公开(公告)号：US5296737A

公开(公告)日：1994-03-22

申请号：US755655

申请日：1991-09-06

申请人： Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Nae Yoneda ,  Ryuji Kohno ,  Gen Murakami ,  Ichiro Anjoh

发明人： Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Nae Yoneda ,  Ryuji Kohno ,  Gen Murakami ,  Ichiro Anjoh

IPC分类号： H01L23/495 ,  H01L23/28

CPC分类号： H01L23/49575 ,  H01L23/49524 ,  H01L24/50

摘要： A semiconductor device comprises a plurality of semiconductor chips; electrodes formed on circuit surfaces of said plurality of semiconductor chips; inner leads made of a metal foil and bonded at first ends thereof to the electrodes, outer leads each having a predetermined surface at a first end thereof bonded to a second end of at least one of the inner leads, and a sealing material sealing said plurality of semiconductor chips, the electrodes, the inner leads, and part of each of the outer leads. The semiconductor chips are laminated in such a manner that those surfaces of the semiconductor chips on which their respective circuits are formed are disposed in facing relation to each other. This provides a semiconductor device which is excellent in assembling efficiency.

摘要翻译： 半导体器件包括多个半导体芯片; 形成在所述多个半导体芯片的电路表面上的电极; 内部引线由金属箔制成并在其第一端连接到电极，外部引线在其第一端处具有预定的表面，其结合至少一个内部引线的第二端;以及密封材料，密封所述多个 半导体芯片，电极，内引线和每个外引线的一部分。 半导体芯片以这样的方式层压，使得形成有各自电路的半导体芯片的那些表面彼此面对地设置。 这提供了组装效率优异的半导体器件。

公开(公告)号：US5256903A

公开(公告)日：1993-10-26

申请号：US797964

申请日：1991-11-26

申请人： Maya Obata ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Ryuji Kohno ,  Nae Yoneda ,  Ichiro Anjoh ,  Gen Murakami

发明人： Maya Obata ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Ryuji Kohno ,  Nae Yoneda ,  Ichiro Anjoh ,  Gen Murakami

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L23/30

CPC分类号： H01L23/49506 ,  H01L21/56 ,  H01L23/3142 ,  H01L23/4951 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01057 ,  H01L2924/181

摘要： A plastic encapsulated semiconductor device containing one or more of insulating films. Uneven surfaces, such as recesses and roughened surfaces, are strategically provided on peripheral side (edge) surfaces of the insulating films. As a result, therefore, an interface separation does not easily occur between the side surfaces of the insulating films and the encapsulating resin. If such an interface separation should occur, it cannot develop easily. Thus, it is possible to obtain a plastic encapsulated semiconductor device of a high level of reliability even when the largest possible semiconductor element is mounted therein within limited outside dimensions.

摘要翻译： 一种包含一种或多种绝缘膜的塑料封装半导体器件。 在绝缘膜的周边（边缘）表面上策略性地提供不均匀的表面，例如凹槽和粗糙表面。 因此，绝缘膜和封装树脂的侧面之间不容易发生界面分离。 如果这样的界面分离应该发生，就不容易开发。 因此，即使在有限的外部尺寸下将最大可能的半导体元件安装在其中，也可以获得高可靠性的塑料封装的半导体器件。

公开(公告)号：US5357139A

公开(公告)日：1994-10-18

申请号：US117639

申请日：1993-09-08

申请人： Akihiro Yaguchi ,  Asao Nishimura ,  Makoto Kitano ,  Ryuji Kohno ,  Nae Yoneda ,  Ichiro Anjoh ,  Gen Murakami

发明人： Akihiro Yaguchi ,  Asao Nishimura ,  Makoto Kitano ,  Ryuji Kohno ,  Nae Yoneda ,  Ichiro Anjoh ,  Gen Murakami

IPC分类号： H01L23/50 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L23/48

CPC分类号： H01L21/56 ,  H01L23/3142 ,  H01L23/49506 ,  H01L23/4951 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1815

摘要： In a package for DRAM, plastic is included between the common signal inner leads (bus bar inner leads) and insulating films arranged in the central part of a semiconductor chip. Thus, the deformation of plastic at the upper edge of the common signal inner leads is reduced and no great stress is generated at this portion. Accordingly, plastic cracking can be prevented.

