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    Microactuators including a metal layer on distal portions of an arched beam
    1.
    发明授权
    Microactuators including a metal layer on distal portions of an arched beam 有权
    微型致动器包括在拱形梁的远端部分上的金属层

    公开(公告)号：US06255757B1

    公开(公告)日：2001-07-03

    申请号：US09388321

    申请日：1999-09-01

    Applicant: Vijayakumar R. Dhuler ,  Mark David Walters

    Inventor： Vijayakumar R. Dhuler ,  Mark David Walters

    IPC: H02N1000

    CPC classification number: F15C5/00 ,  B81B3/0051 ,  B81B2201/031 ,  B81B2201/054 ,  B81B2203/0109 ,  B81B2203/051 ,  B81C2203/031 ,  B81C2203/036 ,  F16K99/0001 ,  F16K99/0007 ,  F16K99/0009 ,  F16K99/0011 ,  F16K99/0036 ,  F16K2099/0074 ,  F16K2099/008 ,  H01H2001/0042

    Abstract: A microelectromechanical (MEMS) device is provided that includes a microelectronic substrate and a thermally actuated microactuator and associated components disposed on the substrate and formed as a unitary structure from a single crystalline material, wherein the associated components arc actuated by the microactuator upon thermal actuation thereof. For example, the MEMS device may be a valve. As such, the valve may include at least one valve plate that is controllably brought into engagement with at least one valve opening in the microelectronic substrate by selective actuation of the microactuator. While the MEMS device can include various microactuators, the microactuator advantageously includes a pair of spaced apart supports disposed on the substrate and at least one arched beam extending therebetween. By heating the at least one arched beam of the microactuator, the arched beams will further arch such that the microactuator moves between a closed position in which the valve plate sealingly engages the valve opening and an open position in which the valve plate is at least partly disengaged from and does not seal the valve opening. The microactuator may further include metallization traces on distal portions of the arched beams to constrain the thermally actuated regions of arched beams to medial portions thereof. The valve may also include a latch for maintaining the valve plate in a desired position without requiring continuous energy input to the microactuator. An advantageous method for fabricating a MEMS valve having unitary structure single crystalline components is also provided.

    Abstract translation: 提供了一种微机电（MEMS）装置，其包括微电子基板和热致动微致动器以及设置在基板上并由单晶材料形成为单一结构的相关部件，其中相关联的部件由微致动器在其热致动时被致动 。 例如，MEMS器件可以是阀。 因此，阀可以包括至少一个阀板，该阀板通过选择性地致动微致动器而可控制地与微电子衬底中的至少一个阀开口接合。 虽然MEMS器件可以包括各种微致动器，微致动器有利地包括设置在基板上的一对间隔开的支撑件和在其间延伸的至少一个拱形梁。 通过加热微致动器的至少一个拱形梁，拱形梁将进一步拱起，使得微致动器在关闭位置之间移动，在该关闭位置中阀板密封地接合阀开口和打开位置，在该位置阀板至少部分地 与阀开口脱离并不密封。 微致动器还可以包括在拱形梁的远侧部分上的金属化迹线，以将拱形梁的热致动区域约束到其中间部分。 阀还可以包括用于将阀板保持在期望位置的闩锁，而不需要连续的能量输入到微致动器。 还提供了一种用于制造具有单一结构单晶组件的MEMS阀的有利方法。

    Microactuator for precisely aligning an optical fiber and an associated fabrication method
    3.
    发明授权
    Microactuator for precisely aligning an optical fiber and an associated fabrication method 失效
    用于精确对准光纤的微致动器和相关的制造方法

    公开(公告)号：US5870518A

    公开(公告)日：1999-02-09

    申请号：US916089

    申请日：1997-08-21

    Applicant: John M. Haake ,  Vijayakumar R. Dhuler ,  Robert L. Wood

    Inventor： John M. Haake ,  Vijayakumar R. Dhuler ,  Robert L. Wood

    IPC: G02B6/38 ,  G02B6/42 ,  G02B6/36

    CPC classification number: G02B6/4226 ,  G02B6/3803

    Abstract: A microactuator for precisely aligning an optical fiber with an optical device and an associated method of fabrication thereof. The microactuator includes a carrier positioned on a base for holding the optical fiber. An alignment frame positioned on the carrier remotely from the optical fiber is adapted to engage the base and the carrier. The carrier is movable relative to the base and the alignment frame. At least one actuator has a beam for engaging the alignment frame and a pad affixed to the carrier. The beam and pad move relative to each other when the actuator is actuated. The actuator is positioned on the carrier so that the beam engages and applies a force to the alignment frame in a predetermined direction when the actuator is actuated. This causes the pad to apply an opposite force to the carrier causing the carrier to move in a direction opposite the predetermined direction for controllably positioning the carrier relative to the base and precisely aligning the optical fiber with the optical device.

