公开(公告)号：US5150193A

公开(公告)日：1992-09-22

申请号：US653244

申请日：1991-02-11

申请人： Toshihiro Yasuhara ,  Masachika Masuda ,  Gen Murakami ,  Kunihiko Nishi ,  Masanori Sakimoto ,  Ichio Shimizu ,  Akio Hoshi ,  Sumio Okada ,  Tooru Nagamine

发明人： Toshihiro Yasuhara ,  Masachika Masuda ,  Gen Murakami ,  Kunihiko Nishi ,  Masanori Sakimoto ,  Ichio Shimizu ,  Akio Hoshi ,  Sumio Okada ,  Tooru Nagamine

IPC分类号： H01L23/495

CPC分类号： H01L24/85 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L24/05 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/45644 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48799 ,  H01L2224/48824 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/83385 ,  H01L2224/83855 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L24/45 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01205 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351

摘要： The present invention consists in that a through hole of large area is provided in a die pad or a tab, thereby to prevent a resin from cracking at the rear surface of a surface-packaging resin package in a high-temperature soldering atmosphere of vapor-phase reflow or the like, whereby a resin-molded surface-packaged IC of high reliability is provided.

摘要翻译： 本发明的特征在于，在芯片焊盘或突片中设置大面积的贯通孔，防止树脂在气相成膜用高温焊接气氛中的表面封装树脂封装的背面开裂， 相回流等，由此提供了高可靠性的树脂模制表面封装IC。