公开(公告)号：US20070277162A1

公开(公告)日：2007-11-29

申请号：US11802636

申请日：2007-05-24

申请人： Akira Tanaka ,  Fumihiro Hatano ,  Tomohiro Yamana ,  Masaaki Mineo

发明人： Akira Tanaka ,  Fumihiro Hatano ,  Tomohiro Yamana ,  Masaaki Mineo

IPC分类号： G06F9/45

CPC分类号： G06F8/4441

摘要： A high-sped block is formed by generating and connecting a new basic block (contains an intermediate code obtained by performing variable replacing processing to a path replacement target variable of the intermediate code on a hot path of an original partial program and contains a branching intermediate code where a branching instruction on the hot path is converted so as to execute the hot path), and a basic block with an intermediate code for restoring value of path guarantee variable among the path replacement target variables to a value of an original variable. When an execution result of a conditional branching intermediate code is true, the speeding up of the original program is achieved through executing the basic block, and performing dependency analysis and dependency generation between the intermediate codes in the high-speed block and scheduling of the instructions.

摘要翻译： 通过生成和连接新的基本块（包含通过对原始部分程序的热路径上的中间代码的路径替换目标变量执行可变替换处理而获得的中间代码）并且包含分支中间体 代码，其中热路径上的分支指令被转换以执行热路径），以及基本块，其具有用于将路径替换目标变量中的路径保证变量的值恢复为原始变量的值的中间代码。 当条件分支中间代码的执行结果为真时，通过执行基本块来实现原始程序的加速，并且在高速块中的中间代码和指令的调度之间执行依赖性分析和依赖关系生成 。

公开(公告)号：US20060130012A1

公开(公告)日：2006-06-15

申请号：US11269705

申请日：2005-11-09

申请人： Fumihiro Hatano ,  Akira Tanaka

发明人： Fumihiro Hatano ,  Akira Tanaka

IPC分类号： G06F9/45

CPC分类号： G06F8/4441

摘要： To provide a compiler device that generates an executable program for a computer capable of executing two or more instructions in parallel, without using compensation code in trace scheduling. The compiler device generates the executable program that causes the computer to concurrently execute code which is a substantially direct translation of the source program, and code generated by optimizing a sequence of instructions of a most frequent execution path in the source program.

摘要翻译： 提供一种编译器装置，它能够并行地执行两个或多个指令的计算机生成可执行程序，而不需要在跟踪调度中使用补偿代码。 编译器设备生成可执行程序，其使计算机同时执行代码，该代码是源程序的基本上直接的转换，以及通过优化源程序中最常执行路径的指令序列而生成的代码。

公开(公告)号：US20080155496A1

公开(公告)日：2008-06-26

申请号：US11957749

申请日：2007-12-17

申请人： Fumihiro Hatano ,  Akira Tanaka

发明人： Fumihiro Hatano ,  Akira Tanaka

IPC分类号： G06F9/315 ,  G06F9/44

CPC分类号： G06F9/3842 ,  G06F9/3851 ,  G06F9/3885 ,  G06F9/5066

摘要： A program for execution by a computer that includes a plurality of processor elements, the program comprising: a parallel execution program part to assign the plurality of processor elements one-to-one to a plurality of program parts so that the plurality of program parts are executed in parallel with each other; an execution history obtaining part to obtain and hold an execution history of each of the plurality of program parts; a parallel execution judgment part to judge whether or not to execute the plurality of program parts in parallel with each other, in accordance with the obtained execution history; and a processor element assignment control part to perform a control to determine whether to assign the plurality of processor elements to the plurality of program parts, depending on a result of the judgment made by the parallel execution judgment part.

摘要翻译： 一种用于由包括多个处理器元件的计算机执行的程序，所述程序包括：并行执行程序部分，用于将多个处理器元件一对一地分配给多个程序部分，使得所述多个程序部分是 相互并行执行; 执行历史获取部分，以获得并保持所述多个节目部分中的每一个的执行历史; 并行执行判断部，根据获得的执行历史来判断是否并行地执行多个程序部; 以及处理器单元分配控制部，其根据并行执行判断部的判定结果，执行控制以确定是否将多个处理器元件分配给多个程序部。

公开(公告)号：US20220326632A1

公开(公告)日：2022-10-13

申请号：US17657471

申请日：2022-03-31

申请人： Keiji MAKABE ,  Akira Tanaka ,  Hidekazu Kakinuma ,  Tsukiko Takahashi

发明人： Keiji MAKABE ,  Akira Tanaka ,  Hidekazu Kakinuma ,  Tsukiko Takahashi

IPC分类号： G03G9/097 ,  G03G15/08 ,  G03G9/08

摘要： [Object] An object of the invention is to provide a toner that can both achieve a higher level of low temperature fixability and suppression of the toner scattering.
[Means of Achieving the Object]
The disclosure is to provide a toner, including base-particles, and an external-additive, wherein a glass-transition temperature obtained from a DSC-curve at a second-warming of a THF-insoluble component is −50° C. or higher and 10° C. or lower, wherein an average circularity of the toner is 0.975 or more and 0.985 or lower, wherein the toner satisfies the following formula: 1.5≤Bt−0.025−Ct≤3.0, wherein the Bt [m2/g] is a BET-specific-surface area of the toner-particles, and the Ct [%] is a coverage by the external-additive, and, at least a portion of a surface of the external-additive is coated with either an oxide of a metallic element, a hydroxide of the metallic element, or both.

