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公开(公告)号：US20140355234A1
公开(公告)日：2014-12-04
申请号：US14459655
申请日：2014-08-14
Applicant: Amazon Technologies, Inc.
Inventor： David C. Buuck
CPC classification number: H05K1/181 , H01L2224/16227 , H01L2224/17181 , H01L2224/81192 , H01L2924/15153 , H01L2924/15192 , H01L2924/15321 , H05K1/111 , H05K1/141 , H05K1/142 , H05K1/182 , H05K1/184 , H05K3/30 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10121 , H05K2201/10159 , H05K2201/10166 , H05K2201/10174 , H05K2201/10378 , Y10T29/4913
Abstract: Devices and methods for constructing low-profile, minimal-thickness electronic devices using existing production techniques are disclosed in this application. An electronic component and interposer form a sub-assembly. The sub-assembly is placed in an aperture in a circuit board with the interposer providing interconnections between the electronic component and the circuit board. The circuit board is coupled to the electronic component at least by one or more fluidic channels included in the interposer. The sub-assembly placed in the aperture in the circuit board as described herein conceals the thickness of the integrated circuit within the thickness of the circuit board, reducing overall thickness.
Abstract translation: 在本申请中公开了使用现有生产技术构造低轮廓，最小厚度的电子设备的装置和方法。 电子部件和插入件形成子组件。 子组件放置在电路板的孔中，插入器提供电子部件和电路板之间的互连。 电路板至少通过包括在插入器中的一个或多个流体通道耦合到电子部件。 放置在如本文所述的电路板的孔中的子组件将集成电路的厚度隐藏在电路板的厚度内，从而减小总体厚度。
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公开(公告)号：US20150099558A1
公开(公告)日：2015-04-09
申请号：US14567721
申请日：2014-12-11
Applicant: AMAZON TECHNOLOGIES, INC.
Inventor： Gregg Zehr , Subram Narasimhan , Varadarajan Gopalakrishnan , David C. Buuck , John Depew , In Chul Hyun
IPC: H04W52/18
CPC classification number: H04W52/18 , H01Q1/243 , H01Q1/245 , H01Q21/28 , H04B1/3838 , H04W52/228 , H04W52/36 , H04W52/367
Abstract: A user device transmits data at a first transmit power level. The user device detects a presence of a human body part within a predetermined distance from an antenna of the user device using one or more sensors disposed at a back side of the user device. In response to the detection of the presence of the human body part, the user device transmits information at a second transmit power level that is less than the first transmit power level.
Abstract translation: 用户设备以第一发射功率电平发送数据。 用户装置使用设置在用户装置的背面的一个或多个传感器来检测来自用户装置的天线的预定距离内的人体部位的存在。 响应于检测到人体部分的存在，用户装置以小于第一发射功率电平的第二发射功率电平发射信息。
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公开(公告)号：US20150097799A1
公开(公告)日：2015-04-09
申请号：US14569037
申请日：2014-12-12
Applicant: Amazon Technologies, Inc.
Inventor： David C. Buuck , John Mathew Depew
IPC: G06F3/041
CPC classification number: G06F3/041 , G06F3/0418
Abstract: An interference suppression module coordinates devices susceptible to interference such as a touch sensor with potentially interference generating devices such as a display drive matrix, an active haptic device, and so forth. As a result of status signals generated by the interference suppression module, controllers of the susceptible devices may modify the input received to mitigate or avoid interference.
Abstract translation: 干扰抑制模块协调易受干扰的装置，例如具有潜在的干扰产生装置的触摸传感器，例如显示驱动矩阵，主动触觉装置等。 作为由干扰抑制模块产生的状态信号的结果，敏感设备的控制器可以修改所接收的输入以减轻或避免干扰。
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Patent Agency Ranking
公开(公告)号：US09509143B1
公开(公告)日：2016-11-29
申请号：US14659201
申请日：2015-03-16
Applicant: Amazon Technologies, Inc.
Inventor： David C. Buuck
Abstract: A wide dynamic range charger module is configured to couple a variable power source such as a photovoltaic cell to a load. The module determines a maximum power point (MPPT) of the power source and based at least in part upon that MPPT selects one of a plurality of power converters to provide power to the load. The selection is such that the selected power converter is operating within its operating regime. The selected power converter may further be configured to a pre-determined input admittance which corresponds to the power source.
