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1.发明申请公开(公告)号：US20100213642A1
公开(公告)日：2010-08-26
申请号：US12709331
申请日：2010-02-19
CPC分类号： G11B5/855 , B29C33/3857 , B29C45/2632 , B29C45/37 , B29K2705/00 , B29K2907/04
摘要： According to one embodiment, the present invention provides a resin stamper injection molding die including a fixed side template having a metal stamper mounting surface mirror-ground in a random direction, a metal stamper having a front surface with recesses and protrusions and a back surface mirror-ground in a random direction, and a moving side template. The metal stamper has a surface roughness of 0 to 50 nm. The metal stamper mounting surface has a surface roughness of 0 to 1.0 nm, and has a coefficient of static friction of at most 0.20 with respect to the second main surface of the metal stamper.
摘要翻译： 根据一个实施例，本发明提供了一种树脂压模注塑成型模具，其包括具有随机方向镜面研磨的金属压模安装面的固定侧模板，具有凹部和突起的前表面的金属压模和背面反射镜 随机方向上的移动侧模板。 金属压模的表面粗糙度为0〜50nm。 金属压模安装表面具有0至1.0nm的表面粗糙度，并且相对于金属压模的第二主表面具有至多0.20的静摩擦系数。
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公开(公告)号：US20100186877A1
公开(公告)日：2010-07-29
申请号：US12691491
申请日：2010-01-21
IPC分类号： B32B37/02
CPC分类号： G11B5/855
摘要： According to one embodiment, a method of manufacturing a stamper includes forming a first stamper from a master plate having lands and grooves through electroforming, forming a second stamper, a width of which is GW, from the first stamper through electroforming, forming a lamination film with a thickness of LLT on the second stamper, forming, on the lamination film, a second releasing layer, a transfer layer with a thickness of TLT and a third electroforming layer with a thickness of ELT, peeling off the transfer layer and the third electroforming layer from the second stamper to form a third stamper, and isotropically etching the transfer layer on the third stamper in an etching thickness of ET to reduce a width of lands of the third stamper, in which the following relations are satisfied: 10 nm≦ELT and ET≦TLT.
摘要翻译： 根据一个实施例，制造压模的方法包括通过电铸从具有焊盘和槽的母板形成第一压模，通过电铸从第一压模形成其宽度为GW的第二压模，形成层压膜 在第二压模上具有LLT的厚度，在层压膜上形成第二释放层，厚度为TLT的转印层和具有ELT厚度的第三电铸层，剥离转印层和第三电铸 从而形成第三压模，并且以蚀刻厚度的ET对第三压模上的转印层进行各向同性蚀刻，以减小第三压模的焊盘的宽度，其中满足以下关系：10nm＆nlE; ELT 和ET＆nlE; TLT。
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公开(公告)号：US20100159281A1
公开(公告)日：2010-06-24
申请号：US12643811
申请日：2009-12-21
CPC分类号： G11B5/855 , C08F290/067 , C08G18/672 , C08G18/73 , C08G18/753 , C09D175/04 , C08F220/68 , C08G18/42 , C08G18/6674
摘要： According to one embodiment, an ultraviolet-curable resin material to be used contains a monomer represented by formula (1) presented earlier, a resin stamper is used as a stamper, and the surface of a magnetic recording layer and the three-dimensional pattern surface of the resin stamper are contacted in a vacuum.
摘要翻译： 根据一个实施方式，使用的紫外线固化型树脂材料含有上述式（1）表示的单体，树脂压模用作压模，磁记录层的表面和三维图案表面 的树脂压模在真空中接触。
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4.发明申请公开(公告)号：US20090280285A1
公开(公告)日：2009-11-12
申请号：US12463270
申请日：2009-05-08
IPC分类号： G11B3/70
摘要： According to one embodiment, there is provided a stamper holder which holds a disk-shape metal stamper for molding having a center hole with an inner diameter of 17.5 mm or less and formed with patterns of protrusions and recesses for a recording medium on a surface in a state that the stamper holder is fixed to a first die having a center hole, in which the stamper holder has an approximately cylindrical shape so as to be inserted into the center hole of the first die and comprises a flange provided at one end configured to hold an inner peripheral portion of the stamper surface near the center hole, and an outer diameter of the flange is 17.6 mm or less.
