公开(公告)号：US09337244B2

公开(公告)日：2016-05-10

申请号：US13404692

申请日：2012-02-24

申请人： Kaoru Hatano ,  Satoshi Seo ,  Akihiro Chida ,  Yoshiaki Oikawa

发明人： Kaoru Hatano ,  Satoshi Seo ,  Akihiro Chida ,  Yoshiaki Oikawa

IPC分类号： H01L33/08 ,  H01L27/32 ,  H01L51/52

CPC分类号： H01L27/3246 ,  H01L51/525

摘要： Provided is a highly reliable light-emitting device in which a light-emitting element is prevented from being damaged when external physical force is applied. The light-emitting device includes a light-emitting element formed over a first substrate, including a first electrode layer, a light-emitting layer, and a second electrode layer; a structure body formed over the first substrate; a second substrate provided to face the first substrate; and a bonding layer provided between the first substrate and the second substrate. The light-emitting layer is separated by the structure body. By strengthening adhesion between the structure body and the bonding layer, or between the structure body and the second electrode, the highly reliable light-emitting device in which damage of the light-emitting element is prevented can be provided.

摘要翻译： 提供了一种高度可靠的发光装置，其中当施加外部物理力时防止发光元件被损坏。 发光装置包括形成在第一基板上的发光元件，包括第一电极层，发光层和第二电极层; 形成在所述第一基板上的结构体; 设置成面对第一基板的第二基板; 以及设置在第一基板和第二基板之间的接合层。 发光层被结构体分开。 通过加强结构体与结合层之间或结构体与第二电极之间的粘附性，可以提供防止发光元件损坏的高度可靠的发光装置。

公开(公告)号：US08803136B2

公开(公告)日：2014-08-12

申请号：US13592722

申请日：2012-08-23

申请人： Shunpei Yamazaki ,  Kaoru Hatano ,  Satoshi Seo ,  Akihiro Chida

发明人： Shunpei Yamazaki ,  Kaoru Hatano ,  Satoshi Seo ,  Akihiro Chida

IPC分类号： H01L51/50 ,  H01L29/51

CPC分类号： H01L51/5259 ,  H01L2251/5369

摘要： A highly reliable light-emitting module including an organic EL element or a light-emitting device using a highly reliable light-emitting module including an organic EL element is provided. Alternatively, a method of manufacturing a highly reliable light-emitting module including an organic EL element, or a method of manufacturing a light-emitting device using a highly reliable light-emitting module including an organic EL element is provided. The light-emitting module has a structure in which a light-emitting element formed over a first substrate and a viscous material layer are sealed in a space between the first substrate and a second substrate which face each other, with a sealing material surrounding the light-emitting element. The viscous material layer is provided between the light-emitting element and the second substrate and includes a non-solid material and a drying agent which reacts with or adsorbs an impurity.

摘要翻译： 提供了一种包括有机EL元件或使用包括有机EL元件的高可靠性发光模块的发光装置的高度可靠的发光模块。 或者，提供一种制造包括有机EL元件的高可靠性发光模块的方法，或者使用包括有机EL元件的高可靠性发光模块的发光装置的制造方法。 发光模块具有这样的结构，其中形成在第一基板和粘性材料层上的发光元件被密封在第一基板和彼此面对的第二基板之间的空间中，围绕光的密封材料 -emitting元素。 粘性材料层设置在发光元件和第二基板之间，并且包括非固体材料和与杂质反应或吸附杂质的干燥剂。

公开(公告)号：US08409973B2

公开(公告)日：2013-04-02

申请号：US13168059

申请日：2011-06-24

申请人： Akihiro Chida ,  Kaoru Hatano

发明人： Akihiro Chida ,  Kaoru Hatano

IPC分类号： H01L21/304

CPC分类号： H01L27/1266 ,  H01L21/67092 ,  H01L21/6838 ,  H01L21/68735 ,  H01L27/1214 ,  Y10T156/1906

摘要： Objects are to reduce the number of steps in a process for separating a substrate and a semiconductor element, to provide a separation apparatus capable of reducing the number of steps, to suppress manufacturing cost by reducing the number of steps in a separation process, and to improve productivity in manufacturing semiconductor elements. A separation apparatus including a frame body, a porous body having a chamfered, rounded corner portion, a suction unit configured to create suction in the porous body and the frame body, and a jig which includes a unit adopted to press down part of an object to be separated and a unit adopted to lift another part of the object to be separated, and also a separation method and a method for manufacturing a semiconductor element by using the separation apparatus, are provided.