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公开(公告)号：US09307499B2
公开(公告)日：2016-04-05
申请号：US14567721
申请日：2014-12-11
Applicant: AMAZON TECHNOLOGIES, INC.
Inventor： Gregg Zehr , Subram Narasimhan , Varadarajan Gopalakrishnan , David C. Buuck , John Depew , In Chul Hyun
CPC classification number: H04W52/18 , H01Q1/243 , H01Q1/245 , H01Q21/28 , H04B1/3838 , H04W52/228 , H04W52/36 , H04W52/367
Abstract: A user device transmits data at a first transmit power level. The user device detects a presence of a human body part within a predetermined distance from an antenna of the user device using one or more sensors disposed at a back side of the user device. In response to the detection of the presence of the human body part, the user device transmits information at a second transmit power level that is less than the first transmit power level.
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公开(公告)号：US09703406B2
公开(公告)日：2017-07-11
申请号：US14569037
申请日：2014-12-12
Applicant: Amazon Technologies, Inc.
Inventor： David C. Buuck , John Mathew Depew
IPC: G06F3/041
CPC classification number: G06F3/041 , G06F3/0418
Abstract: An interference suppression module coordinates devices susceptible to interference such as a touch sensor with potentially interference generating devices such as a display drive matrix, an active haptic device, and so forth. As a result of status signals generated by the interference suppression module, controllers of the susceptible devices may modify the input received to mitigate or avoid interference.
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公开(公告)号：US09131623B2
公开(公告)日：2015-09-08
申请号：US14459655
申请日：2014-08-14
Applicant: Amazon Technologies, Inc.
Inventor： David C. Buuck
CPC classification number: H05K1/181 , H01L2224/16227 , H01L2224/17181 , H01L2224/81192 , H01L2924/15153 , H01L2924/15192 , H01L2924/15321 , H05K1/111 , H05K1/141 , H05K1/142 , H05K1/182 , H05K1/184 , H05K3/30 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10121 , H05K2201/10159 , H05K2201/10166 , H05K2201/10174 , H05K2201/10378 , Y10T29/4913
Abstract: Devices and methods for constructing low-profile, minimal-thickness electronic devices using existing production techniques are disclosed in this application. An electronic component and interposer form a sub-assembly. The sub-assembly is placed in an aperture in a circuit board with the interposer providing interconnections between the electronic component and the circuit board. The circuit board is coupled to the electronic component at least by one or more fluidic channels included in the interposer. The sub-assembly placed in the aperture in the circuit board as described herein conceals the thickness of the integrated circuit within the thickness of the circuit board, reducing overall thickness.
Abstract translation: 在本申请中公开了使用现有生产技术构造低轮廓，最小厚度的电子设备的装置和方法。 电子部件和插入件形成子组件。 子组件放置在电路板的孔中，插入器提供电子部件和电路板之间的互连。 电路板至少通过包括在插入器中的一个或多个流体通道耦合到电子部件。 放置在如本文所述的电路板的孔中的子组件将集成电路的厚度隐藏在电路板的厚度内，从而减小总体厚度。
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公开(公告)号：US09019720B1
公开(公告)日：2015-04-28
申请号：US13674744
申请日：2012-11-12
Applicant: Amazon Technologies, Inc.
Inventor： David C. Buuck , Chris T. Li
CPC classification number: H05K7/005 , G06F1/1626 , G06F1/1656 , G06F1/1658 , H04R1/028 , H05K7/06
Abstract: Components within a portable device are arranged around a perimeter of a display component to reduce the height of the portable device. Components such as a battery, a main logic board, a wireless networking interface, and so forth may be distributed around a display component such as an electrophoretic display. Distribution of components around the perimeter of the display component rather than behind the display component reduces the height. Furthermore, the placement of components in the perimeter provides a structure for a user to grip the portable device or for placement of user actuable controls.
Abstract translation: 便携式设备内的组件围绕显示组件的周边设置以减小便携式设备的高度。 诸如电池，主逻辑板，无线联网接口等的组件可以分布在诸如电泳显示器的显示组件周围。 围绕显示组件的周边部件而不是显示部件后面的部件的分布降低了高度。 此外，组件在周边中的放置提供了一种结构，用于使用者握住便携式设备或放置用户可启动的控制。
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