-
公开(公告)号：US20050041367A1
公开(公告)日：2005-02-24
申请号：US10914129
申请日：2004-08-10
申请人： Akitoshi Yoshii , Masanori Yamamoto
发明人： Akitoshi Yoshii , Masanori Yamamoto
CPC分类号： H01G2/065 , H01G4/228 , H01G4/232 , H05K3/3426 , H05K2201/10651 , Y02P70/613
摘要： An electronic component includes: an element having a pair of terminal electrodes; and a pair of metal terminals formed of metal materials respectively and connected to the pair of terminal electrodes respectively, in which: a portion of the metal terminal that extends from a base-end side of the metal terminal connectable to an external circuit to face the terminal electrode of the element is an electrode facing portion; and a tip side portion of the metal terminal in the electrode facing portion is connected to the terminal electrode, and a gap exists between a base-end side portion of the metal terminal in the electrode facing portion and the terminal electrode. Therefore, the electronic component is capable of fully absorbing a stress and realizes reduction in production cost.
-
公开(公告)号：US06940708B2
公开(公告)日：2005-09-06
申请号：US10914129
申请日：2004-08-10
申请人： Akitoshi Yoshii , Masanori Yamamoto
发明人： Akitoshi Yoshii , Masanori Yamamoto
CPC分类号： H01G2/065 , H01G4/228 , H01G4/232 , H05K3/3426 , H05K2201/10651 , Y02P70/613
摘要： An electronic component includes: an element having a pair of terminal electrodes; and a pair of metal terminals formed of metal materials respectively and connected to the pair of terminal electrodes respectively, in which: a portion of the metal terminal that extends from a base-end side of the metal terminal connectable to an external circuit to face the terminal electrode of the element is an electrode facing portion; and a tip side portion of the metal terminal in the electrode facing portion is connected to the terminal electrode, and a gap exists between a base-end side portion of the metal terminal in the electrode facing portion and the terminal electrode. Therefore, the electronic component is capable of fully absorbing a stress and realizes reduction in production cost.
摘要翻译： 电子部件包括：具有一对端子电极的元件; 以及一对金属端子，分别由金属材料构成并且分别连接到所述一对端子电极，其中：所述金属端子的从所述金属端子的基端侧延伸的部分可连接到外部电路以面对 元件的端子电极是面对电极的部分; 并且电极对置部分中的金属端子的尖端侧部分连接到端子电极，并且在电极对置部分中的金属端子的基端侧部分和端子电极之间存在间隙。 因此，电子部件能够充分吸收应力，实现生产成本的降低。
-
公开(公告)号：US07518849B2
公开(公告)日：2009-04-14
申请号：US11727868
申请日：2007-03-28
IPC分类号： H01G4/06
CPC分类号： H01G4/0085 , H01G4/1227 , H01G4/30
摘要： A production method of a multilayer electronic device having an element body configured by alternately stacked dielectric layers formed by using dielectric paste and internal electrode layers formed by using conductive paste: wherein an adding quantity of a co-material included in conductive paste for forming internal electrode layers at the outermost positions in the stacking direction is larger than an adding quantity of a co-material included in conductive paste for forming internal electrode layers at the center position in the stacking direction when adding conductive particles and co-material particles to the conductive paste.
摘要翻译： 一种多层电子器件的制造方法，其具有通过使用电介质糊料形成的交替堆叠的电介质层和通过使用导电性糊料形成的内部电极层而构成的元件体，其中，包含在形成内部电极的导电性糊料中的共同材料的添加量 层叠方向上的最外侧位置的层比在导电性糊料中添加导电性粒子和助体材料粒子时，在叠层方向的中央位置形成内部电极层的导电性糊剂中所含的共同材料的添加量大 。
-
公开(公告)号：US07304831B2
公开(公告)日：2007-12-04
申请号：US11347296
申请日：2006-02-06
申请人： Akitoshi Yoshii , Taisuke Ahiko , Atsushi Takeda , Shirou Ootsuki , Shinya Onodera , Miki Kimura , Hiromi Kikuchi
发明人： Akitoshi Yoshii , Taisuke Ahiko , Atsushi Takeda , Shirou Ootsuki , Shinya Onodera , Miki Kimura , Hiromi Kikuchi
IPC分类号： H01G4/06
CPC分类号： H01G4/2325
摘要： A multilayer capacitor comprises a ceramic sintered body, an internal electrode disposed in the ceramic sintered body, and an external electrode disposed on an external surface of the ceramic sintered body. The external electrode has a first electrode layer formed on the external surface of the ceramic sintered body, a second electrode layer formed on the first electrode layer, and a conductive resin layer formed on the second electrode layer. The internal electrode and the first electrode layer consist primarily of a base metal. The second electrode layer consists primarily of a noble metal or a noble metal alloy. The conductive resin layer contains a noble metal or a noble metal alloy as a conductive material.