    Abstract translation: 一种用于将光纤与光学装置精确对准的微致动器及其制造方法。 微致动器包括位于基座上用于保持光纤的载体。 定位在远离光纤的载体上的对准框架适于接合基座和载体。 托架可相对于基座和对准框架移动。 至少一个致动器具有用于接合对准框架的梁和固定到托架的垫。 当致动器被致动时，梁和垫相对于彼此移动。 致动器定位在载体上，使得当致动器致动时，梁在预定方向上接合并向对准框架施加力。 这使得焊盘对载体施加相反的力，导致载体在与预定方向相反的方向上移动，以便相对于底座可控地定位载体，并将光纤与光学装置精确对准。

    Methods of fabricating in-plane MEMS thermal actuators
    4.
    发明授权
    Methods of fabricating in-plane MEMS thermal actuators 有权
    制造面内MEMS热致动器的方法

    公开(公告)号：US06410361B2

    公开(公告)日：2002-06-25

    申请号：US09777749

    申请日：2001-02-06

    Applicant: Vijayakumar R. Dhuler ,  Edward Hill ,  Allen Cowen

    Inventor： Vijayakumar R. Dhuler ,  Edward Hill ,  Allen Cowen

    IPC: H01L2100

    CPC classification number: F16K99/0001 ,  B81B3/0024 ,  B81B2201/031 ,  F03G7/06 ,  F15C5/00 ,  F16K99/0007 ,  F16K99/0036 ,  F16K99/0042 ,  F16K2099/0074 ,  F16K2099/008 ,  H01H1/0036 ,  H01H37/32 ,  H01H2037/008 ,  Y10S310/06

    Abstract: A MEMS thermal actuator device is provided that is capable of providing linear displacement in a plane generally parallel to the surface of a substrate. Additionally, the MEMS thermal actuator of the present invention may provide for a self-contained heating mechanism that allows for the thermal actuator to be actuated using lower power consumption and lower operating temperatures. The MEMS thermal actuator includes a microelectronic substrate having a first surface and at least one anchor structure affixed to the first surface. A composite beam extends from the anchor(s) and overlies the first surface of the substrate. The composite beam is adapted for thermal actuation, such that it will controllably deflect along a predetermined path that extends substantially parallel to the first surface of the microelectronic substrate. In one embodiment the composite beam comprises two or layers having materials that have correspondingly different thermal coefficients of expansion. As such, the layers will respond differently when thermal energy is supplied to the composite. An electrically conductive path may extend throughout the composite beam to effectuate thermal actuation. In one embodiment of the invention a two layer composite beam comprises a first layer of a semiconductor material and a second layer of a metallic material. The semiconductor material may be selectively doped during fabrication so as to create a self-contained heating mechanism within the composite beam. The invention also comprises a MEMS thermal actuator that includes two or more composite beams. The two or more composite beams may be disposed in an array or a ganged fashion, such that the multiple composite beams benefit from overall force multiplication and are therefore capable of greater and more linear displacement distances. The invention is also embodied in a method for fabricating the MEMS thermal actuators of the present invention.

    Abstract translation: 提供了一种MEMS热致动器装置，其能够在大致平行于衬底的表面的平面中提供线性位移。 此外，本发明的MEMS热致动器可以提供一种独立的加热机构，其允许使用较低的功率消耗和较低的工作温度来致动热致动器。 MEMS热致动器包括具有固定到第一表面的第一表面和至少一个锚定结构的微电子衬底。 复合梁从锚固体延伸并且覆盖在基底的第一表面上。 组合梁适于热致动，使得其可沿着基本上平行于微电子衬底的第一表面延伸的预定路径可控地偏转。 在一个实施例中，复合梁包括具有相应不同热膨胀系数的材料的两层或多层。 因此，当将热能提供给复合材料时，这些层将响应不同。 导电路径可延伸穿过复合梁，以实现热致动。 在本发明的一个实施例中，双层复合梁包括第一层半导体材料和第二层金属材料。 可以在制造期间选择性地掺杂半导体材料，以便在复合束内产生独立的加热机构。 本发明还包括包括两个或更多个复合梁的MEMS热致动器。 两个或多个复合梁可以以阵列或组合的方式设置，使得多个复合梁受益于总的力倍增，因此能够具有更大和更大的线性位移距离。 本发明还体现在本发明的MEMS热致动器的制造方法中。

