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公开(公告)号：US08270145B2
公开(公告)日：2012-09-18
申请号：US11949914
申请日：2007-12-04
CPC分类号： H05K1/162 , C08G73/22 , C09D11/033 , C09D11/102 , C09D179/04 , H01L23/49894 , H01L2924/0002 , H05K3/285 , H05K2201/0187 , H05K2201/0355 , H05K2201/09763 , Y10T29/49146 , H01L2924/00
摘要： This disclosure relates to compositions and methods for using such compositions to provide protective coatings, particularly of electronic components. Fired-on-foil ceramic capacitors coated with a polybenzoxazole encapsulant which may be embedded in printed wiring boards are disclosed.
摘要翻译： 本公开涉及使用这种组合物来提供保护性涂层，特别是电子部件的组合物和方法。 公开了涂覆有可以嵌入印刷线路板中的聚苯并恶唑密封剂的箔状陶瓷电容器。
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2.发明申请Methods for creating electronic circuitry comprising phenolic epoxy binder compositions 审中-公开制备包含酚醛环氧粘合剂组合物的电子电路的方法公开(公告)号：US20080118633A1
公开(公告)日：2008-05-22
申请号：US11982766
申请日：2007-11-05
IPC分类号： B05D5/12
CPC分类号： H01C17/06586 , H01C7/005 , H05K1/095 , H05K1/167
摘要： The invention relates generally to methods for creating circuitry components from binder materials having a hydrophobic phenolic component and a hydrophobic epoxy component. The phenolic/epoxy based liquids, solutions, suspensions and/or pastes can generally be screen printed or otherwise formed on an electronic substrate, pattern or device, to provide an electronic component having low water sorption properties.
摘要翻译： 本发明一般涉及从具有疏水性酚类成分和疏水环氧组分的粘合剂材料制备电路元件的方法。 酚醛/环氧基液体，溶液，悬浮液和/或糊剂通常可以丝网印刷或以其它方式形成在电子基材，图案或装置上，以提供具有低吸水性质的电子部件。
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公开(公告)号：US07745516B2
公开(公告)日：2010-06-29
申请号：US11248803
申请日：2005-10-12
申请人： Thomas Eugene Dueber , John D. Summers , Brian C. Auman , Munirpallam Appadorai Subramanian , Nyrissa S. Rogado
发明人： Thomas Eugene Dueber , John D. Summers , Brian C. Auman , Munirpallam Appadorai Subramanian , Nyrissa S. Rogado
CPC分类号： H01L21/02118 , C08L63/00 , C08L79/08 , C08L2205/02 , G03F7/023 , G03F7/0387 , H01L21/02282 , H01L21/312 , H05K1/095 , H05K2201/0154 , Y10T428/31522 , C08L2666/20 , C08L2666/22
摘要： Water absorption resistant polyimide/epoxy-based compositions, like pastes (or solutions), are particularly useful to make electronic screen-printable materials and electronic components. A group of hydrophobic epoxies (and soluble polyimides) was discovered to be particularly resistant to moisture absorption. The polyimide/epoxy pastes made with these epoxies (and these polyimides) may optionally contain thermal crosslinking agents, adhesion promoting agents, blocked isocyanates, and other inorganic fillers. The polyimide/epoxy pastes of the present invention can have a glass transition temperature greater than 250° C., a water absorption factor of less than 2%, and a positive solubility measurement.
摘要翻译： 吸水性聚酰亚胺/环氧基组合物（如糊剂（或溶液））特别适用于制作电子可屏幕印刷的材料和电子元件。 发现一组疏水性环氧化物（和可溶性聚酰亚胺）特别耐吸湿性。 用这些环氧化物（和这些聚酰亚胺）制成的聚酰亚胺/环氧树脂浆料可以任选含有热交联剂，粘合促进剂，封闭异氰酸酯和其它无机填料。 本发明的聚酰亚胺/环氧树脂糊料的玻璃化转变温度可以高于250℃，吸水率小于2％，并且具有正的溶解度测量。
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4.发明授权Screen-printable encapsulants based on polyhydroxyamides that thermally convert to polybenzoxazoles 有权基于热转换为聚苯并恶唑的聚羟基酰胺的可印刷网印封装公开(公告)号：US08357753B2
公开(公告)日：2013-01-22
申请号：US12141137
申请日：2008-06-18
CPC分类号： H05K1/162 , C08G69/00 , C08G73/22 , H01L51/5253 , H05K3/1291 , H05K2201/0187 , H05K2201/0355 , H05K2201/09763 , H05K2203/1126
摘要： This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.