摘要翻译： 多层电容器包括陶瓷烧结体，设置在陶瓷烧结体中的内部电极和设置在陶瓷烧结体的外表面上的外部电极。 外部电极具有形成在陶瓷烧结体的外表面上的第一电极层，形成在第一电极层上的第二电极层和形成在第二电极层上的导电树脂层。 内部电极和第一电极层主要由贱金属组成。 第二电极层主要由贵金属或贵金属合金构成。 导电性树脂层含有作为导电材料的贵金属或贵金属合金。
-
公开(公告)号：US07585802B2
公开(公告)日：2009-09-08
申请号：US12292042
申请日：2008-11-10
申请人： Kazushige Ito , Akira Sato , Akitoshi Yoshii , Masayuki Okabe , Atsushi Takeda , Takaki Shinkawa
发明人： Kazushige Ito , Akira Sato , Akitoshi Yoshii , Masayuki Okabe , Atsushi Takeda , Takaki Shinkawa
IPC分类号： C04B35/468
CPC分类号： H01G4/1227 , C04B35/468 , C04B35/6262 , C04B35/62675 , C04B35/62685 , C04B35/62805 , C04B35/62807 , C04B35/638 , C04B2235/3203 , C04B2235/3206 , C04B2235/3208 , C04B2235/3213 , C04B2235/3215 , C04B2235/3224 , C04B2235/3225 , C04B2235/3236 , C04B2235/3239 , C04B2235/3248 , C04B2235/3256 , C04B2235/3258 , C04B2235/3262 , C04B2235/3409 , C04B2235/3418 , C04B2235/3436 , C04B2235/3454 , C04B2235/6562 , C04B2235/6567 , C04B2235/6582 , C04B2235/6584 , C04B2235/6588 , C04B2235/663 , C04B2235/78 , C04B2235/785 , H01G4/30
摘要： A dielectric ceramic composition comprised of at least dielectric particles having barium titanate as its main ingredient, wherein the ratio of dielectric particles having a surface diffusion structure comprised of a main ingredient phase comprised of the main ingredient and a diffusion phase present around the main ingredient phase with respect to said dielectric particles is 60% or more and the ratio of dielectric particles having a domain in the main ingredient phase with respect to the dielectric particles having the surface diffusion structure is 20% or less. According to the present invention, a dielectric ceramic composition and electronic device realizing good high temperature accelerated life can be provided.
摘要翻译： 一种电介质陶瓷组合物，其至少包括具有钛酸钡作为主要成分的电介质颗粒，其中具有表面扩散结构的电介质颗粒的比例包括主要成分相和主要成分相间的扩散相， 相对于所述电介质粒子为60％以上，并且在主成分相中具有畴的电介质粒子相对于具有表面扩散结构的电介质粒子的比率为20％以下。 根据本发明，可以提供实现良好的高温加速寿命的电介质陶瓷组合物和电子器件。
-
公开(公告)号：US07584853B2
公开(公告)日：2009-09-08
申请号：US11313620
申请日：2005-12-22
IPC分类号： B65D85/00
CPC分类号： H05K13/0084 , Y10S206/813
摘要： The present invention is an electronic component series, comprising a carrier tape which has a plurality of storage recesses cyclically arranged along the longitudinal direction, electronic components to be stored in the plurality of storage recesses, a cover tape established to cover the plurality of storage recesses of the carrier tape, and a pair of adhesive regions which adhere to the carrier tape and to the cover tape, and extend along the longitudinal direction of the carrier tape so as to enclose the plurality of storage recesses from both sides, wherein the adhesive width of the pair of adhesive regions is cyclically increased in size corresponding to the storage recesses respectively. With this electronic component series, the difference in the peel strength of the cover tape between the first adhesive regions and the second adhesive regions can be sufficiently reduced.