    Microelectromechanical device having single crystalline components and metallic components
    5.
    发明授权
    Microelectromechanical device having single crystalline components and metallic components 有权
    具有单晶组分和金属组分的微机电装置

    公开(公告)号：US06291922B1

    公开(公告)日：2001-09-18

    申请号：US09383053

    申请日：1999-08-25

    Applicant: Vijayakumar R. Dhuler

    Inventor： Vijayakumar R. Dhuler

    IPC: H02N1000

    CPC classification number: H01H1/0036 ,  H01H59/0009 ,  H01H61/02 ,  H01H61/04 ,  H01H2001/0078 ,  H01H2061/006

    Abstract: A microelectromechanical (MEMS) device is provided that includes a microelectronic substrate, a microactuator disposed on the substrate and formed of a single crystalline material, and at least one metallic structure disposed on the substrate adjacent the microactuator such that the metallic structure is on substantially the same plane as the microactuator and is actuated thereby. For example, the MEMS device may be a microrelay. As such, the microrelay may include a pair of metallic structures that are controllably brought into contact by selective actuation of the microactuator. While the MEMS device can include various microactuators, one embodiment of the microactuator is a thermally actuated microactuator which advantageously includes a pair of spaced apart supports disposed on the substrate and at least one arched beam extending therebetween. By heating the at least one arched beam of the microactuator, the arched beams will further arch. In an alternate embodiment, the microactuator is an electrostatic microactuator which includes a stationary stator and a movable shuttle. Imposing an electrical bias between the stator and the shuttle causes the shuttle to move with respect to the stator. Thus, on actuation, the microactuator moves between a first position in which the microactuator is spaced apart from the at least one metallic structure to a second position in which the microactuator operably engages the at least one metallic structure. Several advantageous methods for fabricating a MEMS device having both single crystal components and metallic components are also provided.

    Abstract translation: 提供了一种微机电（MEMS）器件，其包括微电子衬底，设置在衬底上并由单晶材料形成的微致动器，以及至少一个金属结构，其布置在与微致动器相邻的衬底上，使得金属结构基本上在 与微致动器相同的平面并由此致动。 例如，MEMS器件可以是微型继电器。 因此，微型继电器可以包括通过微致动器的选择性致动可控制地接触的一对金属结构。 虽然MEMS器件可以包括各种微致动器，微致动器的一个实施例是热致动微致动器，其有利地包括设置在基板上的一对间隔开的支撑件和在其间延伸的至少一个拱形梁。 通过加热微致动器的至少一个拱形梁，拱形梁将进一步拱形。 在另一个实施例中，微型致动器是静电微型致动器，其包括固定式定子和可移动梭。 在定子和梭之间施加电偏压使梭子相对于定子移动。 因此，在致动时，微致动器在其中微致动器与至少一个金属结构间隔开的第一位置移动到第二位置，在第二位置，微致动器可操作地接合至少一个金属结构。 还提供了用于制造具有单晶组件和金属部件的MEMS器件的几种有利方法。

    High frequency tunable capacitors
    6.
    发明授权
    High frequency tunable capacitors 有权
    高频可调电容器

    公开(公告)号：US06215644B1

    公开(公告)日：2001-04-10

    申请号：US09392987

    申请日：1999-09-09

    Applicant: Vijayakumar R. Dhuler

    Inventor： Vijayakumar R. Dhuler

    IPC: H01G700

    CPC classification number: H01G5/16

    Abstract: A tunable capacitor having low loss and a corresponding high Q is provided. The tunable capacitor includes first and second substrates having first and second capacitor plates disposed, respectively, thereon. The capacitor plates may include a high temperature superconductor material. A MEMS actuator, that is either driven by electrostatic force, heat or both, operably contacts the second substrate so that once the actuator is engaged it responds by displacing the second substrate, thereby varying the capacitance between said first capacitor plate and said second capacitor plate. As such, the capacitance can be controlled based upon the relative spacing between the first and second capacitor plates. The MEMS actuator may either be operably attached to the second substrate or detached, yet supporting, the second substrate.

    Abstract translation: 提供具有低损耗和相应高Q的可调谐电容器。 可调谐电容器包括分别设置在其上的第一和第二电容器板的第一和第二基板。 电容器板可以包括高温超导体材料。 由静电力，热或两者驱动的MEMS致动器可操作地接触第二基板，使得一旦致动器接合，则通过移动第二基板来响应，由此改变所述第一电容器板和所述第二电容器板之间的电容 。 因此，可以基于第一和第二电容器板之间的相对间隔来控制电容。 MEMS致动器可以可操作地附接到第二基板或者分离，而是支撑第二基板。

    Thermal arched beam microelectromechanical actuators
    8.
    发明授权
    Thermal arched beam microelectromechanical actuators 失效
    热拱形梁微机电执行机构

