公开(公告)号：US20140374892A1

公开(公告)日：2014-12-25

申请号：US13924623

申请日：2013-06-24

申请人： Yit Meng Lee ,  Yin Kheng Au ,  Quentin D. Gunn

发明人： Yit Meng Lee ,  Yin Kheng Au ,  Quentin D. Gunn

IPC分类号： H01L23/495 ,  H01L23/00

CPC分类号： H01L24/97 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/06 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/49179 ,  H01L2224/73265 ,  H01L2224/78251 ,  H01L2224/83005 ,  H01L2224/85005 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A lead frame for a semiconductor device has a die pad for supporting a semiconductor die and intermediate lead fingers extending from a periphery of the package towards the die pad, and each having a bonding end near the die pad. Outer lead fingers are located adjacent respective tie bars edges, each outer lead finger extending from the periphery of the package towards the die pad. Each outer lead finger has a transverse region coupling two spaced longitudinal regions. The two spaced longitudinal regions each have a bonding region near the die pad. A semiconductor die is attached to the die pad and bond wires electrically couple connection pads of the semiconductor die to the bonding regions of each outer lead finger. Only one of the bond wires is bonded to the bonding region of the second longitudinal region.

摘要翻译： 用于半导体器件的引线框架具有用于支撑半导体管芯的管芯焊盘和从封装的周边朝向管芯焊盘延伸的中间引线指，并且每个引线框架具有靠近管芯焊盘的接合端。 外引线指位于相邻的连接条边缘附近，每个外引线指从封装的周边延伸到管芯焊盘。 每个外部引导指具有耦合两个间隔开的纵向区域的横向区域。 两个间隔开的纵向区域各自具有靠近管芯焊盘的接合区域。 将半导体管芯附接到管芯焊盘，并且将引线将半导体管芯的连接焊盘电耦合到每个外引线指的接合区域。 只有一个接合线接合到第二纵向区域的接合区域。

公开(公告)号：US20120073859A1

公开(公告)日：2012-03-29

申请号：US12889428

申请日：2010-09-24

申请人： Wai Yew Lo ,  Yit Meng Lee ,  Lan Chu Tan

发明人： Wai Yew Lo ,  Yit Meng Lee ,  Lan Chu Tan

IPC分类号： H01B5/14 ,  B05D5/12 ,  H01B13/00 ,  C25D5/54

CPC分类号： H01L24/745 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/4519 ,  H01L2224/45193 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/456 ,  H01L2224/45624 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/745 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754

摘要： A wire capable of conducting electrical current has a polymer core and a coating layer surrounding the core. The coating layer, which may be, for example, gold or copper, conducts electrical current and the core provides strength so that the wire is able to withstand bending and breakage. Among other things, the polymer core wire is useful for connecting an integrated circuit to a lead frame or substrate.

摘要翻译： 能够导电的线具有聚合物芯和围绕芯的涂层。 可以是例如金或铜的涂层传导电流，并且芯提供强度，使得电线能够承受弯曲和断裂。 其中，聚合物芯线可用于将集成电路连接到引线框架或基板。

公开(公告)号：US07989965B2

公开(公告)日：2011-08-02

申请号：US12504654

申请日：2009-07-16

申请人： Vittal Raja Manikam ,  Yit Meng Lee ,  Vemal Raja Manikam

发明人： Vittal Raja Manikam ,  Yit Meng Lee ,  Vemal Raja Manikam

IPC分类号： H01L21/56 ,  B05C11/08

CPC分类号： H01L21/563 ,  H01L24/743 ,  H01L2224/73203 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/351 ,  Y10T29/49146 ,  H01L2924/00

摘要： A system for dispensing an underfill material between an integrated circuit (IC) chip and a substrate includes a platform at which the underfill material is supplied. The IC chip and the substrate are mounted at the periphery of the platform. The platform rotates and facilitates the movement of the underfill material toward the IC chip and the substrate. The system further includes a Bernoulli tube that is located proximate to the IC chip and the substrate. The Bernoulli tube generates a low pressure in the proximity of the IC packages. The low pressure facilitates the dispensing of the underfill material between the IC chip and the substrate.

摘要翻译： 用于在集成电路（IC）芯片和基板之间分配底部填充材料的系统包括供给底部填充材料的平台。 IC芯片和基板安装在平台的周边。 平台旋转并促进底部填充材料向IC芯片和基板的移动。 该系统还包括位于IC芯片和基板附近的伯努利管。 伯努利管在IC封装附近产生低压。 低压有助于在IC芯片和基板之间分配底部填充材料。

公开(公告)号：US20100279471A1

公开(公告)日：2010-11-04

申请号：US12504654

申请日：2009-07-16

申请人： Vittal Raja MANIKAM ,  Yit Meng LEE ,  Vemal Raja MANIKAM

发明人： Vittal Raja MANIKAM ,  Yit Meng LEE ,  Vemal Raja MANIKAM

IPC分类号： H01L21/56 ,  B05C11/08

CPC分类号： H01L21/563 ,  H01L24/743 ,  H01L2224/73203 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/351 ,  Y10T29/49146 ,  H01L2924/00

摘要： A system for dispensing an underfill material between an integrated circuit (IC) chip and a substrate includes a platform at which the underfill material is supplied. The IC chip and the substrate are mounted at the periphery of the platform. The platform rotates and facilitates the movement of the underfill material toward the IC chip and the substrate. The system further includes a Bernoulli tube that is located proximate to the IC chip and the substrate. The Bernoulli tube generates a low pressure in the proximity of the IC packages. The low pressure facilitates the dispensing of the underfill material between the IC chip and the substrate.

摘要翻译： 用于在集成电路（IC）芯片和基板之间分配底部填充材料的系统包括供给底部填充材料的平台。 IC芯片和基板安装在平台的周边。 平台旋转并促进底部填充材料向IC芯片和基板的移动。 该系统还包括位于IC芯片和基板附近的伯努利管。 伯努利管在IC封装附近产生低压。 低压有助于在IC芯片和基板之间分配底部填充材料。