公开(公告)号：US20120216167A1

公开(公告)日：2012-08-23

申请号：US13504374

申请日：2010-10-27

申请人： Chen-Feng Chang ,  Chin-Fang Shen ,  Hsien-Shih Chiu ,  I-Jye Lin ,  Tien-Chang Hsu ,  Yao-Wen Chang ,  Chun-Wei Lin ,  Po-Wei Lee

发明人： Chen-Feng Chang ,  Chin-Fang Shen ,  Hsien-Shih Chiu ,  I-Jye Lin ,  Tien-Chang Hsu ,  Yao-Wen Chang ,  Chun-Wei Lin ,  Po-Wei Lee

IPC分类号： G06F17/50

CPC分类号： G06F17/5077 ,  H01L23/525 ,  H01L24/02 ,  H01L24/14 ,  H01L2224/02377 ,  H01L2224/0401 ,  H01L2224/14131 ,  H01L2224/14136 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311

摘要： Disclosed herein are rouging methods and devices for a flip-chip package. The flip chip includes several outer pads and several inner pads. The routing method includes: setting an outer sequence based on the arrangement order of the outer pads; setting several inner sequences based on the connection relationships between inner pads and the outer pads; calculating the longest common subsequence of each inner sequence and the outer sequence, defining the connection relationships between the inner pads and the outer pads corresponding to the longest common subsequence as direct connections, and defining the connection relationships between the inner pads and the outer pads that do not correspond to the longest common subsequence as detour connections; establishing the routing scheme of the flip chip based on the connection relationships between the inner pads and the outer pads.

摘要翻译： 这里公开了用于倒装芯片封装的粗化方法和装置。 倒装芯片包括几个外部焊盘和几个内部焊盘。 路由方法包括：基于外部焊盘的布置顺序设置外部序列; 基于内垫和外垫之间的连接关系设置几个内序列; 计算每个内部序列和外部序列的最长公共子序列，将内部焊盘和对应于最长公共子序列的外部焊盘之间的连接关系定义为直接连接，并且限定内部焊盘和外部焊盘之间的连接关系， 不符合迂回连线最长的共同后果; 基于内部焊盘和外部焊盘之间的连接关系建立倒装芯片的布线方案。

公开(公告)号：US20050133165A1

公开(公告)日：2005-06-23

申请号：US10744715

申请日：2003-12-23

申请人： Kuang-Hsing Liu ,  Peter Chi ,  Yo-Cheng Hsueh ,  Jason Wu ,  Jiang-He Xie ,  Jake Chang ,  Wen-Hsing Liang ,  Hung-Cheng Chen ,  Kuo-Wen Chen ,  Feng-Shih Chiu

发明人： Kuang-Hsing Liu ,  Peter Chi ,  Yo-Cheng Hsueh ,  Jason Wu ,  Jiang-He Xie ,  Jake Chang ,  Wen-Hsing Liang ,  Hung-Cheng Chen ,  Kuo-Wen Chen ,  Feng-Shih Chiu

IPC分类号： C23C16/44 ,  C23C16/458 ,  C23F1/00 ,  H01J37/32

CPC分类号： C23C16/4585 ,  C23C16/4401 ,  H01J37/32522 ,  H01J2237/0206 ,  H01J2237/3321

摘要： A chemical vapor deposition apparatus for titanium-nitride application that is useful for preventing contaminants caused by arching between a substantially planar substrate and a substrate supporting apparatus during the deposition cycle. The apparatus includes a chemical vapor deposition chamber having a substrate-supporting heater. An annular housing supported by the heater, and a conductive strap that connectively secures the substrate-supporting heater to the annular housing by using holes instead of conventional slots. The conductive strap is designed as a flexure to flex with process temperature changes to improve electrical connectivity at its terminal connection and to prevent degradation. The annular housing has a top and a bottom surface and a cylindrical wall extending peripherally below the surfaces. The cylindrical wall encircles an isolator ring. The isolator ring is in contact with the bottom surface of the annular housing, and is placed and supported by at least three lift screws extending above the heater surface.

摘要翻译： 一种用于氮化钛应用的化学气相沉积装置，其可用于在沉积循环期间用于防止在基本上平坦的基板和基板支撑装置之间的拱起引起的污染物。 该装置包括具有基板支撑加热器的化学气相沉积室。 由加热器支撑的环形壳体，以及通过使用孔代替常规槽将基板支撑加热器连接地固定到环形壳体的导电带。 导电带被设计为弯曲以随着过程温度变化而弯曲，以改善其端子连接处的电连接并防止退化。 环形壳体具有顶表面和底表面以及在表面下方周向延伸的圆柱形壁。 圆柱形壁环绕隔离环。 隔离环与环形壳体的底表面接触，并且由至少三个在加热器表面上方延伸的提升螺杆放置和支撑。

公开(公告)号：US08578317B2

公开(公告)日：2013-11-05

申请号：US13504374

申请日：2010-10-27

申请人： Chen-Feng Chang ,  Chin-Fang Shen ,  Hsien-Shih Chiu ,  I-Jye Lin ,  Tien-Chang Hsu ,  Yao-Wen Chang ,  Chun-Wei Lin ,  Po-Wei Lee

发明人： Chen-Feng Chang ,  Chin-Fang Shen ,  Hsien-Shih Chiu ,  I-Jye Lin ,  Tien-Chang Hsu ,  Yao-Wen Chang ,  Chun-Wei Lin ,  Po-Wei Lee