摘要翻译： 在用于DRAM的封装中，在公共信号内引线（母线内引线）和布置在半导体芯片的中心部分的绝缘膜之间包括塑料。 因此，在公共信号内引线的上边缘处的塑料变形减小，并且在该部分处不产生大的应力。 因此，可以防止塑性开裂。

公开(公告)号：US5194935A

公开(公告)日：1993-03-16

申请号：US647416

申请日：1991-01-29

申请人： Makoto Kitano ,  Asao Nishimura ,  Akihiro Yaguchi ,  Nae Yoneda ,  Ryuji Kohno ,  Sueo Kawai ,  Gen Murakami ,  Ichio Shimizu

发明人： Makoto Kitano ,  Asao Nishimura ,  Akihiro Yaguchi ,  Nae Yoneda ,  Ryuji Kohno ,  Sueo Kawai ,  Gen Murakami ,  Ichio Shimizu

IPC分类号： H01L23/29 ,  H01L21/56 ,  H01L23/31 ,  H01L23/367

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L23/3675 ,  H01L2224/48091 ,  H01L2224/48247

摘要： The plastic encapsulated semiconductor device according to the present invention has a semiconductor chip, leads, and members for electrically connecting these parts to each other. A part of leads, the semiconductor chip and the connecting members are encapsulated with a plastic to form a package. The plate type plastic fins formed on the surface of and integrally with the package are divided in two directions perpendicular to each other thereby forming, for example, rows and columns of fins or fin segments, on the package surface. Therefore, the semiconductor device according to the present invention can be molded easily by a transfer molding. It has a high reliability with respect to the prevention of cracks in the plastic, and a low thermal resistance, and is most suitably used to obtain a high-density package mounting structure.

摘要翻译： 根据本发明的塑料封装半导体器件具有半导体芯片，引线和用于将这些部件彼此电连接的部件。 引线，半导体芯片和连接构件的一部分用塑料封装以形成封装。 形成在包装表面上并与包装整体形成的板状塑料翅片在彼此垂直的两个方向上分开，从而在包装表面上形成例如翅片或鳍片的行和列。 因此，根据本发明的半导体器件可以通过传递模塑容易地模制。 它在防止塑料中的裂纹方面具有高的可靠性，并且具有低的热阻，并且最适合用于获得高密度封装安装结构。

公开(公告)号：US6049128A

公开(公告)日：2000-04-11

申请号：US820631

申请日：1997-03-19

申请人： Makoto Kitano ,  Ryuji Kohno ,  Naotaka Tanaka ,  Akihiro Yaguchi ,  Tetsuo Kumazawa ,  Ichiro Anjoh ,  Hideki Tanaka ,  Asao Nishimura ,  Shuji Eguchi ,  Akira Nagai ,  Mamoru Mita

发明人： Makoto Kitano ,  Ryuji Kohno ,  Naotaka Tanaka ,  Akihiro Yaguchi ,  Tetsuo Kumazawa ,  Ichiro Anjoh ,  Hideki Tanaka ,  Asao Nishimura ,  Shuji Eguchi ,  Akira Nagai ,  Mamoru Mita

IPC分类号： H01L21/60 ,  H01L23/04 ,  H01L23/12 ,  H01L23/31 ,  H01L23/495 ,  H01L23/48 ,  H01L23/34 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/50 ,  H01L23/3114 ,  H01L23/49572 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/15787

摘要： A semiconductor device, is provided will semiconductor chips having a plurality of electrodes for external connection, elastomer resin portions formed of an elastomer resin, which are bonded to the semiconductor chip excepting at least some of the plurality of electrodes, a tape layer of resin including tape wiring patterns on the surface thereof, a plurality of solder bumps for bonding the printed wiring pattern to the tape wiring patterns, leads for connecting the plurality of electrodes of the semiconductor chips to the tape wiring patterns, and seal resin for covering the leads and the plurality of electrodes which are connected by the leads. The elastomer resin has a modulus of transverse elasticity not less than 50 MPa and not more than 750 MPa.

摘要翻译： 提供一种半导体器件，具有多个用于外部连接的电极的半导体芯片，除弹性体树脂形成的弹性体树脂部分，其除了多个电极中的至少一些外部结合到半导体芯片，包括树脂的带层，包括 表面上的带状布线图案，用于将印刷布线图案接合到带布线图案的多个焊料凸块，用于将半导体芯片的多个电极连接到带布线图案的引线，以及密封用于覆盖引线的树脂， 由引线连接的多个电极。 弹性体树脂的横向弹性模量不小于50MPa且不大于750MPa。

公开(公告)号：US6130112A

公开(公告)日：2000-10-10

申请号：US166857

申请日：1998-10-06

申请人： Makoto Kitano ,  Ryuji Kohno ,  Naotaka Tanaka ,  Akihiro Yaguchi ,  Tetsuo Kumazawa ,  Ichiro Anjoh ,  Hideki Tanaka ,  Asao Nishimura ,  Shuji Eguchi ,  Akira Nagai ,  Mamoru Mita

