Multilayer printed circuit board and method of manufacturing multilayer printed circuit board
    2.
    发明授权
    Multilayer printed circuit board and method of manufacturing multilayer printed circuit board 失效
    多层印刷电路板及多层印刷电路板制造方法

    公开(公告)号:US08217276B2

    公开(公告)日:2012-07-10

    申请号:US10410434

    申请日:2003-04-10

    IPC分类号: H05K1/03

    摘要: A multilayer printed circuit board which can surely establish interlayer connection with low resistance. The multilayer printed circuit board comprises: a first substrate having a conductive pattern on one face and a non-penetration connection hole on the other face, for exposing the conductive pattern to outside; a second substrate having a conductive pattern formed on a face opposed to the other face of first substrate and a conductive bump on the conductive pattern integrally. The first substrate and the second substrate are integrated by engaging the bump of the second substrate with the connection hole of the first substrate and by intervening a conductive cement between the bumps and the conductive pattern exposed to outside from the connection holes.

    摘要翻译: 一种多层印刷电路板,可以可靠地建立具有低电阻的层间连接。 所述多层印刷电路板包括:在一个面上具有导电图案的第一基板和另一面上的非穿透连接孔,用于将导电图案暴露于外部; 第二基板,其具有形成在与第一基板的另一面相对的表面上的导电图案和导电图案上的导电凸块。 第一基板和第二基板通过将第二基板的凸块与第一基板的连接孔接合并且通过在凸起和从连接孔露出到外部的导电图案之间插入导电粘合剂来集成。

    Speaker diaphragm and method of manufacturing speaker diaphragm
    3.
    发明授权
    Speaker diaphragm and method of manufacturing speaker diaphragm 失效
    扬声器隔膜和制造扬声器隔膜的方法

    公开(公告)号:US07546897B2

    公开(公告)日:2009-06-16

    申请号:US11457681

    申请日:2006-07-14

    IPC分类号: H04R1/00 H04R7/00

    摘要: A speaker diaphragm made of a resin containing a thermoplastic polymeric material is provided. The speaker diaphragm includes a changed portion formed on the diaphragm that is molded using the resin. The changed portion is formed by partially changing physical properties of the thermoplastic polymeric material for dispersing local vibrations based on a characteristic of local vibrations measured in advance.

    摘要翻译: 提供由含有热塑性聚合材料的树脂制成的扬声器隔膜。 扬声器振膜包括形成在使用该树脂模制的隔膜上的改变部分。 改变的部分是通过基于预先测量的局部振动的特性来部分改变用于分散局部振动的热塑性聚合材料的物理性质而形成的。

    Loudspeaker diaphragm
    4.
    发明授权
    Loudspeaker diaphragm 失效
    扬声器隔膜

    公开(公告)号:US07527124B2

    公开(公告)日:2009-05-05

    申请号:US11500309

    申请日:2006-08-08

    IPC分类号: H04R7/02 G10K13/00 H04R7/10

    CPC分类号: H04R31/003

    摘要: Wholly aromatic polyamide fibers cut to a length of 0.5 to 5 mm are dispersedly contained in an injection-moldable thermoplastic resin, and the resin is molded by ultrahigh-speed thin-wall injection molding so as to produce a loudspeaker diaphragm in which the wholly aromatic polyamide fibers are dispersed in a direction perpendicular to the resin flow direction, whereby the loudspeaker diaphragm is improved in internal loss.

    摘要翻译: 将切割成长度为0.5〜5mm的全芳香族聚酰胺纤维分散包含在可注射成型的热塑性树脂中,并通过超高速薄壁注射成型来模制树脂,以便制造其中全芳族的扬声器隔膜 聚酰胺纤维沿垂直于树脂流动方向的方向分散,从而扬声器隔膜内部损耗得到改善。

    Conductive bond, multilayer printed circuit board, and method for making the multilayer printed circuit board
    5.
    发明授权
    Conductive bond, multilayer printed circuit board, and method for making the multilayer printed circuit board 失效
    导电粘合剂,多层印刷电路板以及制造多层印刷电路板的方法

    公开(公告)号:US06710261B2

    公开(公告)日:2004-03-23

    申请号:US10173053

    申请日:2002-06-18

    IPC分类号: H05K102

    摘要: A conductive bond comprises conductive colloidal particles and a dispersant for dispersing the conductive colloidal particles. A multilayer printed circuit board includes a plurality of substrates, each having a conductive pattern on at least one face thereof. Any adjacent two of the substrates are separated by an insulating layer, and the conductive pattern of a first substrate of the two substrates faces the conductive pattern of a second substrate of the two substrate. The conductive pattern of a first substrate has one or more bumps for electrical connection to the second substrate. The bump and the conductive pattern of the second substrate are bonded to each other with the conductive bond applied to the tip of the bump.