公开(公告)号：US10303072B2

公开(公告)日：2019-05-28

申请号：US15889461

申请日：2018-02-06

申请人： Akira Tanaka ,  Hiroyuki Takeda ,  Junichi Awamura ,  Hiroshi Yamada ,  Daichi Hisakuni ,  Yasuo Kamada

发明人： Akira Tanaka ,  Hiroyuki Takeda ,  Junichi Awamura ,  Hiroshi Yamada ,  Daichi Hisakuni ,  Yasuo Kamada

IPC分类号： G03G9/087 ,  C08G63/42 ,  C08G63/20 ,  G03G15/00 ,  C08G63/195 ,  C08G63/16 ,  C08G63/66 ,  C08G18/75 ,  C08G18/42

摘要： A toner is provided. The toner contains a polyester resin. The toner has a glass transition temperature (Tg1st) at first temperature rising of differential scanning calorimetry (DSC) of from 45° C. to 65° C. The toner includes a component insoluble in tetrahydrofuran (THF) having two glass transition temperatures (Tga1st and Tgb1st) at the first temperature rising of DSC, where Tga1st is in a range of −45° C. to 5° C. and Tgb1st is in a range of 45° C. to 70° C. The toner includes a component soluble in THF having a glass transition temperature (Tg2nd) at second temperature rising of DSC of from 40° C. to 65° C.

公开(公告)号：US08686398B2

公开(公告)日：2014-04-01

申请号：US13599852

申请日：2012-08-30

申请人： Akira Tanaka ,  Yoko Motojima

发明人： Akira Tanaka ,  Yoko Motojima

IPC分类号： H01L29/06

CPC分类号： H01L33/06 ,  H01L33/0079 ,  H01L33/22 ,  H01L33/32 ,  H01L33/38 ,  H01L33/382 ,  H01L33/387 ,  H01L33/405 ,  H01L33/42 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor light emitting device includes a first conductivity-type first semiconductor layer, a second conductivity-type second semiconductor layer, a semiconductor light emitting layer, and first and second electrodes. The semiconductor light emitting layer is provided between the first semiconductor layer and the second semiconductor layer, and includes a multiple quantum well structure. The quantum well structure includes well layers and barrier layers each laminated alternately, each of the well layers being not less than 6 nm and not more than 10 nm. The first and second electrodes are electrically connected to the first and second semiconductor layers such that current flows in a direction substantially vertical to the main surface.

摘要翻译： 半导体发光器件包括第一导电型第一半导体层，第二导电型第二半导体层，半导体发光层以及第一和第二电极。 半导体发光层设置在第一半导体层和第二半导体层之间，并且包括多量子阱结构。 量子阱结构包括交替层叠的阱层和势垒层，每个阱层不小于6nm且不大于10nm。 第一和第二电极电连接到第一和第二半导体层，使得电流在基本垂直于主表面的方向上流动。

公开(公告)号：US08570240B2

公开(公告)日：2013-10-29

申请号：US12996839

申请日：2008-06-27

申请人： Akira Tanaka ,  Machiko Oouchida ,  Hiroyuki Mori

发明人： Akira Tanaka ,  Machiko Oouchida ,  Hiroyuki Mori

IPC分类号： H01Q1/36

CPC分类号： H04B13/00

摘要： A communication sheet structure for transmitting electromagnetic waves, and thereby performing communication, is characterized in that the communication sheet structure includes a planar base material with a relative dielectric constant at a frequency of from 800 MHz to 10 GHz of from 1.0 to 15.0, and one side of the base material includes conductor A existing portion and non-existing portion, and the other side of the base material includes a conductor B existing over 90% or more thereof. The communication sheet structure enables communication in two dimensions, and the communication sheet structure is extremely excellent in communication performances.

