公开(公告)号：US5098971A

公开(公告)日：1992-03-24

申请号：US589605

申请日：1990-09-28

申请人： Akira Nagai ,  Shin Nishimura ,  Akio Takahashi ,  Masamichi Maruta ,  Akihiro Fukui

发明人： Akira Nagai ,  Shin Nishimura ,  Akio Takahashi ,  Masamichi Maruta ,  Akihiro Fukui

IPC分类号： C08F22/40 ,  C08F20/52 ,  C08F22/36 ,  C08F122/40 ,  C08G73/12

CPC分类号： C08G73/123 ,  C08F122/40

摘要： A fluorine-containing thermosetting resin having a three-dimensional crosslinking structure is obtained by polymerizing a bismaleimide compound having the formula, ##STR1## wherein Rf is fluorine, CF.sub.3, C.sub.2 F.sub.5 or C.sub.3 F.sub.7. The resin is excellent in moldability, thermal resistance and electric properties, has a low dielectric constant, is hence suitable as a molding material and can be used for molding materials, wiring boards, layer insulation films of LSI, etc.

摘要翻译： 通过使具有下式的双马来酰亚胺化合物（其中Rf是氟，CF 3，C 2 F 5或C 3 F 7）聚合得到具有三维交联结构的含氟热固性树脂。 该树脂的成型性，耐热性和电性能优异，介电常数低，因此适合作为成型材料，可用于成型材料，线路板，LSI等的绝缘膜等。

公开(公告)号：US5308888A

公开(公告)日：1994-05-03

申请号：US20399

申请日：1993-02-22

申请人： Shin Nishimura ,  Akira Nagai ,  Akio Takahashi ,  Akio Mukoo ,  Tadashi Narita ,  Tokio Hagiwara ,  Hiroshi Hamana ,  Junichi Katagiri

发明人： Shin Nishimura ,  Akira Nagai ,  Akio Takahashi ,  Akio Mukoo ,  Tadashi Narita ,  Tokio Hagiwara ,  Hiroshi Hamana ,  Junichi Katagiri

IPC分类号： C08F136/16 ,  H05K1/03 ,  C08J3/28

CPC分类号： C08F136/16 ,  H05K1/034

摘要： According to the present invention, there is provided a resin composition which can provide an insulating resin having excellent heat resistance and flame retardance after curing and showing a low dielectric constant.A fluorine-containing photo-setting resin composition comprising a polymer containing fluorine or a fluorine-containing group represented by general formula [II]: ##STR1## wherein R.sup.1 and R.sup.2 are selected from the group consisting of H, F, CH.sub.3 and CF.sub.3 ; R.sup.3 and R.sup.4 are selected from the group consisting of CH.sub.2 and CF.sub.2 ; x and y show 0 to 4 and m shows 30 to 1000, and a photopolymerization initiator, which is a solid at ambient temperature, melts between 100.degree. and 150.degree. C., has a melt viscosity of not greater than 10.sup.6 poise and is photocurable.

摘要翻译： 根据本发明，提供一种树脂组合物，其可以提供具有优异的耐热性和固化后的阻燃性并显示低介电常数的绝缘树脂。 含氟聚合物的含氟光固化树脂组合物，其含有通式[II]表示的氟或含氟基团的聚合物：其中R 1和R 2选自H，F，CH 3 和CF3; R3和R4选自CH2和CF2; x和y表示0〜4，m表示30〜1000，环境温度为固体的光聚合引发剂在100〜150℃之间熔融，熔融粘度不大于106泊，为光固化 。

公开(公告)号：US5565536A

公开(公告)日：1996-10-15

申请号：US423344

申请日：1995-04-18

申请人： Shin Nishimura ,  Yoshinori Kawai ,  Satoru Amou ,  Akira Nagai ,  Masahiro Suzuki ,  Akio Takahashi ,  Akio Mukoh

发明人： Shin Nishimura ,  Yoshinori Kawai ,  Satoru Amou ,  Akira Nagai ,  Masahiro Suzuki ,  Akio Takahashi ,  Akio Mukoh

IPC分类号： C07D207/44 ,  C07D207/444 ,  C07D207/452 ,  C07D207/456 ,  C08F12/26 ,  C08F22/36 ,  C08F22/40 ,  C08L33/24 ,  C08L35/00 ,  C08F122/40 ,  C08F114/18 ,  C08F128/02 ,  C08F130/08

