公开(公告)号：US20140124812A1

公开(公告)日：2014-05-08

申请号：US14118176

申请日：2012-05-15

申请人： Masafumi Kuramoto ,  Daisuke Iwakura ,  Kenji Ozeki ,  Tomoaki Tsuruha ,  Satoshi Okada ,  Masaki Hayashi

发明人： Masafumi Kuramoto ,  Daisuke Iwakura ,  Kenji Ozeki ,  Tomoaki Tsuruha ,  Satoshi Okada ,  Masaki Hayashi

IPC分类号： H01L33/52

CPC分类号： H01L33/52 ,  H01L24/45 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/54 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012

摘要： To provide a light emitting device having high light extraction efficiency, and a method for manufacturing the light emitting device. A method for manufacturing a light emitting device (100) according to the present invention, includes: forming a sealing member (40) for sealing a light emitting element (10) on a base body (30) by dropping, the base body (30) including a conductive member (20) for connecting to the light emitting element (10), and a molding (25) integrally molded with the conductive member (20); the sealing member (10) being formed such that at least a part of a periphery of the sealing member (40) is located on an outward surface (38) of the conductive member (20) or the molding (25), the outward surface facing outward in a top view.

摘要翻译： 提供一种具有高光提取效率的发光器件及其制造方法。 根据本发明的发光器件（100）的制造方法包括：形成用于通过滴落将基体（30）上的发光元件（10）密封的密封构件（40），基体（30） ），包括用于连接到所述发光元件（10）的导电构件（20）和与所述导电构件（20）一体模制的模制件（25）; 密封构件（10）形成为使得密封构件（40）的周边的至少一部分位于导电构件（20）或模制件（25）的外表面（38）上，外表面 在顶视图中向外。

公开(公告)号：US10090446B2

公开(公告)日：2018-10-02

申请号：US14118176

申请日：2012-05-15

申请人： Masafumi Kuramoto ,  Daisuke Iwakura ,  Kenji Ozeki ,  Tomoaki Tsuruha ,  Satoshi Okada ,  Masaki Hayashi

发明人： Masafumi Kuramoto ,  Daisuke Iwakura ,  Kenji Ozeki ,  Tomoaki Tsuruha ,  Satoshi Okada ,  Masaki Hayashi

IPC分类号： H01L33/54 ,  H01L33/52 ,  H01L23/00 ,  H01L25/075

摘要： To provide a light emitting device having high light extraction efficiency, and a method for manufacturing the light emitting device. A method for manufacturing a light emitting device (100) according to the present invention, includes: forming a sealing member (40) for sealing a light emitting element (10) on a base body (30) by dropping, the base body (30) including a conductive member (20) for connecting to the light emitting element (10), and a molding (25) integrally molded with the conductive member (20); the sealing member (10) being formed such that at least a part of a periphery of the sealing member (40) is located on an outward surface (38) of the conductive member (20) or the molding (25), the outward surface facing outward in a top view.

公开(公告)号：US08759124B2

公开(公告)日：2014-06-24

申请号：US13283415

申请日：2011-10-27

申请人： Tomonori Miyoshi ,  Kenji Ozeki ,  Tomoaki Tsuruha

发明人： Tomonori Miyoshi ,  Kenji Ozeki ,  Tomoaki Tsuruha

IPC分类号： H01L33/60 ,  H01L33/48

CPC分类号： H01L33/502 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/156 ,  H01L33/483 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/16

摘要： A light emitting apparatus comprises an electrically insulating base member; a pair of electrically conductive pattern portions formed on an upper surface of the base member; at least one light emitting device that is electrically connected to the pair of electrically conductive pattern portions; and a resin portion that surrounds at least a side surface of the at least one light emitting device and partially covers the pair of electrically conductive pattern portions. Each of the pair of electrically conductive pattern portions extends toward a periphery of the base member from resin-covered parts of the electrically conductive pattern portions. At least the resin-covered parts of each of the electrically conductive pattern portions has at least one elongated through hole extending in a direction in which the electrically conductive pattern portions extend from the resin-covered parts, wherein the resin portion contacts the base member via the through holes.

摘要翻译： 发光装置包括电绝缘基底构件; 形成在所述基底构件的上表面上的一对导电图案部分; 至少一个电连接到所述一对导电图案部分的发光器件; 以及树脂部分，其围绕所述至少一个发光器件的至少一个侧表面并且部分地覆盖所述一对导电图案部分。 一对导电图案部分中的每一个从导电图案部分的树脂覆盖部分向基部构件的周边延伸。 至少每个导电图案部分的树脂覆盖部分具有至少一个细长通孔，该细长通孔沿着导电图案部分从树脂覆盖部分延伸的方向延伸，其中树脂部分经由 通孔。

公开(公告)号：US20120104452A1

公开(公告)日：2012-05-03

申请号：US13283415

申请日：2011-10-27

申请人： Tomonori MIYOSHI ,  Kenji Ozeki ,  Tomoaki Tsuruha

发明人： Tomonori MIYOSHI ,  Kenji Ozeki ,  Tomoaki Tsuruha

IPC分类号： H01L33/62 ,  H01L33/60

CPC分类号： H01L33/502 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/156 ,  H01L33/483 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/16

摘要： A light emitting apparatus comprises an electrically insulating base member; a pair of electrically conductive pattern portions formed on an upper surface of the base member; at least one light emitting device that is electrically connected to the pair of electrically conductive pattern portions; and a resin portion that surrounds at least a side surface of the at least one light emitting device and partially covers the pair of electrically conductive pattern portions. Each of the pair of electrically conductive pattern portions extends toward a periphery of the base member from resin-covered parts of the electrically conductive pattern portions. At least the resin-covered parts of each of the electrically conductive pattern portions has at least one elongated through hole extending in a direction in which the electrically conductive pattern portions extend from the resin-covered parts, wherein the resin portion contacts the base member via the through holes.

摘要翻译： 发光装置包括电绝缘基底构件; 形成在所述基底构件的上表面上的一对导电图案部分; 至少一个电连接到所述一对导电图案部分的发光器件; 以及树脂部分，其围绕所述至少一个发光器件的至少一个侧表面并且部分地覆盖所述一对导电图案部分。 一对导电图案部分中的每一个从导电图案部分的树脂覆盖部分向基部构件的周边延伸。 至少每个导电图案部分的树脂覆盖部分具有至少一个细长通孔，该细长通孔沿着导电图案部分从树脂覆盖部分延伸的方向延伸，其中树脂部分经由 通孔。