IPC分类号： G06F17/50

CPC分类号： G06F17/5077 ,  H01L23/525 ,  H01L24/02 ,  H01L24/14 ,  H01L2224/02377 ,  H01L2224/0401 ,  H01L2224/14131 ,  H01L2224/14136 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311

摘要： Disclosed herein are rouging methods and devices for a flip-chip package. The flip chip includes several outer pads and several inner pads. The routing method includes: setting an outer sequence based on the arrangement order of the outer pads; setting several inner sequences based on the connection relationships between inner pads and the outer pads; calculating the longest common subsequence of each inner sequence and the outer sequence, defining the connection relationships between the inner pads and the outer pads corresponding to the longest common subsequence as direct connections, and defining the connection relationships between the inner pads and the outer pads that do not correspond to the longest common subsequence as detour connections; establishing the routing scheme of the flip chip based on the connection relationships between the inner pads and the outer pads.

摘要翻译： 这里公开了用于倒装芯片封装的粗化方法和装置。 倒装芯片包括几个外部焊盘和几个内部焊盘。 路由方法包括：基于外部焊盘的布置顺序设置外部序列; 基于内垫和外垫之间的连接关系设置几个内序列; 计算每个内部序列和外部序列的最长公共子序列，将内部焊盘和对应于最长公共子序列的外部焊盘之间的连接关系定义为直接连接，并且限定内部焊盘和外部焊盘之间的连接关系， 不符合迂回连线最长的共同后果; 基于内部焊盘和外部焊盘之间的连接关系建立倒装芯片的布线方案。

公开(公告)号：US5408854A

公开(公告)日：1995-04-25

申请号：US931149

申请日：1992-08-18

申请人： Te-Shih Chiu

发明人： Te-Shih Chiu

IPC分类号： B60B27/06

CPC分类号： B60B37/04 ,  Y10T70/5836 ,  Y10T70/5872 ,  Y10T70/5889

摘要： A lockable wheel coupling comprises an axle plate having a splined shaft with a central bore, a wheel having a fluted axial bore, and a generally cylindrical locking member. The wheel can be mounted on the axle plate by engaging the shaft thereon with the axial bore of the wheel. Spring biased and radially displaceable retaining lugs within the central bore are engaged with retaining recesses on the inner periphery of the axial bore via aligned apertures in the shaft upon insertion of the locking member into the central bore, to releasably secure the wheel to the axle plate. The locking member carries a cam surface for displacing the retaining lugs outwards into corresponding retaining recesses and a set of locking bolts that snap engage into an annular locking recess in the inner periphery of the central bore to retain the locking member therein. A key operated lock cylinder within the locking member retracts the bolts when rotated so that the member can be removed from the central bore. Afterwhich, the retaining lugs retract inwardly under the action of the springs and allow the removal of the wheel from the axle plate.

摘要翻译： 可锁定的车轮联接器包括具有带有中心孔的花键轴的车轴板，具有槽形轴向孔的车轮和大致圆柱形的锁定构件。 轮可以通过将轴与轴的轴孔接合而将轮安装在轴板上。 中心孔内的弹簧偏置和径向移动的保持凸耳通过将锁定构件插入中心孔中的轴中的对准的孔与轴向孔的内周上的保持凹部接合，以将轮可释放地固定到轴板 。 锁定构件承载用于将保持凸耳向外移位到相应的保持凹部中的凸轮表面和一组锁定螺栓，其卡扣接合到中心孔的内周边中的环形锁定凹部中，以将锁定构件保持在其中。 锁定构件内的钥匙操作的锁芯在旋转时使螺栓缩回，使得构件能够从中心孔移除。 之后，保持突耳在弹簧的作用下向内缩回，并允许从轴板上拆下车轮。

公开(公告)号：US20070235871A1

公开(公告)日：2007-10-11

申请号：US11400182

申请日：2006-04-10

申请人： Hsiang-Ming Huang ,  An-Hong Liu ,  Yeong-Jyh Lin ,  Yi-Chang Lee ,  Wu-Chang Tu ,  Chun-Hung Lin ,  Shih Chiu

发明人： Hsiang-Ming Huang ,  An-Hong Liu ,  Yeong-Jyh Lin ,  Yi-Chang Lee ,  Wu-Chang Tu ,  Chun-Hung Lin ,  Shih Chiu

IPC分类号： H01L23/48

CPC分类号： H01L24/10 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/13 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2224/9202 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A high frequency IC package mainly includes a substrate, a bumped chip, and a plurality of conductive fillers where the substrate has a plurality of bump holes penetrating from the top surface to the bottom surface. The active surface of the chip is attached to the top surface of the substrate in a manner that the bumps are inserted into the bump holes respectively. The conductive fillers are formed in the bump holes to electrically connect the bumps to the circuit layer of the substrate. The high frequency IC package has a shorter electrical path and a thinner package thickness.

摘要翻译： 高频IC封装主要包括衬底，凸起芯片和多个导电填料，其中衬底具有从顶表面到底表面穿透的多个凸起孔。 芯片的有源表面以分别插入到凸块孔中的方式附接到基板的顶表面。 导电填料形成在凸起孔中，以将凸块电连接到基板的电路层。 高频IC封装具有更短的电路径和更薄的封装厚度。