。 透镜盖形成包围激光和光电检测器的气密密封腔。 透镜盖的内表面具有在激光器的发射孔上方具有中心开口的反射涂层。 中心开口具有防反射涂层。 来自激光的光由透镜盖引导和成形，以耦合到外部光导中。 来自激光边缘的剩余光从透镜盖的内表面反射并入射到光检测器上。 在另一种方法中，可以使用倒装芯片组装来封装激光器。
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公开(公告)号：US5967577A
公开(公告)日：1999-10-19
申请号：US146465
申请日：1998-09-03
CPC分类号： H05K3/1233 , H01L21/4853 , H05K2203/0134 , H05K3/3478
摘要： A dispenser contains a chamber enclosed by an upper wall and a lower wall, both walls are oriented parallel to each other. The upper wall has a vertically bored inlet port and the lower wall has a plurality of vertically bored outlet ports for providing access to the chamber. The outlet ports are geometrically arranged in an array pattern characterized by equidistantly spaced rows and columns of bores. There is a plurality of baffle plates interposed between the upper wall and the lower wall. The baffle plates, which are spatially separated from each other, are oriented parallel to and spatially separated from the upper and lower walls. The baffle plates have a plurality of vertically bored holes for providing access between the inlet port and the outlet ports, whereby the dispenser is effective in providing homogeneous flow of fluid through the outlet ports.
摘要翻译： 分配器包含由上壁和下壁包围的室，两个壁彼此平行取向。 上壁具有垂直钻孔的入口，并且下壁具有多个用于提供通向腔室的垂直孔的出口。 出口端口几何地布置成阵列图案，其特征在于具有等间隔的行和列的孔。 插入在上壁和下壁之间的多个挡板。 在空间上彼此分离的挡板平行于空间上与上壁和下壁分离。 挡板具有多个垂直钻孔，用于在入口和出口之间提供通路，由此分配器有效地提供通过出口的均匀流体流动。
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公开(公告)号：US5836520A
公开(公告)日：1998-11-17
申请号：US582746
申请日：1996-01-04
CPC分类号： H05K3/1233 , H01L21/4853 , H05K2203/0134 , H05K3/3478
摘要： A dispenser contains a chamber enclosed by an upper wall and a lower wall, both walls are oriented parallel to each other. The upper wall has a vertically bored inlet port and the lower wall has a plurality of vertically bored outlet ports for providing access to the chamber. The outlet ports are geometrically arranged in an array pattern characterized by equidistantly spaced rows and columns of bores. There is a plurality of baffle plates interposed between the upper wall and the lower wall. The baffle plates, which are spatially separated from each other, are oriented parallel to and spatially separated from the upper and lower walls. The baffle plates have a plurality of vertically bored holes for providing access between the inlet port and the outlet ports, whereby the dispenser is effective in providing homogeneous flow of fluid through the outlet ports.
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