公开(公告)号：US08982567B2

公开(公告)日：2015-03-17

申请号：US13678115

申请日：2012-11-15

申请人： Hyo-Jae Bang ,  Dogeun Kim ,  Hongkyun Kim ,  Youngbok Jeon

发明人： Hyo-Jae Bang ,  Dogeun Kim ,  Hongkyun Kim ,  Youngbok Jeon

IPC分类号： H05K1/14 ,  H05K1/11 ,  G06K7/00 ,  H01R12/57 ,  H01R12/50 ,  H01R13/00 ,  H05K3/10 ,  H05K3/30 ,  H05K7/02 ,  H05K13/00 ,  H01R27/00 ,  H05K1/02 ,  H05K3/34

CPC分类号： H05K5/0026 ,  G06F1/18 ,  G06F1/185 ,  G06K7/0047 ,  H01R12/57 ,  H01R12/721 ,  H01R13/00 ,  H01R23/70 ,  H01R27/00 ,  H05K1/0295 ,  H05K1/11 ,  H05K1/117 ,  H05K1/181 ,  H05K3/10 ,  H05K3/303 ,  H05K3/3405 ,  H05K7/02 ,  H05K13/00 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/09954 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10446 ,  Y10S439/946 ,  Y10S439/951 ,  Y10T29/49124 ,  Y10T29/49147

摘要： Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors. According to example embodiments, a solid state device (SSD) may include a circuit board, a connector, and a case. The circuit board may include a unibody board common to at least a first and a second form factor, first circuit board connection terminals of the first form factor on a front side of the board, and second circuit board connection terminals of the second form factor on a back side of the board. The connector may include connector connection terminals, where only one of the first circuit board connection terminals and the second circuit board connection terminals are connected to the connector connection terminals.

摘要翻译： 示例性实施例涉及电路板，连接器，外壳，电路板组件，壳体组件，其制造方法及其制造方法，这对于至少两种不同的形状因子是共同的。 根据示例性实施例，固态设备（SSD）可以包括电路板，连接器和外壳。 电路板可以包括至少第一和第二形状因子共同的一体板，在板的正面上的第一形状因子的第一电路板连接端子和第二形状因子的第二电路板连接端子 董事会的背面。 连接器可以包括连接器连接端子，其中仅一个第一电路板连接端子和第二电路板连接端子连接到连接器连接端子。

公开(公告)号：US20110256671A1

公开(公告)日：2011-10-20

申请号：US13169663

申请日：2011-06-27

申请人： Hyun-Seok CHOI ,  Hyung-Mo Hwang ,  Yong-Hyun Kim ,  Hyo-Jae Bang ,  Su-Yong An

发明人： Hyun-Seok CHOI ,  Hyung-Mo Hwang ,  Yong-Hyun Kim ,  Hyo-Jae Bang ,  Su-Yong An

IPC分类号： H01L21/58

CPC分类号： H05K3/3442 ,  H05K1/111 ,  H05K1/181 ,  H05K3/06 ,  H05K3/244 ,  H05K2201/09736 ,  H05K2201/10477 ,  H05K2201/10636 ,  H05K2203/0369 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49133

摘要： A semiconductor memory module having a reverse mounted chip resistor, and a method of fabricating the same are provided. By reverse mounting the chip resistor on the semiconductor memory module, the resistive material is protected, thereby preventing open circuits caused by damage to the resistive material. Also, a chip-resistor connection pad of a module substrate is formed to extend higher from the module substrate than other connection pads connected to other elements. Thus, the resistive material of the chip resistor does not contact the module substrate, thereby preventing poor alignment and defective connections.

摘要翻译： 提供了具有反向安装的芯片电阻器的半导体存储器模块及其制造方法。 通过将芯片电阻器反向安装在半导体存储器模块上，电阻材料被保护，从而防止由电阻材料损坏引起的开路。 此外，模块基板的芯片电阻器连接焊盘形成为从与其它元件连接的其它连接焊盘相比，从模块基板延伸得更高。 因此，片式电阻器的电阻材料不与模块基板接触，从而防止对准不良和连接不良。

公开(公告)号：US20100105201A1

公开(公告)日：2010-04-29

申请号：US12650093

申请日：2009-12-30

申请人： Hyo-Jae Bang ,  Heui-Seog Kim ,  Dong-Chun Lee ,  Seong-Chan Han ,  Jung-Hyeon Kim

发明人： Hyo-Jae Bang ,  Heui-Seog Kim ,  Dong-Chun Lee ,  Seong-Chan Han ,  Jung-Hyeon Kim

IPC分类号： H01L21/60

CPC分类号： H05K3/303 ,  H05K2201/0305 ,  H05K2201/09781 ,  H05K2201/10689 ,  H05K2201/2036 ,  Y02P70/613

摘要： A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.