    公开(公告)号：US5909078A

    公开(公告)日：1999-06-01

    申请号：US767192

    申请日：1996-12-16

    Applicant: Robert L. Wood ,  Vijayakumar R. Dhuler

    Inventor： Robert L. Wood ,  Vijayakumar R. Dhuler

    IPC: B81B3/00 ,  F03G7/06 ,  G02B6/38 ,  G02B6/42 ,  H01H1/00 ,  H01H9/14 ,  H01H61/00 ,  H02N11/00 ,  F01L1/00 ,  H01G7/00

    CPC classification number: F03G7/06 ,  B81B3/0024 ,  B81B2201/031 ,  B81B2201/054 ,  B81B2203/0109 ,  B81B2203/051 ,  G02B6/3803 ,  G02B6/4226 ,  H01H1/0036 ,  H01H2001/0042 ,  H01H2001/0068 ,  H01H2061/006 ,  H01H61/00 ,  H01H9/14

    Abstract: Microelectromechanical actuators include at least one arched beam which extends between spaced apart supports on a microelectronic substrate. The arched beams are arched in a predetermined direction and expand upon application of heat thereto. A coupler mechanically couples the plurality of arched beams between the spaced apart supports. Heat is applied to at least one of the arched beams to cause further arching as a result of thermal expansion thereof, and thereby cause displacement of the coupler along the predetermined direction. Internal heating of the arched beams by passing current through the arched beams may be used. External heating sources may also be used. The coupler may be attached to a capacitor plate to provide capacitive sensors such as flow sensors. The coupler may also be attached to a valve plate to provide microvalves. Compensating arched beams may be used to provide ambient temperature insensitivity.

    Abstract translation: 微机电致动器包括至少一个拱形梁，其在微电子衬底上的间隔开的支撑件之间延伸。 拱形梁在预定方向上拱形并且在施加热量时膨胀。 耦合器在间隔开的支撑件之间机械耦合多个拱形梁。 对至少一个拱形梁施加热量，由于其热膨胀而导致进一步的拱起，从而引起联接器沿着预定方向的位移。 可以使用通过拱形梁使电流通过拱形梁的内部加热。 也可以使用外部加热源。 耦合器可以附接到电容器板以提供诸如流量传感器的电容式传感器。 联接器还可以附接到阀板以提供微型阀。 补偿拱形梁可用于提供环境温度不敏感性。

    Microelectromechanical actuators including driven arched beams for mechanical advantage
    9.
    发明授权
    Microelectromechanical actuators including driven arched beams for mechanical advantage 失效
    微机电致动器包括驱动的拱形梁，用于机械优点

    公开(公告)号：US06360539B1

    公开(公告)日：2002-03-26

    申请号：US09542672

    申请日：2000-04-05

    Applicant: Edward A. Hill ,  Vijayakumar R. Dhuler ,  Allen B. Cowen ,  Ramaswamy Mahadevan ,  Robert L. Wood

    Inventor： Edward A. Hill ,  Vijayakumar R. Dhuler ,  Allen B. Cowen ,  Ramaswamy Mahadevan ,  Robert L. Wood

    IPC: F01B2910

    CPC classification number: H01H1/0036 ,  H01H61/02 ,  H01H2061/006

    Abstract: Microelectromechanical actuators include a substrate, spaced apart supports on the substrate and a thermal arched beam that extends between the spaced apart supports and that further arches upon heating thereof, for movement along the substrate. One or more driven arched beams are coupled to the thermal arched beam. The end portions of the driven arched beams move relative to one another to change the arching of the driven arched beams in response to the further arching of the thermal arched beam, for movement of the driven arched beams. A driven arched beam also includes an actuated element at an intermediate portion thereof between the end portions, wherein a respective actuated element is mechanically coupled to the associated driven arched beam for movement therewith, and is mechanically decoupled from the remaining driven arched beams for movement independent thereof.

    Abstract translation: 微机电致动器包括衬底，衬底上的间隔开的支撑件和在间隔开的支撑件之间延伸的热拱形梁，并且在其加热时进一步拱形地沿着衬底运动。 一个或多个被驱动的弓形梁联接到热拱形梁。 被驱动的拱形梁的端部相对于彼此移动，以响应于热拱形梁的进一步拱形来改变被驱动的弓形梁的拱形，以便驱动的拱形梁的运动。 被驱动的弓形梁还包括在其端部之间的中间部分处的致动元件，其中相应的致动元件机械地联接到相关联的被驱动的弓形梁以与其一起运动，并且与剩余的被驱动的弓形梁机械地分离以便独立运动 其中。

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