中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

13 records (took 0.013 seconds)

    Packaging substrate and method of manufacturing the same
    3.
    发明申请
    Packaging substrate and method of manufacturing the same 审中-公开
    包装基材及其制造方法

    公开(公告)号：US20080044931A1

    公开(公告)日：2008-02-21

    申请号：US11646291

    申请日：2006-12-28

    Applicant: Ho-Ming Tong ,  Kao-Ming Su ,  Chao-Fu Weng ,  Che-Ya Chou ,  Shin-Hua Chao ,  Teck-Chong Lee ,  Song-Fu Yang ,  Chian-Chi Lin

    Inventor： Ho-Ming Tong ,  Kao-Ming Su ,  Chao-Fu Weng ,  Che-Ya Chou ,  Shin-Hua Chao ,  Teck-Chong Lee ,  Song-Fu Yang ,  Chian-Chi Lin

    IPC: H01L21/98

    CPC classification number: H05K3/0052 ,  H01L21/485 ,  H01L24/97 ,  H01L24/98 ,  H01L25/50 ,  H05K3/225 ,  H05K2201/10598

    Abstract: A packaging substrate and a method of manufacturing the same are provided. The method includes following steps. First, a first substrate including at least one defected packaging unit and several first packaging units is provided. The defected packaging unit and the first packaging units are arranged in an array on the first substrate. Next, the defected packaging unit is removed from the first substrate to correspondingly form at least one opening in the first substrate. Then, a second substrate including at least one second packaging unit is provided. Later, the second packaging unit is separated from the second substrate. The area of the second packaging unit is less than that of the opening. Subsequently, the second packaging unit is disposed in the opening. The edge of the second packaging unit is placed partially against an inner wall of the opening.

    Abstract translation: 提供了一种封装基板及其制造方法。 该方法包括以下步骤。 首先，提供包括至少一个缺陷包装单元和多个第一包装单元的第一基板。 缺陷包装单元和第一包装单元以阵列布置在第一基板上。 接下来，将缺陷的包装单元从第一基板移除，以相应地形成第一基板中的至少一个开口。 然后，提供包括至少一个第二包装单元的第二基板。 之后，第二包装单元与第二基板分离。 第二包装单元的面积小于开口面积。 随后，第二包装单元设置在开口中。 第二包装单元的边缘部分地放置在开口的内壁上。

    LPCVD furnace uniformity improvement by temperature ramp down deposition system
    4.
    发明授权
    LPCVD furnace uniformity improvement by temperature ramp down deposition system 有权
    LPCVD炉的均匀性由温度降低沉积系统提高

    公开(公告)号：US06461979B1

    公开(公告)日：2002-10-08

    申请号：US10075841

    申请日：2002-02-13

    Applicant: Chih-Hao Lin ,  Bu-Fang Chen ,  Xi-Sheng Zhuang ,  Song-Fu Chen

    Inventor： Chih-Hao Lin ,  Bu-Fang Chen ,  Xi-Sheng Zhuang ,  Song-Fu Chen

    IPC: H01L2131

    CPC classification number: C23C16/46 ,  H01L21/3185

    Abstract: A new method is provided for the application of Chemical Vapor Deposition (CVD) processes. Where conventional CVD processes are performed while maintaining one, constant temperature during the CVD process, from the start of the CVD process up to the point where the CVD process is completed, the invention provides for first raising the temperature to a processing temperature and then gradually reducing the applied temperature within the cycle time that is required for the completion of the CVD process.

    Abstract translation: 提供了一种应用化学气相沉积（CVD）工艺的新方法。 在CVD过程中保持一个恒定温度的同时，在CVD工艺开始直至CVD工艺完成之前，本发明提供了将温度升高至加工温度，然后逐渐升高 在完成CVD工艺所需的循环时间内降低施加的温度。

    Techniques for input of a multi-character compound consonant or vowel and transliteration to another language using a touch computing device
    5.
    发明授权
    Techniques for input of a multi-character compound consonant or vowel and transliteration to another language using a touch computing device 有权
    用于使用触摸计算设备输入多字符复合辅音或元音和音译到另一种语言的技术

