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    Wiring board with conductive wirings and protrusion electrodes
    4.
    发明授权
    Wiring board with conductive wirings and protrusion electrodes 有权
    接线板，带导电布线和突起电极

    公开(公告)号：US07800209B2

    公开(公告)日：2010-09-21

    申请号：US11620883

    申请日：2007-01-08

    申请人： Yukihiro Kozaka ,  Nozomi Shimoishizaka ,  Toshiyuki Fukuda

    发明人： Yukihiro Kozaka ,  Nozomi Shimoishizaka ,  Toshiyuki Fukuda

    IPC分类号： H01L23/48 ,  H01L23/488 ,  H01L21/44 ,  H05K3/18 ,  H05K3/06

    CPC分类号： H01L21/563 ,  H01L23/49811 ,  H01L23/4985 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/111 ,  H05K3/243 ,  H05K2201/098 ,  H05K2201/0989 ,  H05K2201/10674 ,  H01L2224/05599

    摘要： A wiring board includes a film base, a plurality of conductive wirings aligned on the film base, and protrusion electrodes formed of a plated metal in the vicinity of end portions of the conductive wirings, respectively. An outer surface at both side portions of the protrusion electrodes in cross section in a width direction of the conductive wirings defines a curve, and the protrusion electrodes in cross section in a longitudinal direction of the conductive wirings define a rectangular shape. The conductive wirings include a first conductive wiring having a wiring width of W1 and a second conductive wiring having a wiring width of W2 larger than W1, and the protrusion electrode on the first conductive wiring and the protrusion electrode on the second conductive wiring have a substantially same height. The wiring board is capable of supporting conductive wirings with a practically enough strength to withstand a stress applied during the connection between the protrusion electrodes of the film base and electrode pads of a semiconductor element, providing sufficient connection stability and coping with a narrow pitch of the semiconductor element.

    摘要翻译： 布线基板分别包括膜基底，在基底上排列的多个导电布线，以及在导电配线的端部附近由电镀金属形成的突出电极。 在导电配线的宽度方向上的突起电极的两侧的两侧部的外表面形成曲线，导电配线的纵向截面的突起电极形成矩形。 导电配线包括布线宽度为W1的第一导电布线和布线宽度W2大于W1的第二导电布线，第一导电布线上的突起电极和第二导电布线上的突起电极具有基本上 相同的高度 布线板能够以足够的强度支撑导电布线，以承受在薄膜基底的突起电极和半导体元件的电极焊盘之间的连接期间施加的应力，提供足够的连接稳定性并且应对窄的间距 半导体元件。

    ELECTRONIC DEVICE HAVING A HEAT SINK
    5.
    发明申请
    ELECTRONIC DEVICE HAVING A HEAT SINK 审中-公开
    具有散热器的电子设备

    公开(公告)号：US20100265665A1

    公开(公告)日：2010-10-21

    申请号：US12760219

    申请日：2010-04-14

    申请人： Yukihiro Kozaka ,  Nobuyuki Koutani ,  Hiroyuki Imamura ,  Masanori Minamio

    发明人： Yukihiro Kozaka ,  Nobuyuki Koutani ,  Hiroyuki Imamura ,  Masanori Minamio

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20963 ,  H01L24/01 ,  H01L2924/01322 ,  H01L2924/00

    摘要： The electronic device includes: a heat sink including a front surface having a concave portion; a heat conductive component placed in the concave portion, in contact with the heat sink; a semiconductor element placed in the concave portion, in contact with the heat conductive component; a flexible base plate electrically connected to the semiconductor element and placed on the surface of the heat sink; and a chassis member having a front surface on which the heat sink is fixed so as to come in contact with the heat sink at the back surface opposite to the front surface.

