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19 条记录 (耗时 0.036 秒)

    Linear motor and electronic component feeding apparatus
    4.
    发明申请
    Linear motor and electronic component feeding apparatus 审中-公开
    线性电机和电子元件供给装置

    公开(公告)号：US20050172770A1

    公开(公告)日：2005-08-11

    申请号：US11099615

    申请日：2005-04-06

    申请人： Yoshinori Kano ,  Osamu Inaoka ,  Haruhiko Yamaguchi ,  Shigeru Kageyama

    发明人： Yoshinori Kano ,  Osamu Inaoka ,  Haruhiko Yamaguchi ,  Shigeru Kageyama

    IPC分类号： B60L13/10 ,  F16C29/00 ,  F16C39/06 ,  H02K9/22 ,  H02K41/03 ,  H05K13/02 ,  B26D7/06

    CPC分类号： F16C29/00 ,  B60L13/10 ,  B60L2200/26 ,  F16C32/044 ,  F16C32/0472 ,  H02K9/04 ,  H02K9/22 ,  H02K41/031 ,  H05K13/021 ,  H05K13/0417 ,  Y10T83/2066

    摘要： This invention is directed to the prevention of the deterioration of the accuracy in component mounting by suppressing the temperature rise of the moving member as much as possible by cooling the moving member, which is the heat source of a linear motor. The moving member 48 of the linear motor 14 is configured in the following manner for achieving the objective of this invention. That is, the heat dissipation portion, the axis 17 made of the material with efficient thermal conduction such as aluminum, pierces through the iron core 18 around which coils 20 are wound. The moving member except a part of the axis 17 is molded with synthetic resin, and at one end of the axis 17, the heat dissipation fin 19 which makes heat dissipation area larger is formed. And this heat dissipation fin 19 is placed to face the air exhaust port 67. By configuring the moving member in aforementioned manner, the temperature rise is suppressed even if the coils 20 generate heat, because the heat in the coils 20 is transmitted to the iron core 18 and then to the axis 17 and dissipated through the heat dissipation fin 19. The heat in the outermost part of the iron core 18 from the heat dissipation fin 19 is also transmitted to the heat dissipation fin 19 through the axis 17 resulting in the suppression of the temperature rise of the moving member as a whole.

    摘要翻译： 本发明旨在通过冷却作为线性电动机的热源的移动部件，尽可能地抑制移动部件的温度升高，防止部件安装的精度的劣化。 直线电动机14的移动部件48为了实现本发明的目的，以如下方式构成。 也就是说，散热部分，由诸如铝的有效热传导材料制成的轴线17穿过缠绕线圈20的铁芯18。 除了轴17的一部分之外的移动部件用合成树脂模制，并且在轴线17的一端形成散热片19，其散热面积较大。 并且该散热片19被放置成面向排气口67。 通过以上述方式配置移动构件，即使线圈20产生热量，由于线圈20中的热量传递到铁芯18然后传递到轴线17并且通过散热翅片19消散，所以温度升高被抑制 。 来自散热片19的铁芯18的最外部的热量也通过轴线17传递到散热片19，导致整体上抑制了移动部件的升温。

    Mounting head of electronic component mounting apparatus
    7.
    发明申请
    Mounting head of electronic component mounting apparatus 有权
    电子元件安装装置的安装头

    公开(公告)号：US20060103151A1

    公开(公告)日：2006-05-18

    申请号：US11261940

    申请日：2005-10-31

    申请人： Yoshinao Usui ,  Haruhiko Yamaguchi ,  Ikuo Takemura ,  Manabu Okamoto

    发明人： Yoshinao Usui ,  Haruhiko Yamaguchi ,  Ikuo Takemura ,  Manabu Okamoto

    IPC分类号： A47J45/00

    CPC分类号： H05K13/0409 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191

    摘要： The invention is directed to reduction of torque by reduction of an outside diameter of a mounting head. A cylindrical cam rotation motor is provided under a nozzle rotation motor. A first rotation axis member as a rotor of the nozzle rotation motor is provided along an axis line of a nozzle holder and penetrates into the nozzle rotation motor and the cylindrical cam rotation motor. A second rotation axis member as a rotor of the cylindrical cam rotation motor is provided along an axis line of a cylindrical cam member and penetrates into the cylindrical cam rotation motor. A suction nozzle to be used protrudes from a lower end surface of the nozzle holder at a protrusion position.

    摘要翻译： 本发明旨在通过减小安装头的外径来减小扭矩。 在喷嘴旋转马达的下方设有圆柱凸轮旋转马达。 作为喷嘴旋转马达的转子的第一旋转轴构件沿喷嘴保持架的轴线设置，并且贯通喷嘴旋转马达和圆筒凸轮旋转马达。 作为圆筒凸轮旋转马达的转子的第二旋转轴构件沿圆柱形凸轮构件的轴线设置并且穿透到圆柱形凸轮旋转马达中。 要使用的吸嘴从突出位置处的喷嘴保持器的下端表面突出。

    Ceramic circuit board and method of manufacturing the same
    8.
    发明授权
    Ceramic circuit board and method of manufacturing the same 有权

    公开(公告)号：US06569514B2

    公开(公告)日：2003-05-27

    申请号：US09957040

    申请日：2001-09-21

    申请人： Takayuki Naba ,  Haruhiko Yamaguchi

    发明人： Takayuki Naba ,  Haruhiko Yamaguchi

    IPC分类号： B32B300

    CPC分类号： H01L23/15 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/381 ,  Y10T428/12472 ,  Y10T428/12993 ,  Y10T428/24926 ,  H01L2924/00

    摘要： The present invention provides a ceramic circuit board comprising: a ceramic substrate and a metal circuit portion bonded to at least one main surface of the ceramic substrate; wherein each of ratios of Ra1/Ra2 and Ra2/Ra1 is 1.5 or less in which a surface roughness in terms of arithmetical average surface roughness Ra in arbitral one direction of the ceramic substrate is Ra1 while a surface roughness Ra in a direction normal to the one direction of the ceramic substrate is Ra2, and a breakdown voltage of the ceramic substrate is 20 kV/mm or more. According to the above structure of the present invention, there can be provided a ceramic circuit board having an excellent heat-cycle resistance and bending strength characteristics without impairing a heat radiating property, and capable of increasing an operating reliability as electronic device.