摘要:
A semiconductor package is provided. The semiconductor includes a lower package and an upper package stacked on the lower package. The lower package includes a package substrate, a semiconductor chip, a mold layer and a residential stress layer. The package substrate has upper and lower surfaces. The semiconductor chip is disposed on the upper surface of the package substrate. The mold layer encapsulates the semiconductor chip. The residual stress layer is disposed on the semiconductor chip. The residual stress layer includes a plastically deformed surface. The residual stress layer has a residual stress to counterbalance warpage of the lower package.
摘要:
A variable resistance memory device includes upper interconnections on a substrate, first and second word lines provided between the substrate and the upper interconnections and vertically spaced apart from each other, a first bit line disposed between the first and second word lines and intersecting the first and second word lines, memory cells provided in an intersecting region of the first word line and the first bit line and an intersecting region of the second word line and the first bit line, a first word line contact directly connecting the first word line to a corresponding one of the upper interconnections, and a second word line contact directly connecting the second word line to a corresponding one of the upper interconnections.
摘要:
A vacuum insulation material includes a core material, and a wrapping member configured to wrap the core material, wherein the wrapping member comprises an outermost layer externally exposed, a barrier layer located beneath the outermost layer and having at least two laminated polymer layers, each polymer layer having an inorganic layer metalized thereon, and a thermal bonding layer located beneath the barrier layer and contacting the core material, wherein the inorganic layers metalized on the polymer layers, respectively, are separated from each other, at least one of the inorganic layers being more than 600 Å in thickness.
摘要:
A core of a vacuum insulation member and a vacuum insulation member using the same are disclosed. The core of a vacuum insulation member includes: a plurality of plates which are spaced apart from each other; and a support member supporting the plurality of plates between the plates.
摘要:
Disclosed are a method for fabricating a core of a vacuum insulation panel, a core of a vacuum insulation panel, and a vacuum insulation panel having the core. The core is positioned at an inner side of an envelope of a vacuum insulation member, which is formed by bonding synthetic resin material fibers through thermal bonding.
摘要:
A semiconductor package is disclosed. The semiconductor package comprises a lower package including a first substrate and a semiconductor chip on the first substrate, a second substrate on the lower package, interconnect terminals between the first substrate and the second substrate, and an adhesive pattern between a top surface of the semiconductor chip and a bottom surface of the second substrate. The adhesive pattern extends along an edge of the semiconductor chip. The adhesive pattern exposes a top surface of a central zone of the semiconductor chip.
摘要:
A variable resistance memory device includes upper interconnections on a substrate, first and second word lines provided between the substrate and the upper interconnections and vertically spaced apart from each other, a first bit line disposed between the first and second word lines and intersecting the first and second word lines, memory cells provided in an intersecting region of the first word line and the first bit line and an intersecting region of the second word line and the first bit line, a first word line contact directly connecting the first word line to a corresponding one of the upper interconnections, and a second word line contact directly connecting the second word line to a corresponding one of the upper interconnections.
摘要:
Disclosed is a vacuum insulation member having a uniform insulation thickness, a refrigerator having a vacuum insulation member, and a method for fabricating a vacuum insulation member. The vacuum insulation member includes: an envelope having gas impermeability and having a certain decompressed space therein; and a core including a plurality of laminated mesh members to support the envelope at an outer side of the envelope.
摘要:
A core of a vacuum insulation member and a vacuum insulation member using the same are disclosed. The core of a vacuum insulation member includes: a plurality of plates which are spaced apart from each other; and a support member supporting the plurality of plates between the plates.
摘要:
Disclosed are a vacuum insulation member, a refrigerator having a vacuum insulation member, and a method for fabricating a vacuum insulation member. The vacuum insulation member includes: an envelope having gas impermeability and having a certain decompressed space therein; and a core having a certain shape, having an empty space formed therein, and disposed at an inner side of the envelope to support the envelope. The use of a glass fiber core can be avoided, and thus, employing equipment for preprocessing the glass fiber core and time required therefor can be restrained and fabrication can be facilitated.