公开(公告)号：US06846550B2

公开(公告)日：2005-01-25

申请号：US10704905

申请日：2003-11-12

申请人： Akiko Matsumura ,  Kazuki Uwada ,  Naoki Sadayori ,  Yuji Hotta

发明人： Akiko Matsumura ,  Kazuki Uwada ,  Naoki Sadayori ,  Yuji Hotta

IPC分类号： C08G18/02 ,  C08G73/00 ,  C09J7/00 ,  C09J179/00 ,  H01L21/56 ,  H01L23/29 ,  C08G73/10 ,  C08G18/00 ,  B32B3/00

CPC分类号： H01L21/563 ,  C08G73/00 ,  C09J7/10 ,  C09J179/00 ,  C09J2479/08 ,  H01L23/293 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31681 ,  Y10T428/31721 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/0401

摘要： An adhesive film for underfill which relaxes the stress formed in the wiring circuit substrate, semiconductor element and electrode parts for connection. The adhesive film is a quickly hardening type, and forms a highly heat resistant sealing resin layer quickly between the wiring circuit substrate and semiconductor element of a semiconductor device.

摘要翻译： 用于底部填充剂的粘合膜，其放松在布线电路基板，半导体元件和用于连接的电极部件中形成的应力。 粘合膜是快速硬化型，并且在布线电路基板和半导体器件的半导体元件之间快速形成高耐热密封树脂层。

公开(公告)号：US06538309B1

公开(公告)日：2003-03-25

申请号：US09537690

申请日：2000-03-29

申请人： Yuji Hotta ,  Miho Yamaguchi ,  Akiko Matsumura

发明人： Yuji Hotta ,  Miho Yamaguchi ,  Akiko Matsumura

IPC分类号： H01L2302

CPC分类号： H01L24/83 ,  H01L21/486 ,  H01L23/49827 ,  H01L24/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/00

摘要： A semiconductor device comprising an anisotropic conductive film and a semiconductor element, wherein the film is bonded to the element on the side comprising an electrode, such that the electrode is electrically connectable to an external circuit via a conductive path in the film. According to the present invention, a conventional mounting apparatus can be used for mounting a chip via ACF. Consequently, the productivity of the mounting process for producing a mounted structure of semiconductor element/ACF/circuit board can be improved.

摘要翻译： 一种包括各向异性导电膜和半导体元件的半导体器件，其中所述膜结合到包括电极的一侧上的元件，使得所述电极经由所述膜中的导电路径可电连接到外部电路。 根据本发明，可以使用传统的安装装置来通过ACF安装芯片。 因此，可以提高用于制造半导体元件/ ACF /电路板的安装结构的安装工艺的生产率。

公开(公告)号：US07018718B2

公开(公告)日：2006-03-28

申请号：US10808380

申请日：2004-03-25

申请人： Akiko Matsumura ,  Kazuki Uwada ,  Naoki Sadayori ,  Yuji Hotta

发明人： Akiko Matsumura ,  Kazuki Uwada ,  Naoki Sadayori ,  Yuji Hotta

IPC分类号： B32B27/00 ,  B32B27/06

CPC分类号： H01L21/563 ,  C08G18/095 ,  C08G18/692 ,  C08G18/71 ,  C08L63/00 ,  C09J7/10 ,  C09J175/14 ,  C09J2475/00 ,  H01L23/293 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  Y10T428/31504 ,  Y10T428/31721 ,  C08L2666/20 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/0401

摘要： An adhesive film for underfill excellent in relaxation effect of the stress generated in the above semiconductor element and the wiring circuit board and in the connecting electrode parts and also excellent in reliability of electrical connection between the semiconductor element and the wiring circuit board.

摘要翻译： 用于底部填充的粘合膜在上述半导体元件，布线电路板和连接电极部分中产生的应力的松弛效果优异，并且半导体元件和布线电路板之间的电连接的可靠性也优异。

公开(公告)号：US06652688B2

公开(公告)日：2003-11-25

申请号：US10176530

申请日：2002-06-24

申请人： Akiko Matsumura ,  Yuji Hotta ,  Sadahito Misumi

发明人： Akiko Matsumura ,  Yuji Hotta ,  Sadahito Misumi

IPC分类号： B32B3120

CPC分类号： H01L21/563 ,  H01L24/29 ,  H01L2224/274 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/83191 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/10329 ,  Y10T29/4921 ,  Y10T29/53178 ,  Y10T156/1052 ,  Y10T428/14 ,  Y10T428/28 ,  H01L2924/01031 ,  H01L2924/00

摘要： A process for producing a semiconductor wafer having an adhesive film, by adhering an adhesive film onto a bump-formed surface of a semiconductor wafer having formed thereon bumps with a predetermined arrangement, which comprises: determining a particular arrangement axis direction in which intervals between adjacent linear arrangement axes connecting the bumps becomes the shortest; and adhering the adhesive film in the direction substantially at a right angle with the determined arrangement axis direction, so as to markedly reduce voids included in the adhesion surface upon adhering an adhesive film such as underfill onto a semiconductor wafer.