CPC分类号： C07D207/452 ,  C07D207/444 ,  C07D207/456 ,  C08F12/26 ,  C08F22/40

摘要： A polymerzable compound represented by the general formula (1) X--R.sub.1 --Y where X is an unsaturated imide group having substituents R.sub.2 and R.sub.3, or an itacon imide group where R.sub.2 and R.sub.3 are selected from the group consisting of hydrogen, a lower alkyl group and an aromatic group having a substituent p which is hydrogen, a lower alkyl group, or an alkoxy group, and Y is a styryl group, and R.sub.1 is a divalent organic group.The polymerizable compounds is excellent in formability, and find a wide variety of applications because they have functional groups different in reactivity from each other and hence allow the curing conditions to control. The cured polymers are excellent in thermal durability, mechanical properties and electrical properties, making it possible to achieve higher performance, higher reliability, highly compact and lower weight of electric apparatuses and electronic parts.

摘要翻译： 由通式（1）X-R1-Y表示的可聚合化合物，其中X是具有取代基R 2和R 3的不饱和酰亚胺基，或其中R 2和R 3选自氢，低级烷基 基团和具有取代基p的芳基，其为氢，低级烷基或烷氧基，Y为苯乙烯基，R1为二价有机基团。 可聚合化合物的成形性优异，因为它们具有彼此反应性不同的官能团，因此允许固化条件进行控制，因此得到广泛的应用。 固化的聚合物的热耐久性，机械性能和电气性能优异，可以实现电气设备和电子部件的更高的性能，更高的可靠性，高度紧凑和更低的重量。

公开(公告)号：US5410069A

公开(公告)日：1995-04-25

申请号：US986758

申请日：1992-12-08

申请人： Shin Nishimura ,  Yoshinori Kawai ,  Satoru Amou ,  Akira Nagai ,  Masahiro Suzuki ,  Akio Takahashi ,  Akio Mukoh

发明人： Shin Nishimura ,  Yoshinori Kawai ,  Satoru Amou ,  Akira Nagai ,  Masahiro Suzuki ,  Akio Takahashi ,  Akio Mukoh

IPC分类号： C07D207/44 ,  C07D207/444 ,  C07D207/452 ,  C07D207/456 ,  C08F12/26 ,  C08F22/36 ,  C08F22/40 ,  C08L33/24 ,  C08L35/00

CPC分类号： C07D207/452 ,  C07D207/444 ,  C07D207/456 ,  C08F12/26 ,  C08F22/40

摘要： A polymerzable compound represented by the general formula (1) X--R.sub.1 --Y where X is un unsaturated imide group having substituents R.sub.2 and R.sub.3, or an itacon imide group where R.sub.2 and R.sub.3 are selected from the group consisting of hydrogen, a lower alkyl group and an aromatic group having a substituent p which is hydrogen, a lower alkyl group, or an alkoxy group, and Y is a styryl group, and R.sub.1 is a divalent organic group.The polymerizable compounds is excellent in formability, and find a wide variety of applications because they have functional groups different in reactivity from each other and hence allow the curing conditions to control. The cured polymers are excellent in thermal durability, mechanical properties and electrical properties, making it possible to achieve higher performance, higher reliability, highly compact and lower weight of electric apparatuses and electronic parts.

摘要翻译： 由通式（1）X-R1-Y表示的可聚合化合物，其中X是具有取代基R2和R3的不饱和酰亚胺基，或其中R2和R3选自氢，低级烷基 基团和具有取代基p的芳基，其为氢，低级烷基或烷氧基，Y为苯乙烯基，R1为二价有机基团。 可聚合化合物的成形性优异，因为它们具有彼此反应性不同的官能团，因此允许固化条件进行控制，因此得到广泛的应用。 固化的聚合物的热耐久性，机械性能和电气性能优异，可以实现电气设备和电子部件的更高的性能，更高的可靠性，高度紧凑和更低的重量。

公开(公告)号：US5352762A

公开(公告)日：1994-10-04

申请号：US676383

申请日：1991-03-28

申请人： Akira Nagai ,  Shin Nishimura ,  Masahiro Suzuki ,  Masao Suzuki ,  Junichi Katagiri ,  Akio Takahashi ,  Akio Mukoh

发明人： Akira Nagai ,  Shin Nishimura ,  Masahiro Suzuki ,  Masao Suzuki ,  Junichi Katagiri ,  Akio Takahashi ,  Akio Mukoh

IPC分类号： C08G12/32 ,  C08G18/30 ,  C08G18/38 ,  C08G59/40 ,  C08G73/06 ,  H01B3/30 ,  H01B3/44 ,  H01L23/12 ,  H05K1/03 ,  H05K3/46 ,  C08G83/00 ,  C08G73/12

CPC分类号： H05K3/4626 ,  H05K1/0346 ,  H05K1/034 ,  H05K2201/015 ,  Y10S428/901 ,  Y10T428/31504 ,  Y10T428/31551 ,  Y10T442/2213 ,  Y10T442/2713 ,  Y10T442/2738

摘要： A multilayer printed circuit board comprising a plurality of alternately laminated layers of insulating layers and circuit conductor layers having a signal transmission delay time of 6.0 ns/m or less, excellent in heat resistance, adhesive, fire retardance, etc. can be produced by forming insulating layers using a fluorine-containing thermosetting resin composition.