    摘要翻译: 导电键包括导电胶体颗粒和用于分散导电胶体颗粒的分散剂。 多层印刷电路板包括多个基板,每个基板在其至少一个面上具有导电图案。 任何相邻的两个基板被绝缘层分开,并且两个基板的第一基板的导电图案面对两个基板的第二基板的导电图案。 第一基板的导电图案具有用于与第二基板电连接的一个或多个凸块。 第二基板的凸起和导电图案通过施加到凸块的尖端的导电接合而彼此接合。

    Loudspeaker diaphragm
    7.
    发明申请
    Loudspeaker diaphragm 失效
    扬声器隔膜

    公开(公告)号:US20070034443A1

    公开(公告)日:2007-02-15

    申请号:US11500309

    申请日:2006-08-08

    IPC分类号: H04R7/00

    CPC分类号: H04R31/003

    摘要: Wholly aromatic polyamide fibers cut to a length of 0.5 to 5 mm are dispersedly contained in an injection-moldable thermoplastic resin, and the resin is molded by ultrahigh-speed thin-wall injection molding so as to produce a loudspeaker diaphragm in which the wholly aromatic polyamide fibers are dispersed in a direction perpendicular to the resin flow direction, whereby the loudspeaker diaphragm is improved in internal loss.

    摘要翻译: 将切割成长度为0.5〜5mm的全芳香族聚酰胺纤维分散包含在可注射成型的热塑性树脂中,并通过超高速薄壁注射成型来模制树脂,以便制造其中全芳族的扬声器隔膜 聚酰胺纤维沿垂直于树脂流动方向的方向分散,从而扬声器隔膜内部损耗得到改善。

    Acoustic diaphragm, and method of fabricating acoustic diaphragm
    9.
    发明授权
    Acoustic diaphragm, and method of fabricating acoustic diaphragm 失效
    声膜,以及制造声膜的方法

    公开(公告)号:US07980355B2

    公开(公告)日:2011-07-19

    申请号:US11561690

    申请日:2006-11-20

    IPC分类号: H04R7/00 H04R1/00

    CPC分类号: H04R7/24

    摘要: There is provided an acoustic diaphragm used for a loudspeaker, having an injection-molded edge molded using a thermoplastic elastomer, in which the edge is formed using a workable polyolefinic elastomer, as a material, containing a soft segment having rubber particles of 1 μm to 10 μm in diameter uniformly dispersed therein, and a hard segment composed of an olefinic resin, and the edge is formed into a shape allowing the resin to be aligned as being not causative of anisotropy in the physical characteristics of the edge, as a result of thin-wall molding by the injection molding.

    摘要翻译: 提供了一种用于扬声器的声学隔膜,其具有使用热塑性弹性体成型的注射成型的边缘,其中边缘使用可加工的聚烯烃弹性体形成,作为材料,其包含具有1μm至 均匀分散在其中的10μm直径,由烯烃树脂构成的硬链段,并且边缘被形成为允许树脂排列成不具有边缘物理特性的各向异性的形状,这是由于 薄壁成型通过注塑成型。

    ACOUSTIC DIAPHRAGM, AND METHOD OF FABRICATING ACOUSTIC DIAPHRAGM
    10.
    发明申请
    ACOUSTIC DIAPHRAGM, AND METHOD OF FABRICATING ACOUSTIC DIAPHRAGM 失效
    声波胶片,以及制作声学胶片的方法

    公开(公告)号:US20070133838A1

    公开(公告)日:2007-06-14

    申请号:US11561690

    申请日:2006-11-20

    IPC分类号: H04R11/02

    CPC分类号: H04R7/24

    摘要: There is provided an acoustic diaphragm used for a loudspeaker, having an injection-molded edge molded using a thermoplastic elastomer, in which the edge is formed using a workable polyolefinic elastomer, as a material, containing a soft segment having rubber particles of 1 μm to 10 μm in diameter uniformly dispersed therein, and a hard segment composed of an olefinic resin, and the edge is formed into a shape allowing the resin to be aligned as being not causative of anisotropy in the physical characteristics of the edge, as a result of thin-wall molding by the injection molding.

    摘要翻译: 提供了一种用于扬声器的声学隔膜,其具有使用热塑性弹性体成型的注射成型边缘,其中边缘使用可加工的聚烯烃弹性体形成,该材料包含具有1mum至 均匀分散在其中的直径为10μm的细颗粒和由烯烃树脂构成的硬链段,并且边缘形成为允许树脂排列为不会导致边缘的物理特性的各向异性的形状,这是由于 薄壁成型通过注塑成型。