公开(公告)号：US07741610B2

公开(公告)日：2010-06-22

申请号：US11933497

申请日：2007-11-01

申请人： Konstantinos Spartiotis ,  Tom Schulman ,  Tuomas Pantsar

发明人： Konstantinos Spartiotis ,  Tom Schulman ,  Tuomas Pantsar

IPC分类号： H01L27/146

CPC分类号： H01L31/02005 ,  H01L27/14636 ,  H01L27/14676 ,  H01L31/022408 ,  H01L31/0296 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/4519 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076

摘要： A CdTe or CdZnTe radiation imaging detector and high voltage bias part for applying a high voltage to the continuous electrode to ensure stable performance of the detector. The high voltage bias part includes conductors of >30 um diameter and preferably selected from a group of materials that do not oxidize easily or oxidize less than aluminium.

摘要翻译： 用于向连续电极施加高电压的CdTe或C​​dZnTe辐射成像检测器和高电压偏压部件，以确保检测器的稳定性能。 高压偏压部分包括>30μm直径的导体，并且优选地选自不易氧化或少于铝氧化的材料组。

公开(公告)号：US20090114831A1

公开(公告)日：2009-05-07

申请号：US11933497

申请日：2007-11-01

申请人： KONSTANTINOS SPARTIOTIS ,  TOM SCHULMAN ,  TUOMAS PANTSAR

发明人： KONSTANTINOS SPARTIOTIS ,  TOM SCHULMAN ,  TUOMAS PANTSAR

IPC分类号： H01L31/02 ,  H01L31/0296

CPC分类号： H01L31/02005 ,  H01L27/14636 ,  H01L27/14676 ,  H01L31/022408 ,  H01L31/0296 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/4519 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076

摘要： A CdTe or CdZnTe radiation imaging detector and high voltage bias part for applying a high voltage to the continuous electrode to ensure stable performance of the detector. The high voltage bias part includes conductors of >30 um diameter and preferably selected from a group of materials that do not oxidize easily or oxidize less than aluminium.

摘要翻译： 用于向连续电极施加高电压的CdTe或C​​dZnTe辐射成像检测器和高电压偏压部件，以确保检测器的稳定性能。 高压偏压部分包括>30μm直径的导体，并且优选地选自不易氧化或少于铝氧化的材料组。

公开(公告)号：US08258011B2

公开(公告)日：2012-09-04

申请号：US12452137

申请日：2008-06-20

申请人： Jean Brun ,  Bruno Mourey ,  Dominique Vicard

发明人： Jean Brun ,  Bruno Mourey ,  Dominique Vicard

IPC分类号： H01L21/44

CPC分类号： H01L25/50 ,  G06K19/07718 ,  G06K19/07754 ,  G06K19/07779 ,  G06K19/07786 ,  H01L21/6835 ,  H01L23/5387 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L24/94 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/24137 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/4519 ,  H01L2224/48139 ,  H01L2224/8585 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  Y10T29/49016 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The method relates to production of a set of chips mechanically interconnected by means of a flexible connection. The chips, integrated on a substrate, each comprise a receiving area. The chips of the set are connected in series in the receiving areas by a connecting element. The chips are then released, the connecting element forming a flexible connection.

摘要翻译： 该方法涉及通过柔性连接机械地互连的一组芯片的生产。 集成在基板上的芯片各自包括接收区域。 组合的芯片通过连接元件串联连接在接收区域中。 芯片然后被释放，连接元件形成柔性连接。

公开(公告)号：US20120073859A1

公开(公告)日：2012-03-29

申请号：US12889428

申请日：2010-09-24

申请人： Wai Yew Lo ,  Yit Meng Lee ,  Lan Chu Tan

发明人： Wai Yew Lo ,  Yit Meng Lee ,  Lan Chu Tan

IPC分类号： H01B5/14 ,  B05D5/12 ,  H01B13/00 ,  C25D5/54

CPC分类号： H01L24/745 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/4519 ,  H01L2224/45193 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/456 ,  H01L2224/45624 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/745 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754

摘要： A wire capable of conducting electrical current has a polymer core and a coating layer surrounding the core. The coating layer, which may be, for example, gold or copper, conducts electrical current and the core provides strength so that the wire is able to withstand bending and breakage. Among other things, the polymer core wire is useful for connecting an integrated circuit to a lead frame or substrate.