摘要翻译： 目的是减少用于分离衬底和半导体元件的工艺中的步骤数量，以提供能够减少步骤数量的分离装置，通过减少分离工艺中的步骤数来抑制制造成本，以及 提高制造半导体元件的生产率。 一种分离装置，包括框体，具有倒角的圆角部分的多孔体，构造成在多孔体和框体中产生吸力的吸引单元，以及包括用于将物体的一部分压下的单元的夹具 以及用于提升要分离的物体的另一部分的单元，还提供了使用分离装置制造半导体元件的分离方法和方法。

公开(公告)号：US20130048995A1

公开(公告)日：2013-02-28

申请号：US13592722

申请日：2012-08-23

申请人： Shunpei Yamazaki ,  Kaoru Hatano ,  Satoshi Seo ,  Akihiro Chida

发明人： Shunpei Yamazaki ,  Kaoru Hatano ,  Satoshi Seo ,  Akihiro Chida

IPC分类号： H01L33/08

CPC分类号： H01L51/5259 ,  H01L2251/5369

摘要： A highly reliable light-emitting module including an organic EL element or a light-emitting device using a highly reliable light-emitting module including an organic EL element is provided. Alternatively, a method of manufacturing a highly reliable light-emitting module including an organic EL element, or a method of manufacturing a light-emitting device using a highly reliable light-emitting module including an organic EL element is provided. The light-emitting module has a structure in which a light-emitting element formed over a first substrate and a viscous material layer are sealed in a space between the first substrate and a second substrate which face each other, with a sealing material surrounding the light-emitting element. The viscous material layer is provided between the light-emitting element and the second substrate and includes a non-solid material and a drying agent which reacts with or adsorbs an impurity.

摘要翻译： 提供了一种包括有机EL元件或使用包括有机EL元件的高可靠性发光模块的发光装置的高度可靠的发光模块。 或者，提供一种制造包括有机EL元件的高可靠性发光模块的方法，或者使用包括有机EL元件的高可靠性发光模块的发光装置的制造方法。 发光模块具有这样的结构，其中形成在第一基板和粘性材料层上的发光元件被密封在第一基板和彼此面对的第二基板之间的空间中，围绕光的密封材料 -emitting元素。 粘性材料层设置在发光元件和第二基板之间，并且包括非固体材料和与杂质反应或吸附杂质的干燥剂。

公开(公告)号：US09000442B2

公开(公告)日：2015-04-07

申请号：US13005766

申请日：2011-01-13

申请人： Kaoru Hatano ,  Takaaki Nagata ,  Nozomu Sugisawa ,  Tatsuya Okano ,  Akihiro Chida ,  Tatsunori Inoue

发明人： Kaoru Hatano ,  Takaaki Nagata ,  Nozomu Sugisawa ,  Tatsuya Okano ,  Akihiro Chida ,  Tatsunori Inoue

IPC分类号： H01L27/14 ,  H01L27/12

CPC分类号： H01L27/1266 ,  H01L27/1225

摘要： To simply provide a flexible light-emitting device with long lifetime. To provide a flexible light-emitting device with favorable display characteristics, high yield, and high reliability without display unevenness. Provided is a flexible light-emitting device including: a substrate having flexibility and a property of transmitting visible light; an adhesive layer provided over the substrate; a conductive layer having a property of transmitting visible light provided over the adhesive layer; an insulating layer disposed over the conductive layer; a transistor provided over the insulating layer; an interlayer insulating layer covering the transistor, a light-emitting element including a first electrode electrically connected to source or drain electrodes of the transistor and provided over the interlayer insulating layer, a second electrode facing the first electrode, and a layer including an organic compound having a light-emitting property provided between the first and second electrodes; and a sealing layer covering the light-emitting element.

摘要翻译： 简单地提供具有长寿命的柔性发光装置。 提供具有良好的显示特性，高产率和高可靠性的柔性发光装置，而不会出现显示不均匀。 提供一种柔性发光装置，包括：具有柔性的透射可见光的特性的基板; 设置在所述基板上的粘合层; 导电层，其具有透射在所述粘合剂层上方提供的可见光的性质; 设置在所述导电层上的绝缘层; 设置在所述绝缘层上的晶体管; 覆盖晶体管的层间绝缘层，发光元件，包括电连接到晶体管的源极或漏极并设置在层间绝缘层上的第一电极，面对第一电极的第二电极和包含有机化合物的层 具有设置在第一和第二电极之间的发光特性; 以及覆盖发光元件的密封层。

公开(公告)号：US08597965B2

公开(公告)日：2013-12-03

申请号：US13467166

申请日：2012-05-09

申请人： Kaoru Hatano ,  Akihiro Chida ,  Akihisa Shimomura ,  Shunpei Yamazaki

发明人： Kaoru Hatano ,  Akihiro Chida ,  Akihisa Shimomura ,  Shunpei Yamazaki

IPC分类号： H01L21/00 ,  H01L33/00

CPC分类号： H01L27/3246 ,  H01L51/0024 ,  H01L51/003 ,  H01L51/525 ,  H01L51/56

摘要： An object is to provide a method for manufacturing a light-emitting device including a flexible substrate, in which separation is performed without separation at the interface between the light-emitting layer and the electrode. A spacer formed of a light absorbing material which absorbs laser light is formed over a partition of one of substrates, a coloring layer is formed over the other substrate, and the substrates are bonded to each other with the use of a bonding layer. The light-emitting layer and the electrode which are formed over the spacer are irradiated with laser light through the coloring layer, so that at least the bonding layer among the light-emitting layer, the electrode, the coloring layer, and the bonding layer is melted to form a fixed portion where the bonding layer and the spacer are bonded by welding.

