ADAPTIVE PROCESSES FOR IMPROVING INTEGRITY OF SURFACES
    2.
    发明申请
    ADAPTIVE PROCESSES FOR IMPROVING INTEGRITY OF SURFACES 审中-公开
    改善表面完整性的自适应方法

    公开(公告)号:US20160029496A1

    公开(公告)日:2016-01-28

    申请号:US14872076

    申请日:2015-09-30

    Applicant: APPLE INC.

    CPC classification number: G06F1/1656

    Abstract: A process for performing localized corrective actions to structure of an electronic device is described. The structure may include a mating surface configured to receive another structured such that the two structures may be, for example, adhesively bonded together. The localized corrective actions are configured not to improve the mating surface but to also prevent light within the electronic device from escaping in undesired areas of the electronic device. In some embodiments, the corrective action includes using a removal tool to remove identified portions of the surface. In other embodiments, the corrective action includes using a different tool to add material identified portions of the surface. The identified means may include an automated inspection system.

    Abstract translation: 描述用于执行电子设备结构的局部校正动作的处理。 该结构可以包括被配置为接收另一结构化的配合表面,使得两个结构例如可以粘合在一起。 局部校正动作被配置成不改进配合表面,而且还防止电子设备内的光在电子设备的不期望的区域中逸出。 在一些实施例中,校正动作包括使用移除工具去除表面的识别部分。 在其他实施例中,校正动作包括使用不同的工具来添加表面的材料识别部分。 所识别的装置可以包括自动检查系统。

    SELF-PROFILING FRICTION PADS FOR ELECTRONIC DEVICES
    5.
    发明申请
    SELF-PROFILING FRICTION PADS FOR ELECTRONIC DEVICES 审中-公开
    用于电子设备的自调式摩擦片

    公开(公告)号:US20150323965A1

    公开(公告)日:2015-11-12

    申请号:US14274452

    申请日:2014-05-09

    Applicant: Apple Inc.

    CPC classification number: G06F1/1656 B05D3/102 G06F1/1613 G06F1/182

    Abstract: This application relates to self-profiling friction pads for computing devices. In particular, the embodiments discussed herein describe self-profiling friction pads that have a naturally dome-shaped profile. In some embodiments, the self-profiling friction pads can be used as device feet for a computing device. Additionally, the self-profiling friction pads can be used to seal certain areas of the computing device such as a display or ventilation system. The self-profiling friction pads are configured to be deposited in a liquid state and form into a dome shape as a result of the material properties of the deposited liquid and the properties of the surface to which the liquid is deposited.

    Abstract translation: 本申请涉及用于计算设备的自动轮廓摩擦垫。 特别地,本文讨论的实施例描述了具有自然圆顶形轮廓的自动轮廓摩擦垫。 在一些实施例中,自动轮廓摩擦垫可用作计算装置的装置脚。 此外,自动轮廓摩擦垫可用于密封诸如显示器或通风系统的计算设备的某些区域。 自成型摩擦垫被构造成由于沉积液体的材料性质和沉积液体的表面的性质而以液态沉积并形成圆顶形状。

    FLOATING FASTENERS
    6.
    发明申请
    FLOATING FASTENERS 有权
    浮动紧固件

    公开(公告)号:US20140109379A1

    公开(公告)日:2014-04-24

    申请号:US13868037

    申请日:2013-04-22

    Applicant: APPLE INC.

    Abstract: One or more floating fastener assemblies used to fasten components together are described. In some embodiments, the components are top and bottom portions of an enclosure of a computing device. Each floating fastener assembly can include a fastener having at least one surface that can engage with a surface of the enclosure to limit the rotation of the fastener during fastening. Each floating fastener can also include a clearance area for the fastener to “float” in a lateral direction with respect to the enclosure. Thus, when corresponding openings in the top and bottom portions of the enclosure are not exactly aligned, each fastener can shift laterally to allow screws to engage to fasten the top and bottom portions together.

    Abstract translation: 描述了一个或多个用于将部件紧固在一起的浮动紧固件组件。 在一些实施例中,组件是计算设备的外壳的顶部和底部。 每个浮动紧固件组件可以包括紧固件,该紧固件具有至少一个表面,该表面能够在紧固期间限制紧固件的旋转。 每个浮动紧固件还可以包括用于紧固件相对于外壳沿横向方向“浮动”的间隙区域。 因此,当外壳的顶部和底部中的对应的开口不精确对准时,每个紧固件可以横向移动以允许螺钉接合以将顶部和底部部分紧固在一起。

    TECHNIQUES FOR JOINING ONE OR MORE STRUCTURES OF AN ELECTRONIC DEVICE
    10.
    发明申请
    TECHNIQUES FOR JOINING ONE OR MORE STRUCTURES OF AN ELECTRONIC DEVICE 审中-公开
    加入一个或多个电子设备结构的技术

    公开(公告)号:US20160342179A1

    公开(公告)日:2016-11-24

    申请号:US15160054

    申请日:2016-05-20

    Applicant: Apple Inc.

    Abstract: Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.

    Abstract translation: 公开了将电子设备的外壳中的结构特征结合在一起的技术。 结构特征可以被超声波焊接到外壳以提供结构支撑并在该装置内形成磁路。 此外,超声波焊接可以将各种特征粘合到外壳的内部区域,而不会在对应于各种特征的位置处留下标记或迹线到外壳的外部区域。 此外,一个或多个特征可以被驱动以抵靠外壳,以通过摩擦焊接来接合一个或多个特征。 此外,旋转摩擦焊接机可以将具有相对较小直径的特征以相对较高的速度旋转到外壳上,以将特征驱动到外壳中,并将该特征与外壳摩擦焊接。 此外,摩擦焊接在外部区域上不会留下任何外观的化妆品变形。

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