摘要翻译： 本发明涉及组合物，以及这些组合物用于保护涂层，特别是电子器件的用途。 本发明涉及涂覆有复合密封剂并嵌入印刷线路板的烧制箔陶瓷电容器。
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公开(公告)号：US20090141425A1
公开(公告)日：2009-06-04
申请号：US11949914
申请日：2007-12-04
CPC分类号： H05K1/162 , C08G73/22 , C09D11/033 , C09D11/102 , C09D179/04 , H01L23/49894 , H01L2924/0002 , H05K3/285 , H05K2201/0187 , H05K2201/0355 , H05K2201/09763 , Y10T29/49146 , H01L2924/00
摘要： This disclosure relates to compositions and methods for using such compositions to provide protective coatings, particularly of electronic components. Fired-on-foil ceramic capacitors coated with a polybenzoxazole encapsulant which may be embedded in printed wiring boards are disclosed.
摘要翻译： 本公开涉及使用这种组合物来提供保护性涂层，特别是电子部件的组合物和方法。 公开了涂覆有可以嵌入印刷线路板中的聚苯并恶唑密封剂的箔状陶瓷电容器。
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6.发明申请Compositions comprising polyimide and hydrophobic epoxy and phenolic resins, and methods relating thereto 审中-公开包含聚酰亚胺和疏水性环氧树脂和酚醛树脂的组合物，以及与其相关的方法公开(公告)号：US20090111948A1
公开(公告)日：2009-04-30
申请号：US11977563
申请日：2007-10-25
IPC分类号： C08L63/00
CPC分类号： C08G73/1039 , C08G73/1064 , C08K3/22 , C08L63/00 , C08L79/08 , C08L2666/22
摘要： Water absorption resistant compositions of the present disclosure, e.g., pastes (or solutions), are well suited for electronic screen-printable materials and electronic components. The composition of the present disclosure may optionally contain thermal crosslinking agents, adhesion promoters, and other inorganic fillers. The composition of the present disclosure can have a glass transition temperature greater than 250° C. and a water absorption factor of less than 2%, and a positive solubility measurement.
摘要翻译： 本公开的耐吸水组合物，例如糊剂（或溶液）非常适用于电子可屏幕印刷的材料和电子部件。 本公开的组合物可以任选地含有热交联剂，粘合促进剂和其它无机填料。 本公开的组合物可以具有大于250℃的玻璃化转变温度和小于2％的吸水系数和正的溶解度测量。
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公开(公告)号：US20090017309A1
公开(公告)日：2009-01-15
申请号：US12169186
申请日：2008-07-08
IPC分类号： B32B15/092 , B32B15/00 , B05D3/06
CPC分类号： H05K1/0373 , H05K3/0032 , H05K3/184 , H05K3/185 , H05K3/28 , H05K2201/0209 , H05K2201/0236 , H05K2203/107 , Y10T428/31529 , Y10T428/3154 , Y10T428/31678
摘要： The present invention is directed to non-lithographic patterning by laser (or similar-type energy beam) ablation, where the ablation system ultimately results in circuitry features that are relative free from debris induced over-plating defects (debris relating to the ablation process) and fully additive plating induced over-plating defects. Compositions of the invention include a circuit board precursor having an insulating substrate and a cover layer. The insulating substrate is made from a dielectric material and also a metal oxide activatable filler. The cover layer can be sacrificial or non-sacrificial and is used to remediate unwanted debris arising from the ablation process.