摘要翻译： 用于传送电磁波，从而进行通信的通信片结构的特征在于，通信片结构包括平面基底材料，其相对介电常数在800MHz至10GHz的频率范围为1.0至15.0，一个 基体材料的一侧包括导体A存在部分和不存在部分，并且基材的另一侧包括存在于其中90％以上的导体B. 通信片结构使得能够在二维方面进行通信，并且通信片结构在通信性能方面非常优异。

公开(公告)号：US20130228742A1

公开(公告)日：2013-09-05

申请号：US13599852

申请日：2012-08-30

申请人： Akira Tanaka ,  Yoko Motojima

发明人： Akira Tanaka ,  Yoko Motojima

IPC分类号： H01L33/06

CPC分类号： H01L33/06 ,  H01L33/0079 ,  H01L33/22 ,  H01L33/32 ,  H01L33/38 ,  H01L33/382 ,  H01L33/387 ,  H01L33/405 ,  H01L33/42 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor light emitting device includes a first conductivity-type first semiconductor layer, a second conductivity-type second semiconductor layer, a semiconductor light emitting layer, and first and second electrodes. The semiconductor light emitting layer is provided between the first semiconductor layer and the second semiconductor layer, and includes a multiple quantum well structure. The quantum well structure includes well layers and barrier layers each laminated alternately, each of the well layers being not less than 6 nm and not more than 10 nm. The first and second electrodes are electrically connected to the first and second semiconductor layers such that current flows in a direction substantially vertical to the main surface.

摘要翻译： 半导体发光器件包括第一导电型第一半导体层，第二导电型第二半导体层，半导体发光层以及第一和第二电极。 半导体发光层设置在第一半导体层和第二半导体层之间，并且包括多量子阱结构。 量子阱结构包括交替层叠的阱层和势垒层，每个阱层不小于6nm且不大于10nm。 第一和第二电极电连接到第一和第二半导体层，使得电流在基本垂直于主表面的方向上流动。

公开(公告)号：US08410473B2

公开(公告)日：2013-04-02

申请号：US13291176

申请日：2011-11-08

申请人： Akira Tanaka

发明人： Akira Tanaka

IPC分类号： H01L29/06

CPC分类号： H01L33/06 ,  B82Y20/00 ,  H01L33/025 ,  H01L33/32 ,  H01S5/309 ,  H01S5/34333

摘要： A light emitting device includes: a first layer made of a semiconductor of a first conductivity type; a second layer made of a semiconductor of a second conductivity type; an active layer including a multiple quantum well provided between the first layer and the second layer, impurity concentration of the first conductivity type in each barrier layer of the multiple quantum well having a generally flat distribution or increasing toward the second layer, average of the impurity concentration in the barrier layer on the second layer side as viewed from each well layer of the multiple quantum well being equal to or greater than average of the impurity concentration in the barrier layer on the first layer side, and average of the impurity concentration in the barrier layer nearest to the second layer being higher than average of the impurity concentration in the barrier layer nearest to the first layer.

摘要翻译： 发光器件包括：由第一导电类型的半导体制成的第一层; 由第二导电类型的半导体制成的第二层; 包括设置在第一层和第二层之间的多量子阱的有源层，多量子阱的每个势垒层中的第一导电类型的杂质浓度具有大致平坦的分布或朝着第二层增加，杂质的平均值 从多量子阱的各阱层观察的第二层侧的阻挡层的浓度等于或大于第一层侧的阻挡层中的杂质浓度的平均值，以及 最靠近第二层的阻挡层高于最靠近第一层的势垒层中的杂质浓度的平均值。

公开(公告)号：US08035212B2

公开(公告)日：2011-10-11

申请号：US12621387

申请日：2009-11-18

申请人： Akira Tanaka ,  Minoru Takizawa ,  Mitsuyoshi Tanimoto ,  Akihiko Happoya

发明人： Akira Tanaka ,  Minoru Takizawa ,  Mitsuyoshi Tanimoto ,  Akihiko Happoya

IPC分类号： H01L23/48

CPC分类号： H01L21/563 ,  H01L23/295 ,  H01L23/3121 ,  H01L24/743 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/0401

摘要： According to one embodiment, a semiconductor chip mounting body, with an enhanced shock-resistance at portions of the bonding member corresponding to the corners of a semiconductor chip, is provided. The semiconductor chip mounting body includes a circuit board having a circuit pattern formed on a mounting surface thereof, a semiconductor chip mounted on the circuit pattern of the circuit board, and a bonding member arranged at least between the circuit board and the semiconductor chip, and on the sides of the semiconductor chip to fix the semiconductor chip on the circuit board. The bonding member contains thermosetting resin and magnetic powder dispersed in the thermosetting resin. The magnetic powder is locally disposed in portions of the bonding member which is located the corners of the semiconductor chip.

摘要翻译： 根据一个实施例，提供一种半导体芯片安装体，其在与半导体芯片的角部对应的接合部件的部分处具有增强的抗冲击性。 半导体芯片安装体包括电路板，其电路图案形成在其安装表面上，安装在电路板的电路图案上的半导体芯片和至少布置在电路板和半导体芯片之间的接合部件，以及 在半导体芯片的侧面上将半导体芯片固定在电路板上。 接合部件包含分散在热固性树脂中的热固性树脂和磁性粉末。 磁性粉末局部地设置在位于半导体芯片的角部的接合部件的部分中。