    公开(公告)号：US08762129B2

    公开(公告)日：2014-06-24

    申请号：US13350901

    申请日：2012-01-16

    Applicant: Hao Huang ,  Song Fu ,  Wei Sun ,  Hanping Feng

    Inventor： Hao Huang ,  Song Fu ,  Wei Sun ,  Hanping Feng

    IPC: G06F17/20 ,  G06F3/02

    CPC classification number: G06F3/04886 ,  G06F3/018 ,  G06F3/0481 ,  G06F3/04883 ,  G06F17/2217

    Abstract: A technique is presented for fast input of multi-character compound consonants and vowels on a touch computing device. The technique provides for fast input of multi-character compound consonants and vowels by enabling a user to touch an initial character on a first layout of characters, then slide his/her finger in different directions and/or different distances according to a second layout of characters. The second layout of characters can be based on the first touched character and therefore can have a limited set of characters, e.g., fewer characters in comparison to the first layout of characters. A syllable formed after input of both a consonant and a vowel, represented as one character set, e.g., in the Roman alphabet, can then be transliterated into another language, e.g., Chinese.

    Abstract translation: 提出了一种用于在触摸计算设备上快速输入多字符复合辅音和元音的技术。 该技术通过使用户能够在第一个字符布局上触摸初始字符，提供多字符复合辅音和元音的快速输入，然后根据第二布局的不同方向和/或不同的距离滑动他/她的手指 人物。 字符的第二布局可以基于第一触摸字符，并且因此可以具有有限的一组字符，例如与字符的第一布局相比较少的字符。 在输入辅音和元音之后形成的音节（例如以罗马字母表示为一个字符集）可以被音译为另一种语言，例如中文。

    Wire-bonding method for wire-bonding apparatus
    6.
    发明授权
    Wire-bonding method for wire-bonding apparatus 有权
    引线接合装置的接线方法

    公开(公告)号：US07581666B2

    公开(公告)日：2009-09-01

    申请号：US11905868

    申请日：2007-10-05

    Applicant: Ho-Ming Tong ,  Teck-Chong Lee ,  Chao-Fu Weng ,  Chian-Chi Lin ,  Chih-Nan Wei ,  Song-Fu Yang ,  Chia-Jung Tsai ,  Kao-Ming Su

    Inventor： Ho-Ming Tong ,  Teck-Chong Lee ,  Chao-Fu Weng ,  Chian-Chi Lin ,  Chih-Nan Wei ,  Song-Fu Yang ,  Chia-Jung Tsai ,  Kao-Ming Su

    IPC: B23K31/12 ,  B23K20/00 ,  B23K31/00

    CPC classification number: H01L24/93 ,  B23K20/004 ,  H01L2224/78901 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  Y10S228/904

    Abstract: A wire-bonding method for a wire-bonding apparatus is provided. The wire-bonding apparatus includes at least a first wire-bonder and a second wire-bonder for respectively bonding at least several first chips in a first region and several second chips in a second region on a substrate simultaneously. The wire-bonding method includes following steps. First, initial position coordinates of the first region and the second region are obtained. Next, it is determined whether a space between the first region and the second region is greater than a predetermined space. When the space between the first region and the second region is greater than the predetermined space, the first wire-bonder and the second wire-bonder respectively bond the first chips and the second chips simultaneously.

    Abstract translation: 提供了一种用于引线接合装置的引线接合方法。 引线接合装置至少包括第一引线接合器和第二引线接合器，用于分别在基板上的第一区域中的至少几个第一芯片和第二区域中的第二区域中的几个第二芯片。 引线键合方法包括以下步骤。 首先，获得第一区域和第二区域的初始位置坐标。 接下来，确定第一区域和第二区域之间的空间是否大于预定空间。 当第一区域和第二区域之间的空间大于预定空间时，第一引线接合器和第二引线接合器分别同时地接合第一芯片和第二芯片。

    Wire-bonding apparatus and wire-bonding method thereof
    7.
    发明申请
    Wire-bonding apparatus and wire-bonding method thereof 审中-公开
    引线接合装置及其引线接合方法

