摘要:
A balance filter includes two acoustic wave filters connected between a single unbalanced terminal and two balanced terminals, and a ground terminal connected to the two acoustic wave filters via a first interconnection portion and a second interconnection portion. The first interconnection portion is connected to the two acoustic wave filters, and the second interconnection portion is connected to the first interconnection portion in a region that is located between the two acoustic wave filters and extends in a direction orthogonal to a direction in which the two acoustic wave filters are aligned.
摘要:
A balance filter includes two acoustic wave filters connected between a single unbalanced terminal and two balanced terminals, and a ground terminal connected to the two acoustic wave filters via a first interconnection portion and a second interconnection portion. The first interconnection portion is connected to the two acoustic wave filters, and the second interconnection portion is connected to the first interconnection portion in a region that is located between the two acoustic wave filters and extends in a direction orthogonal to a direction in which the two acoustic wave filters are aligned.
摘要:
There is provided a method of fabricating an electronic device including flip-chip mounting a device chip on a substrate, and supplying solder between adjacent device chips by supplying the solder on the device chips and applying heat and pressure on the solder, and a contact angle of the device chip and the solder is greater than 90° with the solder melted.
摘要:
A surface acoustic wave device for implementing an attenuation characteristic outside of the pass band and the narrow band characteristics, preferably for use as a filter. The surface acoustic wave device includes a piezoelectric substrate, interdigital transducers formed on the piezoelectric substrate, and first and second reflectors disposed on the sides of the interdigital transducers. Each of the first and second reflectors includes an open electrode block with a plurality of electrically independent electrode fingers, and a short electrode block with a plurality of electrode fingers of which both ends are electrically shorted.
摘要:
A surface acoustic wave filter is free from any loss arising from the impedance mismatching by finding out optimum values achieving a widened band and lowered loss for the electrode width of the interdigital transducer and reflector electrodes. The surface acoustic wave filter includes interdigital transducers and reflectors arranged on both sides of the transducer. The piezoelectric substrate has a ratio h/&lgr; of an electrode thickness h to a surface acoustic wave wavelength &lgr; lying within the range of 0.05≦h/&lgr;0.15 and has an electrode width ratio wr/pr of a reflector electrode width wr to an electrode pitch pr lying within the range of 0.5≦wr/pr≦0.6 and has an electrode width ratio wi/pi of an interdigital transducer interdigital electrode width wi to a pitch pi lying within the range of 0.6≦wi/pi≦0.9.
摘要翻译:表面声波滤波器通过找到实现扩宽带的最佳值和降低叉指式换能器和反射器电极的电极宽度的损耗而不受由阻抗失配引起的任何损失。 表面声波滤波器包括布置在换能器两侧的叉指换能器和反射器。 压电基板的电极厚度h与表面声波波长兰德的比率h / lambd在0.05 <= h / lambd0.15的范围内,并且反射器电极宽度wr的电极宽度比wr / pr 电极间距pr在0.5 <= wr / pr <= 0.6的范围内,并且具有叉指式换能器叉指电极宽度wi的电极宽度比wi / pi至间距p 1在0.6 <= wi / pi <= 0.9。
摘要:
A package substrate includes signal pads provided on a main surface of the package substrate, footpads provided on a backside of the package substrate, and a sealing electrode provided on the main surface to surround the signal pads, the signal pads being electrically coupled to the footpads, the sealing electrode being insulated from the footpads.
摘要:
A filter includes a first filter that is connected between an input node and an output node and is a surface acoustic wave filter, and a second filter that is provided between the input node and the output node and is connected in parallel with the first filter. The first filter has a total number N1 of pairs of electrode fingers of interdigital transducers and the second filter having a total number N2 of pairs of electrode fingers of interdigital transducers, in which N1 is greater than N2.
摘要:
There is provided a method of fabricating an electronic device including flip-chip mounting a device chip on a substrate, and supplying solder between adjacent device chips by supplying the solder on the device chips and applying heat and pressure on the solder, and a contact angle of the device chip and the solder is greater than 90° with the solder melted.
摘要:
A balanced filter includes a package having an input ground metal pattern and an output ground metal pattern, and a filter chip having an inphase filter and an antiphase filter, which filters are mounted on the package, at least one of the inphase and antiphase filters having an input ground terminal connected to the input ground metal pattern and an output ground terminal connected to the output ground metal pattern, the input and output ground terminals of said at least one of the inphase and antiphase filters being separate from each other on the filter chip.
摘要:
A surface acoustic wave device for implementing an attenuation characteristic outside of the pass band and the narrow band characteristics, preferably for use as a filter. The surface acoustic wave device includes a piezoelectric substrate, interdigital transducers formed on the piezoelectric substrate, and first and second reflectors disposed on the sides of the interdigital transducers. Each of the first and second reflectors includes an open electrode block with a plurality of electrically independent electrode fingers, and a short electrode block with a plurality of electrode fingers of which both ends are electrically shorted.