Abstract:
A memory device having an array of memory cells connected to a core voltage level, and access circuitry used to perform a write operation in order to write data into a plurality of addressed memory cells. At least one bit line associated with at least each column in the array containing an addressed memory cell is precharged to the peripheral voltage level prior to the write operation being performed. Word line driver circuitry is then configured to assert a word line signal at the core voltage level on the word line associated with the row of the array containing the addressed memory cells. Write multiplexing driver circuitry asserts a mux control signal to write multiplexing circuitry which then couples the bit line of each addressed memory cell to the write driver circuitry in dependence on the mux control signal identifying which column contains the addressed memory cells.
Abstract:
A memory device includes an array of memory cells arranged as a plurality of rows and columns, each row being coupled to an associated read word line, and each column forming at least one column group, where the memory cells of each column group are coupled to an associated read bit line. Each column group includes circuitry to precharge the associated read bit line to a first voltage level prior to the read operation. Each memory cell has coupling circuitry connected between the associated read bit line and a second voltage level different to the first voltage level. During read operation the coupling circuitry associated with the activated memory cell selectively discharges the associated read bit line towards the second voltage level dependent on the data value stored within that activated memory cell. The clamping circuitry connects the associated read bit line to the second voltage level.
Abstract:
A system-on-chip is provided that includes functional circuitry that performs a function. Control circuitry controls the function based one or more configuration parameters. Non-volatile storage circuitry includes a plurality of non-volatile storage cells each being adapted to write at least a bit of the one or more configuration parameters in a rewritable, persistent manner a plurality of times. Read circuitry locally accesses the non-volatile storage circuitry, obtains the one or more configuration parameters from the non-volatile storage circuitry and provides the one or more configuration parameters to the control circuitry. Write circuitry obtains the one or more configuration parameters and provides the one or more configuration parameters to the non-volatile storage circuitry by locally accessing the non-volatile storage circuitry.
Abstract:
A memory device includes an array of memory cells arranged as a plurality of rows and columns, a plurality of word lines, each word line being coupled to an associated row of memory cells, and a plurality of bit lines, each bit line being coupled to an associated column of memory cells. Access circuitry is coupled to the word lines and the bit lines in order to perform access operations in respect of selected memory cells within the array. Control circuitry controls operation of the access circuitry and includes self-timed path (STP) delay circuitry. The control circuitry employs the delay indication when controlling the access circuitry to perform said access operations. Voltage supply control circuitry switches the voltage supply to at least one portion of the STP delay circuitry between a peripheral voltage supply and an array voltage supply dependent on a control signal.
Abstract:
A memory 2 includes a regular array of storage elements 4. A regular array of write multiplexers 8 is provided outside of the regular array of storage elements 4. The storage element pitch is matched to the write multiplexer pitch. The write multiplexers 10 support a plurality of write ports. When forming a memory design 2, a given instance of an array of write multiplexers 8 may be selected in dependence upon the desired number of write ports to support and this combined with a common form of storage element array 4.
Abstract:
A memory has a normal mode and a power saving mode. The memory has bitline precharge circuitry which during the normal mode selectively couples a pair of bitlines to a precharge node to charge the bitlines to a given voltage level. During the power saving mode the bitlines are isolated from the precharge node. Voltage control circuitry is provided to maintain the precharge node at a first voltage level during the normal mode and at a second voltage level less than the first voltage level during the power saving mode. By reducing the voltage level at the precharge node during the power saving mode, the amount of inrush current occurring when switching from power saving mode to normal mode can be reduced, and this enables the wakeup time to be reduced when returning from power saving mode to normal mode.