    公开(公告)号：US20080035706A1

    公开(公告)日：2008-02-14

    申请号：US11646304

    申请日：2006-12-28

    Applicant: Ho-Ming Tong ,  Kao-Ming Su ,  Chao-Fu Weng ,  Teck-Chong Lee ,  Chian-Chi Lin ,  Chia-Jung Tsai ,  Chih-Nan Wei ,  Song-Fu Yang

    Inventor： Ho-Ming Tong ,  Kao-Ming Su ,  Chao-Fu Weng ,  Teck-Chong Lee ,  Chian-Chi Lin ,  Chia-Jung Tsai ,  Chih-Nan Wei ,  Song-Fu Yang

    IPC: B23K20/12

    CPC classification number: B23K20/005 ,  H01L2224/78 ,  H01L2924/14 ,  H01L2924/1433

    Abstract: A wire-bonding apparatus is used for wire-bonding at least a first chip and a second chip on a substrate at the same time. The wire-bonding apparatus includes at least a first capillary, a second capillary, a driving unit, a processing unit and a database. The driving unit is used for driving the first capillary and the second capillary. The processing unit is used for outputting a command to the driving unit to control the first capillary and the second capillary. The database is used for storing an operating parameter data. The processing unit controls the first capillary and the second capillary according to the operating parameter data.

    Abstract translation: 引线接合装置用于同时将至少第一芯片和第二芯片引线接合在基板上。 引线接合装置至少包括第一毛细管，第二毛细管，驱动单元，处理单元和数据库。 驱动单元用于驱动第一毛细管和第二毛细管。 处理单元用于向驱动单元输出命令以控制第一毛细管和第二毛细管。 数据库用于存储操作参数数据。 处理单元根据操作参数数据控制第一毛细管和第二毛细管。

    TECHNIQUES FOR INPUT OF A MULTI-CHARACTER COMPOUND CONSONANT OR VOWEL AND TRANSLITERATION TO ANOTHER LANGUAGE USING A TOUCH COMPUTING DEVICE
    9.
    发明申请
    TECHNIQUES FOR INPUT OF A MULTI-CHARACTER COMPOUND CONSONANT OR VOWEL AND TRANSLITERATION TO ANOTHER LANGUAGE USING A TOUCH COMPUTING DEVICE 有权
    使用触摸计算设备输入多字符复合函数或VOWEL的技术和对另一种语言的翻译

    公开(公告)号：US20130151234A1

    公开(公告)日：2013-06-13

    申请号：US13350901

    申请日：2012-01-16

    Applicant: Hao Huang ,  Song Fu ,  Wei Sun ,  Hanping Feng

    Inventor： Hao Huang ,  Song Fu ,  Wei Sun ,  Hanping Feng

    IPC: G06F17/20

    CPC classification number: G06F3/04886 ,  G06F3/018 ,  G06F3/0481 ,  G06F3/04883 ,  G06F17/2217

    Abstract: A technique is presented for fast input of multi-character compound consonants and vowels on a touch computing device. The technique provides for fast input of multi-character compound consonants and vowels by enabling a user to touch an initial character on a first layout of characters, then slide his/her finger in different directions and/or different distances according to a second layout of characters. The second layout of characters can be based on the first touched character and therefore can have a limited set of characters, e.g., fewer characters in comparison to the first layout of characters. A syllable formed after input of both a consonant and a vowel, represented as one character set, e.g., in the Roman alphabet, can then be transliterated into another language, e.g., Chinese.

    Abstract translation: 提出了一种用于在触摸计算设备上快速输入多字符复合辅音和元音的技术。 该技术通过使用户能够在第一个字符布局上触摸初始字符，提供多字符复合辅音和元音的快速输入，然后根据第二布局的不同方向和/或不同的距离滑动他/她的手指 人物。 字符的第二布局可以基于第一触摸字符，并且因此可以具有有限的一组字符，例如与字符的第一布局相比较少的字符。 在输入辅音和元音之后形成的音节（例如以罗马字母表示为一个字符集）可以被音译为另一种语言，例如中文。

Patent Agency Ranking