摘要翻译： 本发明的目的是提供一种制造包括柔性基板的发光装置的方法，其中在发光层和电极之间的界面处进行分离而不分离。 由吸收激光的吸光材料形成的间隔物形成在一个基板的隔板上，在另一个基板上形成着色层，并且通过使用接合层将基板彼此接合。 通过着色层，用激光照射在间隔物上形成的发光层和电极，使得至少发光层，电极，着色层和接合层的结合层为 熔化以形成固定部分，其中粘合层和间隔物通过焊接结合。

公开(公告)号：US20100045919A1

公开(公告)日：2010-02-25

申请号：US12538975

申请日：2009-08-11

申请人： Akihiro Chida ,  Kaoru Hatano ,  Takaaki Nagata ,  Satoshi Seo

发明人： Akihiro Chida ,  Kaoru Hatano ,  Takaaki Nagata ,  Satoshi Seo

IPC分类号： G02F1/1345 ,  H01L33/00

CPC分类号： H01L27/1266 ,  H01L27/1225 ,  H01L27/124 ,  H01L27/1248 ,  H01L27/3244 ,  H01L27/3248 ,  H01L27/3276 ,  H01L51/56 ,  H01L2227/326 ,  H01L2251/5338

摘要： Provided is a flexible light-emitting device including: a base insulating film; a thin film transistor formed over a first surface of the base insulating film; an interlayer insulating film formed over the first surface of the base insulating film with the thin film transistor interposed therebetween; a first pixel electrode formed on a second surface of the base insulating film opposite to the first surface; an electroluminescent layer formed on the second surface of the base insulating film with the first pixel electrode interposed therebetween; a second pixel electrode formed on the second surface of the base insulating film with the first pixel electrode and the electroluminescent layer interposed therebetween; and a wiring electrically connected to a semiconductor layer of the thin film transistor in a contact hole provided in the interlayer insulating film and electrically connected to the first pixel electrode in a through-hole penetrating through at least the interlayer insulating film and the base insulating film.

摘要翻译： 提供一种柔性发光装置，包括：基底绝缘膜; 形成在所述基底绝缘膜的第一表面上的薄膜晶体管; 在所述基底绝缘膜的所述第一表面上形成有夹在其间的薄膜晶体管的层间绝缘膜; 形成在与第一表面相对的基底绝缘膜的第二表面上的第一像素电极; 形成在所述基底绝缘膜的第二表面上的电致发光层，其间插入有所述第一像素电极; 形成在所述基底绝缘膜的所述第二表面上的第二像素电极，其间插入有所述第一像素电极和所述电致发光层; 以及布线，电连接到所述薄膜晶体管的半导体层，所述接触孔设置在所述层间绝缘膜中，并且至少贯穿至少所述层间绝缘膜和所述基底绝缘膜的通孔中与所述第一像素电极电连接 。

公开(公告)号：US08555497B2

公开(公告)日：2013-10-15

申请号：US12485957

申请日：2009-06-17

申请人： Kaoru Hatano ,  Akihiro Chida ,  Takaaki Nagata ,  Masayuki Sakakura

发明人： Kaoru Hatano ,  Akihiro Chida ,  Takaaki Nagata ,  Masayuki Sakakura

IPC分类号： H01R43/00

CPC分类号： H01L27/1266 ,  G06K19/07745 ,  G06K19/07747 ,  G06K19/07749 ,  G06K19/0775 ,  H01L21/6835 ,  H01L23/145 ,  H01L23/49827 ,  H01L23/5389 ,  H01L27/1218 ,  H01L2221/6835 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K1/0366 ,  H05K3/002 ,  H05K3/4069 ,  H05K3/4644 ,  H05K2203/1163 ,  Y10T29/49126 ,  Y10T29/49169 ,  H01L2924/00

摘要： To form a conductive region in a prepreg without opening a through hole in a fibrous body. A wiring substrate is provided, including: an organic resin layer and a fibrous body, wherein the fibrous body is impregnated with the organic resin layer; and a wiring with which the fibrous body is impregnated and which is formed by dissolving the organic resin layer. The wiring is exposed on both surfaces of the organic resin layer and penetrates the fibrous body so that the fibrous body is positioned in the through wiring. Further, a semiconductor device is provided by adhering an integrated circuit chip having a bump to the wiring substrate so that the bump is in contact with the wiring.