摘要翻译： 能够导电的线具有聚合物芯和围绕芯的涂层。 可以是例如金或铜的涂层传导电流，并且芯提供强度，使得电线能够承受弯曲和断裂。 其中，聚合物芯线可用于将集成电路连接到引线框架或基板。

公开(公告)号：US07417324B2

公开(公告)日：2008-08-26

申请号：US11075442

申请日：2005-03-09

申请人： Tomochika Obiya

发明人： Tomochika Obiya

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L24/48 ,  H01L24/05 ,  H01L24/45 ,  H01L24/50 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4519 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/4848 ,  H01L2224/48482 ,  H01L2224/48499 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01202 ,  H01L2924/01204 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/01026 ,  H01L2924/01004 ,  H01L2924/00014 ,  H01L2924/00011 ,  H01L2224/85186 ,  H01L2224/45644 ,  H01L2224/48483 ,  H01L2924/00 ,  H01L2224/78 ,  H01L2924/00012 ,  H01L2924/00015

摘要： A semiconductor device is composed of a semiconductor chip, aluminum pads formed on the semiconductor chip, alloy ball bumps, which are formed on the aluminum pads, containing gold and Pd, and gold wires, which are connected to the alloy ball bumps, having a surface made of gold. The alloy ball bumps may be composition containing gold not less than 98 mass % to not more than 99.5 mass % and palladium not less than 0.5 mass % to not more than 2 mass %. The semiconductor device having above configuration is excellent in long-term reliability.

摘要翻译： 半导体器件由半导体芯片，形成在半导体芯片上的铝焊盘，形成在包含金和Pd的铝焊盘上的合金球凸块和连接到合金球凸块的金线组成，具有 金表面。 合金球凸点可以是含有不低于98质量％至不大于99.5质量％的金和不小于0.5质量％至不超过2质量％的钯的组合物。 具有上述结构的半导体器件具有优异的长期可靠性。

公开(公告)号：US06794760B1

公开(公告)日：2004-09-21

申请号：US10656413

申请日：2003-09-05

申请人： Edward Jaeck ,  Ronald I. Spreitzer ,  Robert M. Nickerson ,  Lesley A. Polka

发明人： Edward Jaeck ,  Ronald I. Spreitzer ,  Robert M. Nickerson ,  Lesley A. Polka

IPC分类号： H01L2940

CPC分类号： H01L24/49 ,  H01L23/66 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05553 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/45013 ,  H01L2224/45015 ,  H01L2224/45025 ,  H01L2224/45028 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4519 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2924/00011 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049

摘要： A system may include an integrated circuit die, a package, and an interconnect. The integrated circuit die may include a conductive die pad, the package may include a conductive package pad, and the interconnect may include two or more stranded wires. A first end of the interconnect is electrically coupled to the conductive die pad, and a second end of the interconnect is electrically coupled to the package pad.

摘要翻译： 系统可以包括集成电路管芯，封装和互连。 集成电路管芯可以包括导电管芯焊盘，封装可以包括导电封装焊盘，并且互连可以包括两条或更多条绞线。 互连的第一端电耦合到导电管芯焊盘，并且互连的第二端电耦合到封装焊盘。

公开(公告)号：US20100245182A1

公开(公告)日：2010-09-30

申请号：US12665419

申请日：2008-06-18

申请人： Dominique Vicard ,  Jean Brun ,  Benoit Lepine

发明人： Dominique Vicard ,  Jean Brun ,  Benoit Lepine

IPC分类号： H01Q1/24 ,  H01L21/98

CPC分类号： H01L25/50 ,  G06K19/07718 ,  G06K19/07754 ,  G06K19/07779 ,  G06K19/07786 ,  H01L21/6835 ,  H01L23/5387 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L24/94 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/24137 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/4519 ,  H01L2224/48139 ,  H01L2224/8585 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  Y10T29/49016 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The invention relates to the fabrication of radiofrequency transmission/reception devices. The invention makes provision for: the making of radiofrequency transmission/reception chips devoid of antennas; the connecting in series of the chips by at least two conducting wire elements whose respective lengths between two neighboring chips are chosen as a function of the transmission/reception frequency, each element contacting electrically at least one terminal of a chip and ensuring an at least temporary function of mechanical holding of the chips chainwise; and the cutting at regular intervals of the serial connection to form, for each chip, two strands of an antenna of the device.