摘要翻译： 一种用于制造具有粘合剂膜的半导体晶片的方法，其通过将粘合剂膜粘附到具有在其上形成有凸起的半导体晶片的凸起形成的表面上，该半导体晶片具有预定布置，其包括：确定特定的布置轴方向，其中相邻 连接凸块的线性排列轴线最短; 并且在确定的布置轴线方向上以大致直角的方向粘合粘合剂膜，以便在将诸如底部填充剂的粘合剂膜粘附到半导体晶片上时，显着地减小包括在粘合表面中的空隙。

公开(公告)号：US06492484B2

公开(公告)日：2002-12-10

申请号：US09941559

申请日：2001-08-30

申请人： Sadahito Misumi ,  Yuji Hotta ,  Akiko Matsumura

发明人： Sadahito Misumi ,  Yuji Hotta ,  Akiko Matsumura

IPC分类号： C08G7300

CPC分类号： C08G73/00 ,  Y10S525/907 ,  Y10T428/31721

摘要： A polycarbodiimide represented by the formula (I): wherein R1 is an alkylene group having 2 to 10 carbon atoms, R2 is a divalent aromatic group, R3 is a monovalent aromatic group, k is 0 or an integer of 1 to 30, m is an integer of 2 to 100, and n is 0 or an integer of 1 to 30, a process for preparing the same and uses of the polycarbodiimide. The polycarbodiimide is favorably used in the form of films such as adhesive films for die bonding and adhesive films for underfilling, which can be used in semiconductor devices.

摘要翻译： 一种由式（I）表示的聚碳化二亚胺：其中R1为碳原子数2〜10的亚烷基，R2为二价芳香族基团，R3为1价芳香族基团，k为0​​或1〜30的整数，m为 2〜100的整数，n为0或1〜30的整数，其制备方法以及聚碳化二亚胺的用途。 聚碳化二亚胺以薄膜形式有利地使用，例如用于芯片粘合的粘合剂膜和用于底部填充的粘合剂膜，其可用于半导体器件中。

公开(公告)号：US07487586B2

公开(公告)日：2009-02-10

申请号：US10737853

申请日：2003-12-18

申请人： Akiko Matsumura ,  Yuji Hotta

发明人： Akiko Matsumura ,  Yuji Hotta

IPC分类号： H05K3/30

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01077 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2224/0401

摘要： A process for semiconductor device production by which the reliability of connection with bumps can be easily heightened with higher certainty. The process for producing a semiconductor device comprising a substrate having bumps formed thereon, comprises covering the bumps with an adhesive film which has a modulus of elasticity (−55° C.) of from 100 MPa to 5 GPa and has a thickness corresponding to from 5 to 40% of the height of the bumps, and then disposing the adhesive film on the substrate so that the bumps pierce through the adhesive film and come to protrude therefrom.

摘要翻译： 一种用于半导体器件生产的方法，通过该方法可以更高的确定性容易地提高与凸块的连接的可靠性。 包括其上形成有凸起的基板的半导体器件的制造方法包括：使用具有100MPa至5GPa的弹性模量（-55℃）的粘合剂膜覆盖凸块，并且具有对应于 凸起的高度的5〜40％，然后将粘合剂膜设置在基板上，使得突起穿过粘合膜并从其突出。

公开(公告)号：US20050049385A1

公开(公告)日：2005-03-03

申请号：US10927101

申请日：2004-08-27

申请人： Kazuki Uwada ,  Yuji Hotta ,  Akiko Matsumura

发明人： Kazuki Uwada ,  Yuji Hotta ,  Akiko Matsumura

IPC分类号： C09J5/00 ,  C08G18/09 ,  C08G18/69 ,  C08G73/00 ,  C09J175/14 ,  C09J179/00 ,  H01B3/30 ,  H05K1/03 ,  H05K3/38

CPC分类号： C09J179/00 ,  C08G18/095 ,  C08G18/69 ,  C08G73/00 ,  C09J175/14 ,  H01B3/302 ,  H05K1/0346 ,  H05K3/386

摘要： The present invention provides a thermosetting resin which has a tensile modulus after cure of from 0.001 to 1 GPa at 35° C. and which has a resin flow rate before cure under heat and pressure at 150° C. and 2.94×10−1 MPa of from 5 to 50%.