摘要翻译： 半导体器件包括半导体封装，电路板和间隔保持元件。 半导体封装具有从主体突出的主体和引线。 电路板具有与引线电连接的第一焊盘。 间隔保持构件插入在电路板和主体之间。 间隔保持构件保持引线与第一焊盘之间的间隔。 因此，均匀地保持引线和焊盘之间的间隔，从而提高了半导体器件的热和/或机械可靠性。

公开(公告)号：US20090129041A1

公开(公告)日：2009-05-21

申请号：US12232990

申请日：2008-09-26

申请人： Jung-Chan Cho ,  Yang-Je Lee ,  Hyun-Seok Choi ,  Yong-Hyun Kim ,  Jung-Hyeon Kim ,  Hyo-Jae Bang ,  Do-Hyung Kim ,  Kyoung-Sun Kim ,  Young-Ho Lee ,  Jae-Sang Baik ,  Yong-Jin Kim

发明人： Jung-Chan Cho ,  Yang-Je Lee ,  Hyun-Seok Choi ,  Yong-Hyun Kim ,  Jung-Hyeon Kim ,  Hyo-Jae Bang ,  Do-Hyung Kim ,  Kyoung-Sun Kim ,  Young-Ho Lee ,  Jae-Sang Baik ,  Yong-Jin Kim

IPC分类号： H05K1/14 ,  H05K1/00 ,  H05K7/10

CPC分类号： H05K1/147 ,  H05K1/117 ,  H05K1/189 ,  H05K3/323 ,  H05K3/361 ,  H05K3/4691 ,  H05K2201/042 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/0949 ,  H05K2201/10159 ,  H05K2203/1572

摘要： A stacked semiconductor module, a method of fabricating the same, and an electronic system using the module are provided. A first semiconductor module having a plurality of semiconductor devices mounted on a rigid printed circuit board (PCB) and a second semiconductor module having a plurality of other semiconductor devices mounted on a flexible PCB are provided. On the rigid PCB a number L of first tabs may be disposed on a first surface, and a number K of second tabs may be disposed on a second surface of the rigid PCB. The flexible PCB may have a number M of third tabs on a third surface, and a number N of fourth tabs on a fourth surface of the flexible PCB. The second tabs may be combined with the third tabs using a conductive adhesive. The third tabs may be electrically connected to corresponding ones of the second tabs.

摘要翻译： 提供堆叠半导体模块，其制造方法和使用该模块的电子系统。 提供了具有安装在刚性印刷电路板（PCB）上的多个半导体器件和具有安装在柔性PCB上的多个其它半导体器件的第二半导体模块的第一半导体模块。 在刚性PCB上，可以在第一表面上设置数L个第一突出部，并且可以在刚性PCB的第二表面上设置数个K个第二突片。 柔性PCB可以在第三表面上具有数量M的第三突出部，并且在柔性PCB的第四表面上可以具有数目N的第四突出部。 第二突片可以使用导电粘合剂与第三突片组合。 第三突片可以电连接到相应的第二突片。

公开(公告)号：US08385079B2

公开(公告)日：2013-02-26

申请号：US12624552

申请日：2009-11-24

申请人： Jae-Hoon Choi ,  Jae-Seon Hwang ,  Hyo-Jae Bang ,  Hai-Young Lee

发明人： Jae-Hoon Choi ,  Jae-Seon Hwang ,  Hyo-Jae Bang ,  Hai-Young Lee

IPC分类号： H05K7/00

CPC分类号： H01L23/49827 ,  H01L2224/16225 ,  H01L2924/3011 ,  H05K1/025 ,  H05K3/326 ,  H05K2201/0133 ,  H05K2201/09336 ,  H05K2201/09718 ,  H05K2201/10378 ,  H05K2203/0278

摘要： A pressure conductive sheet includes a connector body formed of a thin plate of insulation material, an elastic body deposited as one body with the connector body, pluralities of connection terminals provided with a given interval to pass through the elastic body and the connector body, and a ground plate constituting a matching circuit, the ground plate being buried by a given width in between the connector body and the elastic body. The ground plate is coupled to a ground terminal among the connection terminals and is separated from an outer circumference face of a signal terminal. The connector body, the elastic body, the connection terminals and the ground plate are combined with one another to substantially reduce an interference between signal terminals through the matching circuit formed based on capacitance of a gap between a ground face of the ground plate and the signal terminal, and to improve electrical characteristics.