    摘要翻译： 电子设备包括：散热器，其包括具有凹部的前表面; 放置在所述凹部中的与所述散热器接触的导热部件; 放置在所述凹部中的与所述导热部件接触的半导体元件; 电连接到半导体元件并放置在散热器的表面上的柔性基板; 以及底板部件，其具有前表面，散热器固定在该前表面上，以便在与前表面相对的后表面与散热器接触。

    WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    6.
    发明申请
    WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    接线板及其制造方法和半导体器件及其制造方法

    公开(公告)号：US20070182009A1

    公开(公告)日：2007-08-09

    申请号：US11620883

    申请日：2007-01-08

    申请人： Yukihiro KOZAKA ,  Nozomi SHIMOISHIZAKA ,  Toshiyuki FUKUDA

    发明人： Yukihiro KOZAKA ,  Nozomi SHIMOISHIZAKA ,  Toshiyuki FUKUDA

    IPC分类号： H01L23/48 ,  H01L21/44

    CPC分类号： H01L21/563 ,  H01L23/49811 ,  H01L23/4985 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/111 ,  H05K3/243 ,  H05K2201/098 ,  H05K2201/0989 ,  H05K2201/10674 ,  H01L2224/05599

    摘要： A wiring board includes a film base, a plurality of conductive wirings aligned on the film base, and protrusion electrodes formed of a plated metal in the vicinity of end portions of the conductive wirings, respectively. An outer surface at both side portions of the protrusion electrodes in cross section in a width direction of the conductive wirings defines a curve, and the protrusion electrodes in cross section in a longitudinal direction of the conductive wirings define a rectangular shape. The conductive wirings include a first conductive wiring having a wiring width of W1 and a second conductive wiring having a wiring width of W2 larger than W1, and the protrusion electrode on the first conductive wiring and the protrusion electrode on the second conductive wiring have a substantially same height. The wiring board is capable of supporting conductive wirings with a practically enough strength to withstand a stress applied during the connection between the protrusion electrodes of the film base and electrode pads of a semiconductor element, providing sufficient connection stability and coping with a narrow pitch of the semiconductor element.

    摘要翻译： 布线基板分别包括膜基底，在基底上排列的多个导电布线，以及在导电配线的端部附近由电镀金属形成的突出电极。 在导电配线的宽度方向上的突起电极的两侧的两侧部的外表面形成曲线，导电配线的纵向截面的突起电极形成矩形。 导电布线包括布线宽度为W 1的第一导电布线和布线宽度为W 2大于W 1的第二导电布线，第一导电布线上的突起电极和第二导线上的突起电极 具有基本相同的高度。 布线板能够以足够的强度支撑导电布线，以承受在薄膜基底的突起电极和半导体元件的电极焊盘之间的连接期间施加的应力，提供足够的连接稳定性并且应对窄的间距 半导体元件。

    TAPE CARRIER SUBSTRATE
    7.
    发明申请
    TAPE CARRIER SUBSTRATE 审中-公开
    胶带底座

    公开(公告)号：US20120018861A1

    公开(公告)日：2012-01-26

    申请号：US13190042

    申请日：2011-07-25

    申请人： Yukihiro KOZAKA ,  Hiroyuki Imamura

    发明人： Yukihiro KOZAKA ,  Hiroyuki Imamura

    IPC分类号： H01L23/495

    CPC分类号： H01L23/49572 ,  H01L23/36 ,  H01L23/4006 ,  H01L24/50 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/00

    摘要： A tape carrier substrate includes: a tape carrier base 1; a first terminal section 2A including a plurality of first terminals 2a arranged with one another in a first direction W; a second terminal section 2B including a plurality of second terminals 2b; and first and second conductive wires 3a and 3b. A plurality of slits 7 arranged with one another in the first direction are provided in the tape carrier base. An interval between one of the plurality of slits placed at one end in the first direction and a corresponding end of the tape carrier base in the first direction and an interval between another one of the plurality of slits placed at the other end in the first direction and a corresponding end of the tape carrier base in the first direction are greater than an interval between adjacent ones of the plurality of slits.