摘要翻译： 根据一个实施例，提供了一种压模保持器，其保持具有内径为17.5mm或更小的中心孔的用于模制的盘形金属压模，并且在其表面上形成用于记录介质的突起和凹槽的图案 将压模保持器固定到具有中心孔的第一模具的状态，其中压模保持器具有大致圆筒形状以便插入到第一模具的中心孔中，并且包括设置在一端的凸缘， 在中心孔附近保持压模表面的内周部分，凸缘的外径为17.6mm以下。
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公开(公告)号：US20090232928A1
公开(公告)日：2009-09-17
申请号：US12473071
申请日：2009-05-27
CPC分类号： G11B7/261 , B29C33/424 , B29C2033/426 , B82Y10/00 , B82Y40/00 , C25D1/10 , G03F7/0002 , G11B7/263 , H01F41/34
摘要： According to one embodiment, a method of manufacturing a stamper includes forming a conductive layer on a surface of a master having patterns of protrusions and recesses, forming an electroforming layer on the conductive layer, separating the electroforming layer and the conductive layer from the master to form a stamper to which the patterns of protrusions and recesses of the master are transferred, removing a resist left on the surface of the stamper, and etching the surface of the stamper with an acidic solution having a pH value of less than 3.
摘要翻译： 根据一个实施例，制造压模的方法包括在具有突起和凹槽图案的母版表面上形成导电层，在导电层上形成电铸层，将电铸层和导电层与母模分离成 形成压模，母模的突起和凹部的图案被转印到其上，去除压模表面上的抗蚀剂，并用pH值小于3的酸性溶液蚀刻压模的表面。
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公开(公告)号：US08840258B2
公开(公告)日：2014-09-23
申请号：US13723374
申请日：2012-12-21
CPC分类号： G02B1/118 , B81C1/0046 , C03C15/00 , C03C17/007 , C03C17/28 , C03C2217/42 , C03C2217/77 , C03C2218/34 , C03C2218/355 , Y10T428/24421
摘要： The present invention provides such a formation method that an antireflection structure having excellent antireflection functions can be formed in a large area and at small cost. Further, the present invention also provides an antireflection structure formed by that method. In the formation method, a base layer and particles placed thereon are subjected to an etching process. The particles on the base layer serve as an etching mask in the process, and hence they are more durable against etching than the base layer. The etching rate ratio of the base layer to the particles is more than 1 but not more than 5. The etching process is stopped before the particles disappear. It is also possible to produce an antireflection structure by nanoimprinting method employing a stamper. The stamper is formed by use of a master plate produced according to the above formation method.
摘要翻译： 本发明提供这样一种形成方法，即可以大面积且成本低的方式形成具有优异的抗反射功能的抗反射结构。 此外，本发明还提供了通过该方法形成的抗反射结构。 在形成方法中，对基底层和放置在其上的颗粒进行蚀刻处理。 基层上的颗粒在该过程中用作蚀刻掩模，因此它们比基层更耐腐蚀。 基层与颗粒的蚀刻速率比大于1但不大于5.蚀刻过程在颗粒消失之前停止。 也可以通过使用压模的纳米压印方法制造抗反射结构。 通过使用根据上述形成方法制造的母版形成压模。
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公开(公告)号：US08778162B2
公开(公告)日：2014-07-15
申请号：US13077537
申请日：2011-03-31
摘要： According to one embodiment, a stamper manufacturing method comprises electroless plating by using a master includes a substrate, a conductive underlayer formed on the substrate and having catalytic activity, projecting patterns having no catalytic activity and partially formed on a surface of the conductive underlayer having catalytic activity, and regions in which the conductive underlayer having catalytic activity is exposed between the projecting patterns to deposit selectively an amorphous conductive layer between the projecting patterns and in the regions in which the conductive underlayer is exposed, and forming stamper projections, electroplating on the stamper projections includes the projecting patterns and the amorphous conductive layer by using the amorphous conductive layer and the conductive underlayer as electrodes to form a stamper main body made of a crystalline metal, and releasing a stamper includes the stamper projections and the stamper main body from the master.