摘要翻译： 在预浸料坯中形成导电区域，而不在纤维体内打开通孔。 提供一种布线基板，包括：有机树脂层和纤维体，其中所述纤维体浸渍有机树脂层; 以及纤维体浸渍并通过溶解有机树脂层而形成的布线。 布线暴露在有机树脂层的两个表面上并穿透纤维体，使得纤维体位于贯通布线中。 此外，通过将具有凸块的集成电路芯片粘附到布线基板以使得凸块与布线接触来提供半导体器件。

公开(公告)号：US08284369B2

公开(公告)日：2012-10-09

申请号：US12538975

申请日：2009-08-11

申请人： Akihiro Chida ,  Kaoru Hatano ,  Takaaki Nagata ,  Satoshi Seo

发明人： Akihiro Chida ,  Kaoru Hatano ,  Takaaki Nagata ,  Satoshi Seo

IPC分类号： G02F1/1345 ,  B60Q1/14 ,  H01L21/00

CPC分类号： H01L27/1266 ,  H01L27/1225 ,  H01L27/124 ,  H01L27/1248 ,  H01L27/3244 ,  H01L27/3248 ,  H01L27/3276 ,  H01L51/56 ,  H01L2227/326 ,  H01L2251/5338

摘要： Provided is a flexible light-emitting device including: a base insulating film; a thin film transistor formed over a first surface of the base insulating film; an interlayer insulating film formed over the first surface of the base insulating film with the thin film transistor interposed therebetween; a first pixel electrode formed on a second surface of the base insulating film opposite to the first surface; an electroluminescent layer formed on the second surface of the base insulating film with the first pixel electrode interposed therebetween; a second pixel electrode formed on the second surface of the base insulating film with the first pixel electrode and the electroluminescent layer interposed therebetween; and a wiring electrically connected to a semiconductor layer of the thin film transistor in a contact hole provided in the interlayer insulating film and electrically connected to the first pixel electrode in a through-hole penetrating through at least the interlayer insulating film and the base insulating film.

摘要翻译： 提供一种柔性发光装置，包括：基底绝缘膜; 形成在所述基底绝缘膜的第一表面上的薄膜晶体管; 在所述基底绝缘膜的所述第一表面上形成有夹在其间的薄膜晶体管的层间绝缘膜; 形成在与第一表面相对的基底绝缘膜的第二表面上的第一像素电极; 形成在所述基底绝缘膜的第二表面上的电致发光层，其间插入有所述第一像素电极; 形成在所述基底绝缘膜的所述第二表面上的第二像素电极，其间插入有所述第一像素电极和所述电致发光层; 以及布线，电连接到所述薄膜晶体管的半导体层，所述接触孔设置在所述层间绝缘膜中，并且至少贯穿至少所述层间绝缘膜和所述基底绝缘膜的通孔中与所述第一像素电极电连接 。

公开(公告)号：US09929220B2

公开(公告)日：2018-03-27

申请号：US12651734

申请日：2010-01-04

申请人： Shunpei Yamazaki ,  Masahiro Katayama ,  Shingo Eguchi ,  Yoshiaki Oikawa ,  Ami Nakamura ,  Satoshi Seo ,  Kaoru Hatano

发明人： Shunpei Yamazaki ,  Masahiro Katayama ,  Shingo Eguchi ,  Yoshiaki Oikawa ,  Ami Nakamura ,  Satoshi Seo ,  Kaoru Hatano

IPC分类号： H01L27/32 ,  H05B33/02 ,  H05B33/04 ,  H05B33/12 ,  H01L27/12 ,  H01L29/786 ,  H01L51/00 ,  H01L51/52

CPC分类号： H01L27/3246 ,  H01L27/1214 ,  H01L27/1218 ,  H01L27/1266 ,  H01L29/7869 ,  H01L51/003 ,  H01L51/52 ,  H01L51/524 ,  H01L51/5253 ,  H01L2251/5338 ,  H05B33/02 ,  H05B33/04 ,  H05B33/12

摘要： Thinned and highly reliable light emitting elements are provided. Further, light emitting devices in which light emitting elements are formed over flexible substrates are manufactured with high yield. One light emitting device includes a flexible substrate, a light emitting element formed over the flexible substrate, and a resin film covering the light emitting element, and in the light emitting element, an insulating layer serving as a partition has a convex portion and the convex portion is embedded in the resin film, that is, the resin film covers an entire surface of the insulating layer and an entire surface of the second electrode, whereby the light emitting element can be thinned and highly reliable. In addition, a light emitting device can be manufactured with high yield in a manufacturing process thereof.