    摘要翻译： 带载基板包括：载带基座1; 包括在第一方向W上彼此配置的多个第一端子2a的第一端子部分2A; 包括多个第二端子2b的第二端子部分2B; 以及第一和第二导线3a和3b。 在带状基座上设置有沿第一方向彼此配置的多个狭缝7。 在第一方向上的一端放置的多个狭缝中的一个与第一方向上的带载体的相应端部之间的间隔和在第一方向上位于另一端的另一个狭缝之间的间隔 并且所述带载基座在所述第一方向上的对应端部大于所述多个狭缝中的相邻端部之间的间隔。

    TAPE CARRIER SUBSTRATE AND SEMICONDUCTOR DEVICE
    8.
    发明申请
    TAPE CARRIER SUBSTRATE AND SEMICONDUCTOR DEVICE 审中-公开
    带状载体基板和半导体器件

    公开(公告)号：US20090020858A1

    公开(公告)日：2009-01-22

    申请号：US12169199

    申请日：2008-07-08

    申请人： Yukihiro Kozaka ,  Yoshifumi Nakamura

    发明人： Yukihiro Kozaka ,  Yoshifumi Nakamura

    IPC分类号： H01L23/495 ,  B32B3/10

    CPC分类号： H01J11/10 ,  H01L24/50 ,  H01L24/86 ,  H01L2924/181 ,  Y10T428/24322 ,  H01L2924/00

    摘要： The present invention provides a tape carrier substrate that can prevent a conductor wire on the tape carrier substrate from being broken at the boundary portion between the conductor wire and a slit formed in a folding portion of the tape carrier substrate. The slit is formed in the folding portion of the tape carrier substrate so that the width thereof located on an extensional portion side of the tape carrier substrate is larger than that located on a central portion side of the tape carrier substrate. Possible stress resulting from bending of the tape carrier substrate is thus distributed. This prevents the stress from concentrating at the boundary portion between the slit and the conductor wire.

    摘要翻译： 本发明提供一种能够防止带状载体基板上的导体线在导线与形成在带状载体基板的折叠部分的狭缝的边界部分断裂的带状载体基板。 狭缝形成在带状载体基板的折叠部分中，使得其位于带状载体基底的延伸部分侧的宽度大于位于带状载体基板的中心部分侧的宽度。 因此，能够将由带状基材的弯曲产生的应力分散。 这防止了应力集中在狭缝和导线之间的边界部分。

    Lighting unit and liquid crystal display device using the same
    10.
    发明授权
    Lighting unit and liquid crystal display device using the same 失效
    照明单元和使用其的液晶显示装置

    公开(公告)号：US06231202B1

    公开(公告)日：2001-05-15

    申请号：US09377174

    申请日：1999-08-19

    申请人： Yukihiro Kozaka ,  Mitsuo Nomura

    发明人： Yukihiro Kozaka ,  Mitsuo Nomura

    IPC分类号： F21K2700

    CPC分类号： G02B6/009 ,  G02B6/0071 ,  G02F1/133615

    摘要： A lighting unit includes a housing, a light-conductive-panel and a fluorescent lamp, and has a space between the panel and a side wall of the housing. The lamp has electrodes on both its ends and a curved-corner. The space has different widths at sections where the electrodes are rested and at a section where the curved-corner is rested, and accommodates the lamp therein. The lighting unit is compact in size and has better shock resistance, as well as vibration resistance. The lighting unit and an LCD are integrated into a compact and highly reliable LCD device.

    摘要翻译： 照明单元包括壳体，导光面板和荧光灯，并且在面板和壳体的侧壁之间具有空间。 该灯在其两端和弯曲的角上都有电极。 该空间在放置电极的部分处和在弯曲角落的部分处具有不同的宽度，并且在其中容纳灯。 照明单元的尺寸紧凑，具有更好的抗冲击性以及抗振动性。 照明单元和LCD被集成到紧凑且高可靠性的LCD设备中。