利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

42 条记录 (耗时 0.027 秒)

    Pick and place mechanism for contactor
    5.
    发明授权
    Pick and place mechanism for contactor 有权
    接触器拾取和放置机构

    公开(公告)号：US06359454B1

    公开(公告)日：2002-03-19

    申请号：US09368002

    申请日：1999-08-03

    申请人： Theodore A. Khoury

    发明人： Theodore A. Khoury

    IPC分类号： G01R3102

    CPC分类号： G01R3/00 ,  G01R1/07342

    摘要： A pick and place mechanism for assembling a large number of contactors on a contact substrate. The pick and place mechanism includes a first area for positioning an intermediate plate having a plurality of contactors thereon, a second area for positioning the contact substrate for receiving the contactors thereon, a carrier provided between the first and second areas for converting a direction of the contactor to a predetermined direction when receiving the contactor on a seat having an inclined back wall and a flat bottom surface, a first transfer mechanism for picking the contactor from the intermediate plate and placing the contactor on the seat of the carrier, a second transfer mechanism for picking the contactor from the seat of the carrier while maintaining the predetermined direction of the contactor defined by the carrier and placing the contactor on the contact substrate.

    摘要翻译： 用于在接触基板上组装大量接触器的拾取和放置机构。 拾取和放置机构包括用于定位其上具有多个接触器的中间板的第一区域，用于定位用于接收其上的接触器的接触基板的第二区域，设置在第一和第二区域之间的载体，用于转换 在具有倾斜后壁和平坦底面的座椅上接收接触器时，将接触器接触到预定方向;第一传送机构，用于从中间板拾取接触器并将接触器放置在载体的座位上;第二传送机构 用于在保持由载体限定的接触器的预定方向并将接触器放置在接触基板上的同时从载体的座位拾取接触器。

    Contact structure and production method thereof
    6.
    发明授权
    Contact structure and production method thereof 失效
    接触结构及其制造方法

    公开(公告)号：US06250933B1

    公开(公告)日：2001-06-26

    申请号：US09488661

    申请日：2000-01-20

    申请人： Theodore A. Khoury ,  James W. Frame

    发明人： Theodore A. Khoury ,  James W. Frame

    IPC分类号： H01R1200

    CPC分类号： G01R1/06738 ,  G01R1/07314 ,  H01L2924/0002 ,  H01R12/714 ,  H01R13/24 ,  H05K3/4092 ,  H01L2924/00

    摘要： A contact structure for achieving an electrical connection with a contact target is formed of a contact substrate and a plurality of contactors mounted on the contact substrate. The contactors are produced on a semiconductor substrate or other dielectric by a microfabrication technology. Each of the contactors has a contact bump to contact with the contact target. In one aspect, one of the base portions of the contactor is slidably formed on the surface of the contact substrate. A spring force is generated when the contactor is pressed against the contact target. Various types of contact structures and the associated production methods are also described.

    摘要翻译： 用于实现与接触靶的电连接的接触结构由接触基板和安装在接触基板上的多个接触器形成。 通过微细加工技术在半导体衬底或其它电介质上制造接触器。 每个接触器具有接触凸块以与接触目标接触。 一方面，接触器的基部之一可滑动地形成在接触基板的表面上。 当接触器被压靠在接触靶上时产生弹簧力。 还描述了各种类型的接触结构和相关联的制备方法。

    Probe contract system having planarity adjustment mechanism
    8.
    发明授权
    Probe contract system having planarity adjustment mechanism 失效
    具有平面调整机制的探头契约系统

    公开(公告)号：US06586956B2

    公开(公告)日：2003-07-01

    申请号：US09885437

    申请日：2001-06-20

    申请人： Robert Edward Aldaz ,  Theodore A. Khoury

    发明人： Robert Edward Aldaz ,  Theodore A. Khoury

    IPC分类号： G01R3102

    CPC分类号： G01R1/07342 ,  G01R1/06794 ,  G01R1/07378

    摘要： A probe contact system is capable of adjusting distances between tips of the contactors and contact targets with simple and low cost mechanism. The probe contact system includes a contact substrate having a plurality of contactors thereon, a probe card for fixedly mounting the contact substrate, a conductive elastomer provided between the contact substrate and the probe card, a gap sensor for measuring a distance between the contact substrate and the contact targets, a probe card ring attached to a frame of the probe contact system for mechanically coupling the probe card to the frame, and a plurality of connection members for connecting the probe card to the probe card ring while adjusting a gap between the probe card and the probe card ring.

    摘要翻译： 探头接触系统能够以简单且低成本的机制调节接触器的尖端和接触目标之间的距离。 探针接触系统包括其上具有多个接触器的接触衬底，用于固定安装接触衬底的探针卡，设置在接触衬底和探针卡之间的导电弹性体，用于测量接触衬底和接触衬底之间的距离的间隙传感器 接触目标，附接到用于将探针卡机械地耦合到框架的探针接触系统的框架的探针卡环以及用于将探针卡连接到探针卡环的多个连接构件，同时调节探针之间的间隙 卡和探针卡环。

    Packaging and interconnection of contact structure
    10.
    发明授权
    Packaging and interconnection of contact structure 失效
    接触结构的包装和互连

    公开(公告)号：US06548756B2

    公开(公告)日：2003-04-15

    申请号：US09765113

    申请日：2001-01-18

    申请人： Mark R. Jones ,  Theodore A. Khoury

    发明人： Mark R. Jones ,  Theodore A. Khoury

    IPC分类号： H01R900

    CPC分类号： G01R31/2808 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/07811 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A packaging and interconnection for connecting a contact structure to an outer component. The packaging and interconnection is formed of a contact structure mounted on a contact substrate, a contact trace formed on the contact substrate and electrically connected to the contact structure at one end and provided with a contact pad at another end, a print circuit board (PBS) pad provided on a PCB board substrate, a conductive lead for electrically connecting an upper surface of the contact pad and the connector, an elastomer provided under contact substrate, and a support structure provided between the contact structure, contact substrate and elastomer. The contact structure is projected from the contact substrate to a free space to allow free movements of at least a horizontal portion and a contact portion thereof.

    摘要翻译： 用于将接触结构连接到外部部件的包装和互连。 封装和互连由安装在接触基板上的接触结构形成，接触轨迹形成在接触基板上并且在一端电连接到接触结构并且在另一端电连接接触焊盘，印刷电路板（PBS ）焊盘，用于电连接接触焊盘的上表面和连接器的导电引线，设置在接触基板下的弹性体，以及设置在接触结构，接触基板和弹性体之间的支撑结构。 接触结构从接触基板突出到自由空间，以允许至少一个水平部分及其接触部分的自由移动。