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    Light emitting device and backlight unit using the same
    5.
    发明授权
    Light emitting device and backlight unit using the same 有权
    发光装置和使用其的背光单元

    公开(公告)号：US08426879B2

    公开(公告)日：2013-04-23

    申请号：US11992670

    申请日：2006-09-29

    申请人： Motohisa Kitani ,  Hirofumi Ichikawa ,  Tomoya Tsukioka ,  Tomohide Miki ,  Masafumi Kuramoto

    发明人： Motohisa Kitani ,  Hirofumi Ichikawa ,  Tomoya Tsukioka ,  Tomohide Miki ,  Masafumi Kuramoto

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An object of the present invention is to provide a light emitting device that shows high adhesion between a sealing member and a package member. A light emitting device 100 of the present invention comprises a package 20 with a recess 60 having a bottom face 20a and a side wall 20b, a light emitting element 10 mounted on the bottom face 20a of the recess 60 of the package 20, and a sealing member 40 filled in the recess 60 of the package 20, with which the light emitting element 10 is coated, wherein the package 20 contains, against the entire monomer component, from 5 to 70% by weight of potassium titanate fibers and/or wollastonite, from 10 to 50% by weight of titanium oxide, and from 15 to 85% by weight of a semiaromatic polyamide containing 20 mol % or more of an aromatic monomer, a part of the side wall 20b of the recess 60 of the package 20 has a thickness of 100 μm or less, and the sealing member 40 is made of silicone.

    摘要翻译： 本发明的目的是提供一种在密封构件和包装构件之间显示高粘合性的发光装置。 本发明的发光器件100包括具有凹部60的封装20，该凹部60具有底面20a和侧壁20b，安装在封装20的凹部60的底面20a上的发光元件10和 密封构件40填充在包装20的凹部60中，发光元件10通过该凹部60被涂覆，其中包装20针对整个单体组分包含5至70重量％的钛酸钾纤维和/或硅灰石 ，10〜50重量％的二氧化钛，15〜85重量％的含有20摩尔％以上的芳香族单体的半芳族聚酰胺，包装体20的凹部60的一部分侧壁20b 厚度为100μm以下，密封部件40为硅树脂。

    Curing composition and method for preparing same, light-shielding paste, light-shielding resin and method for producing same, package for light-emitting diode, and semiconductor device
    7.
    发明申请
    Curing composition and method for preparing same, light-shielding paste, light-shielding resin and method for producing same, package for light-emitting diode, and semiconductor device 有权

    公开(公告)号：US20060243947A1

    公开(公告)日：2006-11-02

    申请号：US10546905

    申请日：2004-02-25

    申请人： Manabu Tsumura ,  Masahito Ide ,  Katsuya Ouchi ,  Masafumi Kuramoto ,  Tomohide Miki

    发明人： Manabu Tsumura ,  Masahito Ide ,  Katsuya Ouchi ,  Masafumi Kuramoto ,  Tomohide Miki

    IPC分类号： C09K19/52

    CPC分类号： C08G77/452 ,  C08F283/00 ,  C08F290/06 ,  C08F290/14 ,  C08G77/485 ,  C08G77/54 ,  C08K3/22 ,  C08L51/003 ,  C08L53/00 ,  C08L83/04 ,  C08L101/00 ,  H01L23/295 ,  H01L33/44 ,  H01L2924/0002 ,  H01L2924/12044 ,  Y10T428/31663 ,  Y10T428/31786 ,  C08L2666/02 ,  H01L2924/00

    摘要： The invention aims at providing A light-shielding paste which contains a thermoplastic resin and an inorganic member as essential components; A light-shielding paste which contains a thermosetting resin and an inorganic member as essential components; A curable composition which contains, as essential components, (A) an organic compound comprising an organic main chain containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, (E) a silanol condensation catalyst, and (F) an inorganic member; The above curable composition which further contains (G) silica; The above curable composition which shows such a flow leveling property that when the composition is allowed to stand on a glass substrate inclined at an angle of 80 degrees at 100° C. for 1 hour, the flow-out distance is not longer than 2 cm; A light-shielding paste which comprises the above curable composition; or, A method of forming a light-shielding resin layer on a LED package having an aperture comprising a bottom and sidewalls and formed of a molding resin by a monolithic process with the respective ends of an external positive electrode and an external negative electrode being exposed at a predetermined distance on the aperture bottom which method comprises (1) applying a light-shielding paste to a substrate; (2) bringing the LED package aperture into close contact therewith; and (3) heating the LED package with the aperture facing upward; and thereby the light-shielding paste is allowed to spread along the package sidewalls alone. The curable composition of the invention is excellent in light-shielding ability and is highly resistant to light and, therefore, can be used as a light-shielding paste. Further, the curable composition of the invention is low in fluidity and, therefore, light-emitting diodes with the curing product formed on the LED package sidewalls alone can be obtained by using that curable composition. Furthermore, according to the method of light-shielding resin layer formation according to the invention, it is possible to efficiently apply a light-shielding paste to the LED package sidewalls alone for light-shielding resin layer formation, whereby the productivity is markedly improved.