摘要翻译： 本发明提供一种热固性树脂，其在35℃下的固化后的拉伸模量为0.001〜1GPa，在150℃和2.94×10 -1的加热和压力下具有固化前的树脂流动速率， MPa为5〜50％。

公开(公告)号：US06709606B2

公开(公告)日：2004-03-23

申请号：US10123180

申请日：2002-04-17

申请人： Akiko Matsumura ,  Miho Yamaguchi ,  Yuji Hotta

发明人： Akiko Matsumura ,  Miho Yamaguchi ,  Yuji Hotta

IPC分类号： B44C122

CPC分类号： H01L23/49827 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01R12/52 ,  H01R13/22 ,  H05K3/323 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2203/1189 ,  H01L2224/05599

摘要： An anisotropic conductive film 1 comprising an insulating film 2 and plural conductive paths (3, 4), wherein the plural conductive paths are insulated from each other and penetrate the insulating film 2 in the thickness direction of the film, with both ends of the paths being exposed on both surfaces of the insulating film, and wherein a conductive path 3 capable of contact with an electrode 12 of a semiconductor element 11 and a circuit 14 of a circuit board 13 has at least one end protruding more than an end on the same side of a conductive path incapable of contact with the electrode and the circuit. The ACF of the present invention can prevent a conductive path not involved in electrical connection from being in contact with a part other than an electrode of a semiconductor element and/or a part other than a circuit of a circuit board.

摘要翻译： 包括绝缘膜2和多个导电路径（3,4）的各向异性导电膜1，其中多个导电路径彼此绝缘并且在膜的厚度方向上穿透绝缘膜2，两条路径 暴露在绝缘膜的两个表面上，并且其中能够与半导体元件11的电极12和电路板13的电路14接触的导电路径3具有至少一个比其端部突出的端部 导电路径的一侧不能与电极和电路接触。 本发明的ACF可以防止电连接的导电路径不与半导体元件的电极和/或电路板的电路以外的部分接触。

公开(公告)号：US06394821B1

公开(公告)日：2002-05-28

申请号：US09572910

申请日：2000-05-17

申请人： Akiko Matsumura ,  Miho Yamaguchi ,  Yuji Hotta

发明人： Akiko Matsumura ,  Miho Yamaguchi ,  Yuji Hotta

IPC分类号： H01R458

CPC分类号： H01L23/49827 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01R12/52 ,  H01R13/22 ,  H05K3/323 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2203/1189 ,  H01L2224/05599

摘要： An anisotropic conductive film 1 comprising an insulating film 2 and plural conductive paths (3, 4), wherein the plural conductive paths are insulated from each other and penetrate the insulating film 2 in the thickness direction of the film, with both ends of the paths being exposed on both surfaces of the insulating film, and wherein a conductive path 3 capable of contact with an electrode 12 of a semiconductor element 11 and a circuit 14 of a circuit board 13 has at least one end protruding more than an end on the same side of a conductive path incapable of contact with the electrode and the circuit. The ACF of the present invention can prevent a conductive path not involved in electrical connection from being in contact with a part other than an electrode of a semiconductor element and/or a part other than a circuit of a circuit board.

摘要翻译： 包括绝缘膜2和多个导电路径（3,4）的各向异性导电膜1，其中多个导电路径彼此绝缘并且在膜的厚度方向上穿透绝缘膜2，两条路径 暴露在绝缘膜的两个表面上，并且其中能够与半导体元件11的电极12和电路板13的电路14接触的导电路径3具有至少一个比其端部突出的端部 导电路径的一侧不能与电极和电路接触。 本发明的ACF可以防止电连接的导电路径不与半导体元件的电极和/或电路板的电路以外的部分接触。

公开(公告)号：US08310714B2

公开(公告)日：2012-11-13

申请号：US12470007

申请日：2009-05-21

申请人： Akiko Matsumura

发明人： Akiko Matsumura

IPC分类号： G06F3/12 ,  G06K15/00 ,  G03G15/00

CPC分类号： G03G15/01 ,  G03G15/6585 ,  G03G2215/00936

摘要： A print control apparatus includes an input unit configured to input a binding position of sheets related to a binding processing for the sheets on each of which an image is printed based on print data, a setting unit configured to set a printing position of an auxiliary image of transparent color to be printed with the image that is printed based the print data, according to the binding position of the sheets input by the input unit, and a print control unit configured, based on the printing position of the auxiliary image set by the setting unit, to control printing of the auxiliary image.

摘要翻译： 一种打印控制装置，包括：输入单元，被配置为基于打印数据输入与打印图像相对应的纸张的装订处理相关的装订位置;设置单元，其被配置为设置辅助图像的打印位置 根据由输入单元输入的纸张的装订位置，根据打印数据打印的图像被打印的透明颜色;以及打印控制单元，其基于由所述打印数据设置的辅助图像的打印位置， 设置单位，以控制辅助图像的打印。