摘要:
A spectroscopic sensor that applies lights in a wavelength band containing plural wavelengths to an object and spectroscopically separates reflected lights or transmitted lights from the object using plural light band-pass filters that transmit the respective specific wavelengths and plural photosensor parts to which corresponding transmitted lights are input based on output results of independent photosensors. The spectroscopic sensor may be integrated in a semiconductor device or module by integration using a semiconductor process and downsizing may be realized.
摘要:
A spectroscopic sensor has plural angle limiting filters that limit incident angles of incident lights, plural light band-pass filters that transmit specific wavelengths, and plural photodiodes to which corresponding transmitted lights are input. The spectroscopic sensor is a semiconductor device in which the angle limiting filters, the light band-pass filters, and the photodiodes are integrated, and, assuming that the surface on which impurity regions for the photodiodes are formed is a front surface of a semiconductor substrate, holes for receiving lights are formed in the impurity regions from the rear surface side.
摘要:
A laser beam source device includes a light source that emits light of a first wavelength, a wavelength converting element that converts a wavelength of the light of the first wavelength entered into a second wavelength, a multi-layer film mirror having a characteristic of reflecting light of the first wavelength and transmitting light of the second wavelength, a band-pass filter having a band-pass characteristic near the first wavelength is formed, a reflection mirror that branches the light transmitted through the multi-layer film mirror to the first optical path and a second optical path, a laser-power measuring unit that measures power of the light branched to the second optical path, and a control unit that performs angle adjustment for displacing a tilt angle of the band-pass filter.
摘要:
A laser source device includes a laser source for oscillating a laser beam with a predetermined wavelength, a mirror for reflecting the laser beam emitted from the laser source to form a resonator, and including a dielectric multilayer film having a property of reflecting a light beam with an oscillation wavelength and transmitting a light beam with a conversion wavelength, a wavelength conversion element disposed between the laser source and the mirror for converting the laser beam with the oscillation wavelength emitted from the laser source and emitting a laser beam with the conversion wavelength, and a bandpass filter disposed between the laser source and the mirror, and including a bandpass filter multilayer film having a bandpass property at least around the oscillation wavelength.
摘要:
In fabrication of a light guiding unit, a half mirror layer as a reflection film for folding light is covered by a light transmission main body part as a coating member, i.e., a light transmission member, and a hard coating layer is deposited thereon. Therefore, even when the surfaces of a light guide main body part and the light transmission main body part forming the light guiding unit are cleansed as pre-processing of the deposition of the hard coating layer, the situations such that the half mirror layer is separated thereby may be avoided and optical properties of the half mirror layer may not be lost.
摘要:
A thickness of a tapered part provided at the deeper side (−X side) in a light guide direction of a light transmission member is smaller toward the deeper side, and thus, a reflection angle of ghost light that has passed through a fourth reflection surface provided with a half mirror layer and reached the light transmission member gradually becomes smaller within the tapered part and no longer satisfies a total reflection condition, and the light is ejected to the outside in the position diverging from an eye of an observer. That is, the tapered part may prevent the ghost light from reaching the eye and good see-through observation can be realized.
摘要:
Since a distance from an image extraction part to a light exiting surface is shorter downstream in an optical path than upstream in the optical path in relation to Z direction that is an arraying direction of reflection units, image light that propagates to pass between the image extraction part and the light exiting surface without becoming incident on the reflection units and therefore cannot be extracted to outside can be reduced. That is, since image light having a large total reflection angle in a light guide plate can be securely made incident on the image extraction part and efficiently extracted from the light exiting surface, light use efficiency in image formation can be enhanced. Thus, a virtual image display apparatus with brightness and high performance can be provided.
摘要:
In one embodiment, a semiconductor substrate has first and second principal surfaces opposite to each other, and has a penetration hole extending from the first principal surface to the second principal surface. An imaging element portion is formed on the first principal surface side. A first insulating film is formed on the first principal surface side. An interconnection electrode is formed in the first insulating film and connected to the imaging element portion. A second insulating film is provided to cover a surface of the penetration hole and the second principal surface except at least a portion facing the interconnection electrode. The second insulating film contains particles and is configured to intercept an infrared ray and to transmit a visible light. A conductor film contacts the interconnection electrode and is formed on the second insulating film.
摘要:
A semiconductor device comprises a semiconductor substrate, a through contact and a metal film. The semiconductor substrate has a semiconductor element at a first face. The wiring pattern includes a grounding line and is located at a side of a second face opposite to the first face of the semiconductor substrate. The through contact penetrates the semiconductor substrate from the first face to the second face and electrically connects between the semiconductor element and the wiring pattern. The metal film is located between the second face of the semiconductor substrate and a face where the wiring pattern exists and electrically connected with the grounding line.
摘要:
A damper 8 supports a yoke portion 16, 17 holding a magnet 18 therein. The damper 8 includes an annular yoke retainer portion 8a holding the yoke portion, a plurality of support portions 8b projecting radially outward from the yoke retainer portion 8a, a plurality of suspension spring portions 8c extending from each of the plurality of support portions 8b to an adjacent support portion along a periphery of the yoke retainer portion 8a, and a plurality of T-shaped projections 8T provided on an end of each of the plurality of suspension spring portions 8c. The plurality of T-shaped projections 8T are respectively fitted in notches K in a case so that the yoke portion 16, 17 is movable relative to the case. Because the damper 8 can be fixed to the case without any screws, the electromechanical vibration converter can readily be assembled and produced in a speaker manufacturing line.