摘要:
A CMOS image sensor with improved sensitivity includes a main pixel array region of an active pixel array region formed on a semiconductor substrate. A passivation layer is formed over the sensor, and it is at least partially removed from the main pixel array region, such that incident light being detected by the main pixel array does not pass through the passivation layer. Optical absorption and refraction caused by the material of the passivation layer are eliminated, resulting in an image sensor with improved optical sensitivity.
摘要:
A semiconductor device includes a pad electrode layer and an align mark layer, formed on the semiconductor substrate. A passivation layer is formed on the semiconductor substrate and exposes at least a portion of the top of the pad electrode layer and at least a portion of the top of the align mark layer. A light-transmitting protecting layer covers at least a portion of the passivation layer, exposes the top portion of the pad electrode layer exposed from the passivation layer, and covers the portion of the align mark layer exposed from the passivation layer.
摘要:
A field effect transistor includes a gate that is formed in a channel region of an active region defined on a substrate. A source is formed at a first surface portion of the active region that is adjacently disposed at a first side face of the gate. A drain is formed at a second surface portion of the active region that is opposite to the first surface portion with respect to the gate. The drain has a protruded portion that is protruded from a surface portion of the substrate.
摘要:
In one aspect, an electrically erasable and programmable read-only memory (EEPROM) is provided. The EEPROM includes a semiconductor substrate including spaced apart first, second and third active regions, a common floating gate traversing over the first through third active regions, source/drain regions formed in the third active region on opposite sides of the floating gate, a first interconnect connected to the first active region, a second interconnect connected to the second active region, and a third interconnect connected to either one of the source/drain regions.
摘要:
A semiconductor device includes a pad electrode layer and an align mark layer, formed on the semiconductor substrate. A passivation layer is formed on the semiconductor substrate and exposes at least a portion of the top of the pad electrode layer and at least a portion of the top of the align mark layer. A light-transmitting protecting layer covers at least a portion of the passivation layer, exposes the top portion of the pad electrode layer exposed from the passivation layer, and covers the portion of the align mark layer exposed from the passivation layer.
摘要:
A field effect transistor includes a gate that is formed in a channel region of an active region defined on a substrate. A source is formed at a first surface portion of the active region that is adjacently disposed at a first side face of the gate. A drain is formed at a second surface portion of the active region that is opposite to the first surface portion with respect to the gate. The drain has a protruded portion that is protruded from a surface portion of the substrate.
摘要:
A source driver for controlling a slew rate of a liquid crystal display (LCD) and a method for controlling the slew rate is provided. The source driver includes a plurality of output buffers for driving data lines, and a bias circuit for varying a bias voltage inputted to the output buffers to control a slew rate of the output buffers.
摘要:
A silicon-on-insulator (SOI) integrated, circuit is provided. A plurality of transistor active regions and at least one body contact active region are formed on an SOI substrate. A semiconductor residue layer, which is thinner than the transistor active regions and the body contact active region, is disposed between the transistor active regions and the body contact active region. The transistor active regions, the body contact active region and the semiconductor residue layer are disposed on a buried insulating layer of the SOI substrate. The semiconductor residue layer is covered with a partial trench isolation layer. A bar-shaped full trench isolation layer is interposed between the adjacent transistor active regions. The full trench isolation layer is in contact with sidewalls of the transistor active regions adjacent thereto and is in contact with the buried insulating layer between the adjacent transistor active regions. An insulated gate pattern crosses over the respective transistor active regions. The insulated gate pattern is disposed to be parallel with the full trench isolation layer.
摘要:
The present invention relates to a semiconductor device and a fabricating method therefor. According to the semiconductor device of the present invention, a phased layer of under bump metallurgy (UBM) is formed by repeatedly depositing chrome and copper layers with sputtering equipment in which chrome and copper targets are installed in singular or plural chambers. The chrome and copper layers of the phased layer are deposited in the structure of the same, thin multi-layers possible for mutual diffusion, wherein the chrome layers gradually get thinner and the copper layers gradually get thicker. As a consequence, reliability in the phased layer of the present invention is achieved with increase in the speed of depositing UBM to reduce the time and cost for all the fabricating processes of the semiconductor device.
摘要:
A MOS transistor of the present invention includes a semiconductor substrate of a first conductivity type impurity, a gate insulating layer formed on the semiconductor substrate, gate electrodes formed on the gate insulating layer, and an oxide layer formed by surface oxidation of the gate electrodes. A first spacer is formed on the side wall of the gate electrodes, and a second spacer is formed on the inclined side wall. A first impurity layer of low concentration is formed at a first depth by a second conductivity type impurity implanted in the vicinity of surface of the semiconductor substrate to be self-aligned at the edge of the gate electrode. A second impurity layer of middle concentration is formed at a deeper second depth than the first depth by the second conductivity type impurity implanted in the vicinity of surface of the semiconductor substrate. A third impurity layer having higher impurity concentration than that of the semiconductor, is formed at a third depth for surrounding the second impurity layer of middle concentration by a first conductivity type impurity implanted in the vicinity of surface of the semiconductor substrate to be self-aligned at the edge of the first spacer. A fourth impurity layer of high concentration formed at a fourth depth deeper than the third depth by the second conductivity type impurity implanted in the vicinity of the surface of the semiconductor substrate to be aligned at the edge of the second spacer.