摘要翻译： 压力传导片包括由绝缘材料薄板形成的连接器主体，与连接器本体一体地沉积的弹性体，设置有给定间隔的多个连接端子以穿过弹性体和连接器主体，以及 构成匹配电路的接地板，接地板在连接器主体和弹性体之间被掩埋一定宽度。 接地板与连接端子之间的接地端子连接，并与信号端子的外周面分离。 连接器主体，弹性体，连接端子和接地板彼此组合，以通过基于接地板的接地面和信号之间的间隙的电容形成的匹配电路来大大减小信号端子之间的干扰 端子，并提高电气特性。

公开(公告)号：US08240360B2

公开(公告)日：2012-08-14

申请号：US12205773

申请日：2008-09-05

申请人： Hyo-Jae Bang ,  Jung-Hyeon Kim

发明人： Hyo-Jae Bang ,  Jung-Hyeon Kim

IPC分类号： F28F7/00 ,  F28F27/00 ,  F28D11/00

CPC分类号： H01L23/367 ,  H01L23/3672 ,  H01L2924/0002 ,  H05K7/20436 ,  H01L2924/00

摘要： One embodiment exemplarily described herein can be generally characterized as a heat sink for an electronic component. The heat sink may include a main body thermally contactable to an electronic component; at least one fin thermally contacted with the main body; and a confining member. The at least one fin and the confining member may be cooperatively engaged such that the at least one fin is moveable between a first position relative to a longitudinal axis of the main body and a second position relative to the longitudinal axis of the relative to the main body.

摘要翻译： 本文示例性描述的一个实施例通常可以表征为电子部件的散热器。 散热器可以包括可与电子部件热接触的主体; 至少一个翅片与主体热接触; 和一个限制成员。 所述至少一个翅片和所述限制构件可以协作地接合，使得所述至少一个翅片可在相对于所述主体的纵向轴线的第一位置和相对于所述主体的纵向轴线的第二位置之间移动 身体。

公开(公告)号：US07663219B2

公开(公告)日：2010-02-16

申请号：US11978370

申请日：2007-10-29

申请人： Hyo-Jae Bang ,  Heui-Seog Kim ,  Dong-Chun Lee ,  Seong-Chan Han ,  Jung-Hyeon Kim

发明人： Hyo-Jae Bang ,  Heui-Seog Kim ,  Dong-Chun Lee ,  Seong-Chan Han ,  Jung-Hyeon Kim

IPC分类号： H01L23/48

CPC分类号： H05K3/303 ,  H05K2201/0305 ,  H05K2201/09781 ,  H05K2201/10689 ,  H05K2201/2036 ,  Y02P70/613

摘要： A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.

摘要翻译： 半导体器件包括半导体封装，电路板和间隔保持元件。 半导体封装具有从主体突出的主体和引线。 电路板具有与引线电连接的第一焊盘。 间隔保持构件插入在电路板和主体之间。 间隔保持构件保持引线与第一焊盘之间的间隔。 因此，均匀地保持引线和焊盘之间的间隔，从而提高了半导体器件的热和/或机械可靠性。

公开(公告)号：US07576437B2

公开(公告)日：2009-08-18

申请号：US11598755

申请日：2006-11-14

申请人： Seong-Chan Han ,  Dong-Chun Lee ,  Kwang-Su Yu ,  Dong-Woo Shin ,  Hyo-Jae Bang ,  Hyun-Seok Choi ,  Si-Suk Kim

发明人： Seong-Chan Han ,  Dong-Chun Lee ,  Kwang-Su Yu ,  Dong-Woo Shin ,  Hyo-Jae Bang ,  Hyun-Seok Choi ,  Si-Suk Kim