摘要翻译： 包括绝缘层的多个交替层叠层和具有6.0ns / m以下的信号传输延迟时间的电路导体层的多层印刷电路板，耐热性，粘合剂，阻燃性等优异，可以通过形成 使用含氟热固性树脂组合物的绝缘层。

公开(公告)号：US5080965A

公开(公告)日：1992-01-14

申请号：US487406

申请日：1990-03-26

申请人： Katuo Sugawara ,  Akio Takahashi ,  Junichi Katagiri ,  Akira Nagai ,  Masahiro Ono ,  Toshikazu Narahara

发明人： Katuo Sugawara ,  Akio Takahashi ,  Junichi Katagiri ,  Akira Nagai ,  Masahiro Ono ,  Toshikazu Narahara

IPC分类号： C08G59/34 ,  B32B27/04 ,  B32B27/38 ,  C08F279/02 ,  C08G59/00 ,  C08G59/32 ,  C08G59/40 ,  C08J5/24 ,  C08L25/00 ,  C08L25/18 ,  C08L63/00 ,  C08L63/08 ,  H05K1/03

CPC分类号： C08J5/24 ,  C08F279/02 ,  H05K1/0353 ,  C08J2351/00 ,  Y10T428/24917 ,  Y10T442/2475 ,  Y10T442/2721 ,  Y10T442/2902 ,  Y10T442/2951 ,  Y10T442/3528

摘要： The present invention provides a thermosetting resin composition comprising(a) a prepolymer of a poly-p-hydroxystyrene derivative represented by the general formula ##STR1## wherein A is a halogen group, R.sub.1 is an alkenyl or alkenoyl group of 2 to 4 carbon atoms, 4 carbon atoms, m denotes a number of 1 to 4 and n denotes a number of 1 to 100,(b) an epoxy-modified polybutadiene, and(c) an aromatic maleimide compound, and a prepreg and a laminated sheet which use said resin composition.

公开(公告)号：US5045381A

公开(公告)日：1991-09-03

申请号：US413070

申请日：1989-09-27

申请人： Masao Suzuki ,  Junichi Katagiri ,  Akira Nagai ,  Masahiro Suzuki ,  Akio Takahashi

发明人： Masao Suzuki ,  Junichi Katagiri ,  Akira Nagai ,  Masahiro Suzuki ,  Akio Takahashi

IPC分类号： C08G18/09 ,  C08G18/62 ,  C08G18/67 ,  C08G73/10 ,  H01B3/30 ,  H05K1/03

CPC分类号： C08G18/092 ,  C08G18/6275 ,  C08G18/6705 ,  C08G18/678 ,  C08G73/1035 ,  H01B3/302 ,  H01B3/303 ,  H05K1/0346 ,  Y10S428/901 ,  Y10T156/10 ,  Y10T428/24917 ,  Y10T428/31547 ,  Y10T428/31678

摘要： A thermosetting resin composition which comprises a cyanate compound or an isocyanate compound represented by the following general formula (I):A--R.sub.1 --A (I)wherein R.sub.1 is an aromatic group, an alicyclic group or a mixed group thereof and A is a cyanate group or an isocyanate group, and a poly-(p-hydroxystyrene) derivative represented by the following general formula (II): ##STR1## wherein X is a fluorine atom, a bromine atom and a chlorine atom, R.sub.2 is an alkenyl group and an unsaturated carboxyl group, each having 2 to 4 carbon atoms, B is any one of a polymerization initiator residue, a polymerization-terminating agent residue, H and ##STR2## m is an integer of 1 to 4 and n is an integer of 5 to 100, and further containing a compound having at least one N-substituted unsaturated imido group, if required, can produce a printed circuit board of high flame retardness, low dielectric constant, low moisture absorption and a high mechanical strength at an elevated temperature.