摘要翻译： 本发明涉及射频发送/接收设备的制造。 本发明提供：制造没有天线的射频发送/接收芯片; 通过至少两个导线元件连接芯片的串联，其中两个相邻芯片之间的相应长度被选择为发射/接收频率的函数，每个元件电接触芯片的至少一个端子并确保至少临时 机械夹持芯片的功能; 并且以规则的间隔对串行连接进行切割，以便为每个芯片形成设备的天线的两股。

公开(公告)号：US20050200015A1

公开(公告)日：2005-09-15

申请号：US11075442

申请日：2005-03-09

申请人： Tomochika Obiya

发明人： Tomochika Obiya

IPC分类号： H01L21/60 ,  H01L23/48

CPC分类号： H01L24/48 ,  H01L24/05 ,  H01L24/45 ,  H01L24/50 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4519 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/4848 ,  H01L2224/48482 ,  H01L2224/48499 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01202 ,  H01L2924/01204 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/01026 ,  H01L2924/01004 ,  H01L2924/00014 ,  H01L2924/00011 ,  H01L2224/85186 ,  H01L2224/45644 ,  H01L2224/48483 ,  H01L2924/00 ,  H01L2224/78 ,  H01L2924/00012 ,  H01L2924/00015

摘要： A semiconductor device is composed of a semiconductor chip, aluminum pads formed on the semiconductor chip, alloy ball bumps, which are formed on the aluminum pads, containing gold and Pd, and gold wires, which are connected to the alloy ball bumps, having a surface made of gold. The alloy ball bumps may be composition containing gold not less than 98 mass % to not more than 99.5 mass % and palladium not less than 0.5 mass % to not more than 2 mass %. The semiconductor device having above configuration is excellent in long-term reliability.

摘要翻译： 半导体器件由半导体芯片，形成在半导体芯片上的铝焊盘，形成在包含金和Pd的铝焊盘上的合金球凸块和连接到合金球凸块的金线组成，具有 金表面。 合金球凸点可以是含有不低于98质量％至不大于99.5质量％的金和不小于0.5质量％至不超过2质量％的钯的组合物。 具有上述结构的半导体器件具有优异的长期可靠性。

公开(公告)号：US08471773B2

公开(公告)日：2013-06-25

申请号：US12665419

申请日：2008-06-18

申请人： Dominique Vicard ,  Jean Brun ,  Benoît Lepine

发明人： Dominique Vicard ,  Jean Brun ,  Benoît Lepine

IPC分类号： H01Q1/24

CPC分类号： H01L25/50 ,  G06K19/07718 ,  G06K19/07754 ,  G06K19/07779 ,  G06K19/07786 ,  H01L21/6835 ,  H01L23/5387 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L24/94 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/24137 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/4519 ,  H01L2224/48139 ,  H01L2224/8585 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  Y10T29/49016 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The invention relates to the fabrication of radiofrequency transmission/reception devices. The invention makes provision for: the making of radiofrequency transmission/reception chips devoid of antennas; the connecting in series of the chips by at least two conducting wire elements whose respective lengths between two neighboring chips are chosen as a function of the transmission/reception frequency, each element contacting electrically at least one terminal of a chip and ensuring an at least temporary function of mechanical holding of the chips chainwise; and the cutting at regular intervals of the serial connection to form, for each chip, two strands of an antenna of the device.

摘要翻译： 本发明涉及射频发送/接收设备的制造。 本发明提供：制造没有天线的射频发送/接收芯片; 通过至少两个导线元件连接芯片的串联，其中两个相邻芯片之间的相应长度被选择为发射/接收频率的函数，每个元件电接触芯片的至少一个端子并确保至少临时 机械夹持芯片的功能; 并且以规则的间隔对串行连接进行切割，以便为每个芯片形成设备的天线的两股。

公开(公告)号：US20100136746A1

公开(公告)日：2010-06-03

申请号：US12452137

申请日：2008-06-20

申请人： Jean Brun ,  Bruno Mourey ,  Dominique Vicard

发明人： Jean Brun ,  Bruno Mourey ,  Dominique Vicard

IPC分类号： H01L21/60

CPC分类号： H01L25/50 ,  G06K19/07718 ,  G06K19/07754 ,  G06K19/07779 ,  G06K19/07786 ,  H01L21/6835 ,  H01L23/5387 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L24/94 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/24137 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/4519 ,  H01L2224/48139 ,  H01L2224/8585 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  Y10T29/49016 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The method relates to production of a set of chips mechanically interconnected by means of a flexible connection. The chips, integrated on a substrate, each comprise a receiving area. The chips of the set are connected in series in the receiving areas by a connecting element. The chips are then released, the connecting element forming a flexible connection.

摘要翻译： 该方法涉及通过柔性连接机械地互连的一组芯片的生产。 集成在基板上的芯片各自包括接收区域。 组合的芯片通过连接元件串联连接在接收区域中。 芯片然后被释放，连接元件形成柔性连接。