发明人： Makoto Kitano ,  Ryuji Kohno ,  Naotaka Tanaka ,  Akihiro Yaguchi ,  Tetsuo Kumazawa ,  Ichiro Anjoh ,  Hideki Tanaka ,  Asao Nishimura ,  Shuji Eguchi ,  Akira Nagai ,  Mamoru Mita

IPC分类号： H01L21/60 ,  H01L23/04 ,  H01L23/12 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48

CPC分类号： H01L24/50 ,  H01L23/3114 ,  H01L23/49572 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/15787

摘要： A semiconductor device, is provided will semiconductor chips having a plurality of electrodes for external connection, elastomer resin portions formed of an elastomer resin, which are bonded to the semiconductor chip excepting at least some of the plurality of electrodes, a tape layer of resin including tape wiring patterns on the surface thereof, a plurality of solder bumps for bonding the printed wiring pattern to the tape wiring patterns, leads for connecting the plurality of electrodes of the semiconductor chips to the tape wiring patterns, and seal resin for covering the leads and the plurality of electrodes which are connected by the leads. The elastomer resin has a modulus of transverse elasticity not less than 50 MPa and not more than 750 MPa.

公开(公告)号：US5539250A

公开(公告)日：1996-07-23

申请号：US713100

申请日：1991-06-11

申请人： Makoto Kitano ,  Asao Nishimura ,  Akihiro Yaguchi ,  Ryuji Kohno ,  Nae Yoneda

发明人： Makoto Kitano ,  Asao Nishimura ,  Akihiro Yaguchi ,  Ryuji Kohno ,  Nae Yoneda

IPC分类号： H01L25/18 ,  H01L23/31 ,  H01L23/495 ,  H01L25/065 ,  H01L25/07 ,  H01L23/34

CPC分类号： H01L24/32 ,  H01L23/3135 ,  H01L23/4951 ,  H01L23/49555 ,  H01L23/49575 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/83191 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/92 ,  H01L2224/92147 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/181

摘要： A plastic-molded-type semiconductor device is provided wherein two semiconductor chips, having main surfaces on which electrodes and circuits are formed, are arranged to face each other. A lead frame is placed between these two semiconductor chips and electrically connected to their electrodes, and a plastic package is formed by plastic-sealing the above components. To provide for secure and convenient electrical connections between the electrodes on the semiconductor chips and the lead frame, wiring patterns are provided on the main surfaces of the semiconductor chips through the intermediation of insulating films. With this structure, it is possible for two large-sized semiconductor chips having electrodes in their middle sections to be encased in a single, relatively thin package.

摘要翻译： 提供了一种塑料模制型半导体器件，其中具有形成有电极和电路的主表面的两个半导体芯片被布置成彼此面对。 引线框架放置在这两个半导体芯片之间并电连接到它们的电极，并且通过塑性密封上述部件形成塑料封装。 为了提供半导体芯片上的电极和引线框架之间的牢固和方便的电连接，布线图案通过绝缘膜设置在半导体芯片的主表面上。 利用这种结构，在其中间部分中具有电极的两个大尺寸半导体芯片可以被封装在单个相对薄的封装中。

公开(公告)号：US06297073B1

公开(公告)日：2001-10-02

申请号：US09547937

申请日：2000-04-11

申请人： Makoto Kitano ,  Ryuji Kohno ,  Naotaka Tanaka ,  Akihiro Yaguchi ,  Tetsuo Kumazawa ,  Ichiro Anjoh ,  Hideki Tanaka ,  Asao Nishimura ,  Shuji Eguchi ,  Akira Nagai ,  Mamoru Mita

发明人： Makoto Kitano ,  Ryuji Kohno ,  Naotaka Tanaka ,  Akihiro Yaguchi ,  Tetsuo Kumazawa ,  Ichiro Anjoh ,  Hideki Tanaka ,  Asao Nishimura ,  Shuji Eguchi ,  Akira Nagai ,  Mamoru Mita

IPC分类号： H01L21283

CPC分类号： H01L24/50 ,  H01L23/3114 ,  H01L23/49572 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/15787 ,  H01L2924/00

摘要： A semiconductor device, is provided will semiconductor chips having a plurality of electrodes for external connection, elastomer resin portions formed of an elastomer resin, which are bonded to the semiconductor chip excepting at least some of the plurality of electrodes, a tape layer of resin including tape wiring patterns on the surface thereof, a plurality of solder bumps for bonding the printed wiring pattern to the tape wiring patterns, leads for connecting the plurality of electrodes of the semiconductor chips to the tape wiring patterns, and seal resin for covering the leads and the plurality of electrodes which are connected by the leads. The elastomer resin has a modulus of transverse elasticity not less than 50 MPa and not more than 750 MPa.