IPC分类号： H01L23/48 ,  H01L23/495

CPC分类号： H05K3/3421 ,  H05K3/243 ,  H05K3/282 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10689 ,  H05K2203/046 ,  Y02P70/613

摘要： Example embodiments may be directed to a printed circuit board having an insulating substrate, pads disposed on the surface of the insulating substrate, a solder resist, and a solder moving portion. Leads of a semiconductor package may be mounted on the insulating substrate. The pads to which the leads of the semiconductor package are connected may be disposed on the surface of the insulating substrate. The solder resist layer may cover the insulating substrate, but may also contain openings exposing at least a portion of the pads to which the leads of the semiconductor package are connected. During the process by which each semiconductor lead is connected to a pad, the solder moving portion on the pad may allow an adhesion solder coating each of the leads of the semiconductor package to move towards a shoulder portion of the semiconductor package leads.

摘要翻译： 示例性实施例可以涉及具有绝缘基板，设置在绝缘基板的表面上的焊盘，阻焊剂和焊料移动部分的印刷电路板。 半导体封装的引线可以安装在绝缘基板上。 连接半导体封装的引线的焊盘可以设置在绝缘基板的表面上。 阻焊层可以覆盖绝缘基板，但也可以包含露出半导体封装的引线连接到的焊盘的至少一部分的开口。 在每个半导体引线连接到焊盘的过程中，焊盘上的焊料移动部分可以允许将半导体封装的每个引线的每个引线的焊料焊接涂覆到半导体封装引线的肩部。

公开(公告)号：US20080116546A1

公开(公告)日：2008-05-22

申请号：US11984762

申请日：2007-11-21

申请人： Hyo-Jae Bang ,  Heui-Seog Kim ,  Seong-Chan Han ,  Jung-Hyeon Kim ,  Sung-Hwan Kim

发明人： Hyo-Jae Bang ,  Heui-Seog Kim ,  Seong-Chan Han ,  Jung-Hyeon Kim ,  Sung-Hwan Kim

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/3107 ,  H01L23/49541 ,  H01L23/49558 ,  H01L23/49586 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A lead frame unit, a semiconductor package having a lead frame unit, a stacked semiconductor package having a semiconductor package, and methods of manufacturing the same are provided. The lead frame unit in a stacked semiconductor package may include a die pad supporting a semiconductor chip, an inner lead electrically connected to the semiconductor chip, an outer lead extending from the inner lead, and a heat-resistant insulation member surrounding the connection portion. The outer lead may include a connection portion connected to the inner lead and a junction portion connected to the connection portion and a circuit board. An external signal may be applied to the junction portion. If the lead frame unit is used in the stacked semiconductor package, the outer lead and a dummy outer lead in the stacked semiconductor package may have substantially the same shape.

摘要翻译： 提供引线框单元，具有引线框单元的半导体封装，具有半导体封装的堆叠半导体封装及其制造方法。 层叠半导体封装中的引线框架单元可以包括：支撑半导体芯片的管芯焊盘，与半导体芯片电连接的内部引线;从内部引线延伸的外部引线;以及围绕连接部分的耐热绝缘构件。 外引线可以包括连接到内引线的连接部分和连接到连接部分的接合部分和电路板。 外部信号可以施加到接合部分。 如果在叠层半导体封装中使用引线框架单元，则堆叠半导体封装中的外引线和虚外外引线可以具有基本相同的形状。

公开(公告)号：US20070181993A1

公开(公告)日：2007-08-09

申请号：US11699498

申请日：2007-01-30

申请人： Jae-Hoon Choi ,  Kwang-Su Yu ,  Hyo-Jae Bang ,  Dong-Chun Lee

发明人： Jae-Hoon Choi ,  Kwang-Su Yu ,  Hyo-Jae Bang ,  Dong-Chun Lee

IPC分类号： H01L23/04

CPC分类号： H05K1/09 ,  H05K3/241 ,  H05K3/282 ,  H05K3/428 ,  H05K2201/0209 ,  H05K2201/0215

摘要： A printed circuit board (PCB) may include a substrate. A copper layer may be formed over a portion of the substrate, the copper layer including at least one of a metallic powder and a ceramic powder.

摘要翻译： 印刷电路板（PCB）可以包括基板。 可以在基板的一部分上形成铜层，铜层包括金属粉末和陶瓷粉末中的至少一种。