摘要翻译： 根据一个实施例，压模制造方法包括使用主体的无电镀，其包括基板，形成在基板上的具有催化活性的导电底层，具有催化活性的突出图案，并部分地形成在具有催化作用的导电底层的表面上 活性以及其中具有催化活性的导电底层在突出图案之间暴露的区域，以选择性地沉积在突出图案之间的非晶导体层和导电底层暴露的区域中，并且形成压模突起，在压模上电镀 突起包括通过使用非晶导体层和导电底层作为电极形成由结晶金属制成的压模主体的突出图案和非晶导体层，并且释放压模包括压模主体和压模主体 。
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公开(公告)号：US08361339B2
公开(公告)日：2013-01-29
申请号：US12347187
申请日：2008-12-31
CPC分类号： G02B1/118 , B81C1/0046 , C03C15/00 , C03C17/007 , C03C17/28 , C03C2217/42 , C03C2217/77 , C03C2218/34 , C03C2218/355 , Y10T428/24421
摘要： The present invention provides such a formation method that an antireflection structure having excellent antireflection functions can be formed in a large area and at small cost. Further, the present invention also provides an antireflection structure formed by that method. In the formation method, a base layer and particles placed thereon are subjected to an etching process. The particles on the base layer serve as an etching mask in the process, and hence they are more durable against etching than the base layer. The etching rate ratio of the base layer to the particles is more than 1 but not more than 5. The etching process is stopped before the particles disappear. It is also possible to produce an antireflection structure by nanoimprinting method employing a stamper. The stamper is formed by use of a master plate produced according to the above formation method.
摘要翻译： 本发明提供这样一种形成方法，即可以大面积且成本低的方式形成具有优异的抗反射功能的抗反射结构。 此外，本发明还提供了通过该方法形成的抗反射结构。 在形成方法中，对基底层和放置在其上的颗粒进行蚀刻处理。 基层上的颗粒在该过程中用作蚀刻掩模，因此它们比基层更耐腐蚀。 基层与颗粒的蚀刻速率比大于1但不大于5.蚀刻过程在颗粒消失之前停止。 也可以通过使用压模的纳米压印方法制造抗反射结构。 通过使用根据上述形成方法制造的母版形成压模。
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公开(公告)号：US08173029B2
公开(公告)日：2012-05-08
申请号：US12725403
申请日：2010-03-16
IPC分类号： B44C1/22
CPC分类号： G11B5/855 , C08F220/18
摘要： According to one embodiment, a cured first ultraviolet-curing resin material layer having a first three-dimensional pattern is formed on a first principal surface of a magnetic recording medium having a central hole. A cured second ultraviolet-curing resin material layer having a second three-dimensional pattern is formed on a second principal surface opposite to the first principal surface of the magnetic recording.
摘要翻译： 根据一个实施方案，在具有中心孔的磁记录介质的第一主表面上形成具有第一三维图案的固化的第一紫外线固化树脂材料层。 在与磁记录的第一主表面相对的第二主表面上形成具有第二三维图案的固化的第二紫外线固化树脂材料层。
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公开(公告)号：US20110262580A1
公开(公告)日：2011-10-27
申请号：US13077537
申请日：2011-03-31
摘要： According to one embodiment, a stamper manufacturing method comprises electroless plating by using a master includes a substrate, a conductive underlayer formed on the substrate and having catalytic activity, projecting patterns having no catalytic activity and partially formed on a surface of the conductive underlayer having catalytic activity, and regions in which the conductive underlayer having catalytic activity is exposed between the projecting patterns to deposite selectively an amorphous conductive layer between the projecting patterns and in the regions in which the conductive underlayer is exposed, and forming stamper projections, electroplating on the stamper projections includes the projecting patterns and the amorphous conductive layer by using the amorphous conductive layer and the conductive underlayer as electrodes to form a stamper main body made of a crystalline metal, and releasing a stamper includes the stamper projections and the stamper main body from the master.
摘要翻译： 根据一个实施例，压模制造方法包括使用主体的无电镀，其包括基板，形成在基板上的具有催化活性的导电底层，具有催化活性的突出图案，并部分地形成在具有催化作用的导电底层的表面上 活性和其中具有催化活性的导电底层在突出图案之间暴露的区域，以选择性地沉积在突出图案之间的非晶导体层和导电底层暴露的区域中，并且形成压模突起，在压模上电镀 突起包括通过使用非晶导体层和导电底层作为电极形成由结晶金属制成的压模主体的突出图案和非晶导体层，并且释放压模包括压模主体和压模主体 。
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