摘要翻译： 提供一种半导体器件，具有多个用于外部连接的电极的半导体芯片，除弹性体树脂形成的弹性体树脂部分，其除了多个电极中的至少一些外部结合到半导体芯片，包括树脂的带层，包括 表面上的带状布线图案，用于将印刷布线图案接合到带布线图案的多个焊料凸块，用于将半导体芯片的多个电极连接到带布线图案的引线，以及密封用于覆盖引线的树脂， 由引线连接的多个电极。 弹性体树脂的横向弹性模量不小于50MPa且不大于750MPa。

公开(公告)号：US5347429A

公开(公告)日：1994-09-13

申请号：US68319

申请日：1993-05-28

申请人： Ryuji Kohno ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Nae Yoneda

发明人： Ryuji Kohno ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Nae Yoneda

IPC分类号： H01L25/18 ,  H01L23/06 ,  H01L23/495 ,  H01L23/52 ,  H01L25/04 ,  H01L25/065 ,  H01L25/07 ,  H05K5/02

CPC分类号： H01L23/4951 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/49 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/49 ,  H01L2224/73215 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19107

摘要： A plastic-molded-type semiconductor device includes a plurality of semiconductor chips, metallic wires connected to the semiconductor chips, leads connected to the metallic wires, and an insulating member interposed between the semiconductor chips and sealed in a resin member. Circuit formed surfaces of the semiconductor chips are directed in the same direction, and one or more of the semiconductor chips serve as a base on which the other semiconductor chips are mounted through the insulating member. One ends of the leads are bonded to the insulating member, and electrodes pad of each semiconductor chip are not covered by the other semiconductor chips, the insulating member and the leads, and therefore are exposed to the surface of the insulating member. In this device, the provision of a tab is omitted, and the laminated chips can be contained in a package thinner than a conventional package. Since the circuit formation surfaces of all of the chips are directed in the same direction, all of the electrical connections can be made by wire bonding from one direction.

摘要翻译： 塑料模制型半导体器件包括多个半导体芯片，连接到半导体芯片的金属线，连接到金属线的引线以及置于半导体芯片之间并被密封在树脂构件中的绝缘构件。 半导体芯片的电路形成表面指向相同的方向，并且一个或多个半导体芯片用作通过绝缘构件安装其它半导体芯片的基底。 引线的一端接合到绝缘构件，并且每个半导体芯片的电极焊盘不被其它半导体芯片，绝缘构件和引线覆盖，因此暴露于绝缘构件的表面。 在该装置中，省略了突片的设置，并且层压芯片可以被包含在比常规封装更薄的封装中。 由于所有芯片的电路形成表面指向相同的方向，所以所有的电连接都可以通过从一个方向引线接合而形成。

公开(公告)号：US5295045A

公开(公告)日：1994-03-15

申请号：US791551

申请日：1991-11-14

申请人： Makoto Kitano ,  Asao Nishimura ,  Akihiro Yaguchi ,  Nae Yoneda ,  Maya Obata ,  Ryuji Kohno ,  Mitsuaki Haneda

发明人： Makoto Kitano ,  Asao Nishimura ,  Akihiro Yaguchi ,  Nae Yoneda ,  Maya Obata ,  Ryuji Kohno ,  Mitsuaki Haneda

IPC分类号： H01L23/28 ,  H01L23/495 ,  H01L23/50 ,  H01L23/52 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K5/02

CPC分类号： H01L23/49575 ,  H01L23/4951 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041

摘要： A plastic-molded-type semiconductor device having a high degree of integration encases a plurality of semiconductor chips in a package unit with each chip situated perpendicular to the substrate for mounting. On a surface of each chip containing circuits or on a reverse surface of the same, a lead frame is attached with an insulating material interposed therebetween. The chip and lead frame are connected with each other by using wire. The lead frame is arranged perpendicularly to another lead frame provided in parallel and connected therewith by welding. A printed circuit board may be used in place of said latter lead frame. By arranging the chips in projections made of resin, the thermal resistance of the semiconductor device is decreased. The present invention is particularly effective for a memory IC.

摘要翻译： 具有高集成度的塑料模制型半导体器件将多个半导体芯片封装在封装单元中，每个芯片垂直于衬底设置用于安装。 在每个芯片容纳电路的表面上或其背面上，引线框架之间插入绝缘材料。 芯片和引线框架通过电线相互连接。 引线框架垂直布置成并联设置的另一引线框架，通过焊接与引线框架相连接。 可以使用印刷电路板代替所述后置引线框架。 通过将芯片布置在由树脂制成的突起中，半导体器件的热阻降低。 本发明对存储器IC特别有效。