摘要翻译： 本发明涉及通过激光（或类似能量束）消融的非平版印刷图案，其中消融系统最终导致电路特征相对没有碎片诱导的过度电镀缺陷（与消融过程有关的碎片） 和完全添加电镀引起的过度镀覆缺陷。 本发明的组合物包括具有绝缘基板和覆盖层的电路板前体。 绝缘基板由介电材料制成，也可由金属氧化物可活化填料制成。 覆盖层可以是牺牲的或非牺牲的，并且用于修复由消融过程产生的不想要的碎屑。
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8.发明授权Flexible, flame-retardant, aqueous-processable photoimageable composition for coating flexible printed circuits 有权柔性，阻燃，水性加工的可光成像组合物用于涂布柔性印刷电路公开(公告)号：US06218074B1
公开(公告)日：2001-04-17
申请号：US09358212
申请日：1999-07-21
IPC分类号： G03F7095
CPC分类号： G03F7/033 , H05K3/287 , H05K3/4676 , Y10S430/108 , Y10S430/111
摘要： A flexible, flame-retardant, aqueous processable, photoimageable resin composition for forming a permanent, protective coating film for printed circuitry and a multilayer photoimageable element containing a layer of the photoimageable resin composition in combination with a low tack photoimageable resin sublayer and a temporary support film are disclosed. The photoimageable resin composition has excellent aqueous developability and provides a cured coating film having good flexibility, adhesion, solvent resistance, surface hardness, thermal resistance, electrical insulating properties and flame retardancy.
摘要翻译： 一种用于形成用于印刷电路的永久性保护涂膜的柔性阻燃水性可加工的可光成像树脂组合物，以及含有可光成像树脂组合物层与低粘度可光成像树脂子层和临时载体的多层可光成像元件 披露电影。 可光成像树脂组合物具有优异的水性显影性，并且提供具有良好的柔韧性，粘合性，耐溶剂性，表面硬度，耐热性，电绝缘性和阻燃性的固化涂膜。
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9.发明授权Flexible, aqueous processable, photoimageable permanent coatings for printed circuits 失效灵活的，水性可加工的，用于印刷电路的可光成像永久性涂层
公开(公告)号：US5728505A
公开(公告)日：1998-03-17
申请号：US802494
申请日：1997-02-20
IPC分类号： C08F299/06 , C08F290/00 , C09D175/04 , C09D175/14 , C09D175/16 , G03F7/033 , H05K3/28 , G03F7/09
CPC分类号： G03F7/033 , H05K3/287 , Y10S430/107 , Y10S430/111
摘要： Aqueous processable, photopolymerized coating compositions are disclosed, which after curing, have superior flexibility for use as permanent coatings for the protection of printed circuitry.
摘要翻译： 公开了水性可加工的光聚合涂料组合物，其在固化后具有优异的柔性，用作用于保护印刷电路的永久涂层。
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10.发明授权Polyimide composite coverlays and methods and compositions relating thereto 有权聚酰亚胺复合材料覆盖物及其相关的方法和组合物公开(公告)号：US07579134B2
公开(公告)日：2009-08-25
申请号：US11080608
申请日：2005-03-15
CPC分类号： H05K3/281 , C09J7/22 , C09J7/35 , C09J2479/08 , C09J2479/086 , H05K3/0023 , H05K3/386 , H05K2201/0154 , H05K2201/0195 , Y10S430/107 , Y10S430/117 , Y10S430/127 , Y10T428/31681 , Y10T428/31721 , Y10T428/31725
摘要： The present invention is directed to coverlay compositions derived from two-layer polyamic acid-based composites having a cover layer and adjacent thereto an adhesive layer wherein the cover layer comprises polyamic acid and other additives allowing the composition to be photosensitive and aqueous base developable, and where the adhesive layer can form a polyimide having a glass transition temperature between 170 and 250° C. The two-layer coverlay compositions of the present invention are used to encapsulate metal circuit traces formed on a flexible printed circuit base substrate. These two-layer compositions are particularity useful due to having an overall in-plane CTE between 10 and 40 ppm/° C. a range that is useful in avoiding unwanted curling of a flexible printed circuit when used as a polyimide-based coverlay material.
摘要翻译： 本发明涉及衍生自具有覆盖层并与其相邻的粘合剂层的两层聚酰胺酸基复合材料的覆盖层组合物，其中所述覆盖层包含聚酰胺酸和允许组合物为光敏性和水性基础显影的其它添加剂，以及 其中粘合剂层可以形成玻璃化转变温度在170和250℃之间的聚酰亚胺。本发明的双层覆盖层组合物用于封装形成在柔性印刷电路基底基板上的金属电路迹线。 这些双层组合物是特别有用的，因为其具有10至40ppm /℃的总体平面内CTE，可用于避免当用作基于聚酰亚胺的覆盖材料时柔性印刷电路的不必要的卷曲的范围。
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