公开(公告)号：US4970107A

公开(公告)日：1990-11-13

申请号：US383074

申请日：1989-07-21

申请人： Haruo Akahoshi ,  Kanji Murakami ,  Yoshihiro Suzuki ,  Akira Nagai ,  Kiyonori Kogawa ,  Akio Takahashi

发明人： Haruo Akahoshi ,  Kanji Murakami ,  Yoshihiro Suzuki ,  Akira Nagai ,  Kiyonori Kogawa ,  Akio Takahashi

IPC分类号： H01L21/3205 ,  H01L23/52 ,  H05K1/09 ,  H05K3/38 ,  H05K3/46

CPC分类号： H05K3/385 ,  H05K3/384 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/072 ,  H05K2203/1157 ,  H05K3/4611 ,  Y10S428/901 ,  Y10T156/10 ,  Y10T428/24917 ,  Y10T428/31 ,  Y10T428/31678

摘要： To make a composite article comprising a copper element and an adhesive material adhesively bonded to a surface thereof, the surface of the copper element is provided with knife-shaped elongate projections whose opposite flanks are at an average angle of less than 60.degree. to each other. The knife-shaped elongate projections may include rod-shaped projections much smaller than the knife-shaped projections projecting outwardly from the surface of the knife-shaped projections. The knife-shaped projections may be formed by electroless plating and the rod-shaped projections by oxidation and optionally reduction. Bonding strength is improved.

公开(公告)号：US4931507A

公开(公告)日：1990-06-05

申请号：US266406

申请日：1988-11-02

申请人： Katuo Sugawara ,  Akio Takahashi ,  Junichi Katagiri ,  Akira Nagai ,  Masahiro Ono ,  Toshikazu Narahara

发明人： Katuo Sugawara ,  Akio Takahashi ,  Junichi Katagiri ,  Akira Nagai ,  Masahiro Ono ,  Toshikazu Narahara

IPC分类号： C08G59/34 ,  B32B27/04 ,  B32B27/38 ,  C08F279/02 ,  C08G59/00 ,  C08G59/32 ,  C08G59/40 ,  C08J5/24 ,  C08L25/00 ,  C08L25/18 ,  C08L63/00 ,  C08L63/08 ,  H05K1/03

CPC分类号： C08J5/24 ,  C08F279/02 ,  H05K1/0353 ,  C08J2351/00 ,  Y10T428/24917 ,  Y10T442/2475 ,  Y10T442/2721 ,  Y10T442/2902 ,  Y10T442/2951 ,  Y10T442/3528

摘要： The present invention provides a thermosetting resin composition comprising(a) a prepolymer of a poly(p-hydroxystyrene) derivative represented by the general formula ##STR1## wherein A is a halogen group, R.sub.1 is an alkenyl or alkenoyl group of 2 to 4 carbon atoms, m denotes a number of 1 to 4 and n denotes a number of 1 to 100,(b) an epoxy-modified polybutadiene, and(c) an aromatic maleimide compound, and a prepreg and a laminated sheet which use said resin composition.

公开(公告)号：US4886858A

公开(公告)日：1989-12-12

申请号：US15325

申请日：1987-02-17

申请人： Junichi Katagiri ,  Akira Nagai ,  Keiko Tawara ,  Akio Takahashi ,  Motoyo Wajima ,  Toshikazu Narahara ,  Ryo Hiraga

发明人： Junichi Katagiri ,  Akira Nagai ,  Keiko Tawara ,  Akio Takahashi ,  Motoyo Wajima ,  Toshikazu Narahara ,  Ryo Hiraga

IPC分类号： C08L25/04 ,  C08F8/00 ,  C08F12/22 ,  C08F290/12 ,  C08F299/00 ,  C08G59/34 ,  C08L63/08 ,  H05K1/03

CPC分类号： C08G59/027 ,  C08F290/124 ,  C08F299/00 ,  C08F8/00 ,  C08L63/08 ,  H05K1/034 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31511 ,  Y10T428/31529 ,  Y10T428/31678 ,  Y10T428/31696 ,  Y10T442/674

摘要： A thermosetting resin composition comprising a special poly(p-hydroxystyrene) derivative resin and a radical polymerization initiator, and if necessary an epoxy modified polybutadiene, can provide prepregs and laminates having a low dielectric constant, a shorter signalling delay time, good heat resistance and flame retardancy and thus being suitable for producing multilayer printed circuit boards.

摘要翻译： 包含特殊聚（对 - 羟基苯乙烯）衍生物树脂和自由基聚合引发剂的热固性树脂组合物，并且如果需要，可以提供环氧改性聚丁二烯，可以提供具有低介电常数，较短的信号延迟时间，良好的耐热性和较短的信号延迟时间的预浸料和层压材料 阻燃性，因此适用于生产多层印刷电路板。