摘要翻译： 本发明是一种电子部件系列，其包括载带，该载带具有沿着长度方向周期布置的多个存储凹部，要存储在多个存储凹部中的电子部件，覆盖多个存储凹部的盖带 的载带，以及粘合到载带和盖带的一对粘合区域，并且沿着载带的纵向方向延伸以便从两侧包围多个存储凹部，其中粘合宽度 一对粘合剂区域分别相应于储存凹槽的尺寸周期性地增加。 利用该电子部件系列，可以充分降低第一粘合区域和第二粘合区域之间的覆盖带的剥离强度的差异。
-
公开(公告)号：US07177138B2
公开(公告)日：2007-02-13
申请号：US11295487
申请日：2005-12-07
申请人： Akitoshi Yoshii , Taisuke Ahiko , Shirou Ootsuki , Takashi Aoki , Akira Goshima , Hiroki Houchi
发明人： Akitoshi Yoshii , Taisuke Ahiko , Shirou Ootsuki , Takashi Aoki , Akira Goshima , Hiroki Houchi
IPC分类号： H01G4/228
摘要： A chip-type electronic component comprises a chip element body including an inner circuit element, and a pair of terminal electrodes electrically connected to the inner circuit element. The pair of terminal electrodes are positioned at respective end portions of the chip element body. The chip element body has one side face acting as a mounting surface opposing a circuit substrate. The pair of terminal electrodes include an electrode portion formed on the mounting surface. Here, it is assumed that a first direction is a direction orthogonal to the mounting surface, a second direction is a direction along which the pair of terminal electrodes oppose each other on the mounting surface, and a third direction is a direction orthogonal to the first and second directions. A first length of the electrode portion along the second direction from an edge portion of the mounting surface at a center region in the third direction is set longer than a second length of the electrode portion along the second direction from the edge portion of the mounting surface at both end regions in the third direction.
摘要翻译： 芯片型电子部件包括具有内部电路元件的芯片元件主体和与内部电路元件电连接的一对端子电极。 一对端子电极位于芯片元件本体的各个端部。 芯片元件主体具有作为与电路基板相对的安装面的一个侧面。 一对端子电极包括形成在安装面上的电极部。 这里，假设第一方向是与安装面正交的方向，第二方向是一对端子电极在安装面上彼此相对的方向，第三方向是与第一方向正交的方向 和第二个方向。 电极部分沿着第二方向的第一长度从安装表面的沿第三方向的中心区域的边缘部分的长度设定为比安装表面的边缘部分沿着第二方向的电极部分的第二长度长 在第三方向的两端区域。
-
公开(公告)号：US20060193103A1
公开(公告)日：2006-08-31
申请号：US11347367
申请日：2006-02-06
申请人： Akitoshi Yoshii , Taisuke Ahiko , Masumi Miyairi , Akio Kikuchi
发明人： Akitoshi Yoshii , Taisuke Ahiko , Masumi Miyairi , Akio Kikuchi
IPC分类号： H01G4/228
CPC分类号： H01G4/232 , H01G4/008 , H01G4/30 , H01G13/006
摘要： An electronic component comprises an element body, and a terminal electrode disposed on the element body. The terminal electrode has a first electrode layer, a second electrode layer, and a third electrode layer. The first electrode layer is formed on an external surface of the element body and formed by baking of a conductive paste. The second electrode layer is formed by Ni plating on the first electrode layer. The third electrode layer is formed by Sn plating or Sn alloy plating on the second electrode layer. A thickness of the second electrode layer is set in a range of not less than 5 μm, and less than 8 μm.
摘要翻译： 电子部件包括元件主体和设置在元件主体上的端子电极。 端子电极具有第一电极层，第二电极层和第三电极层。 第一电极层形成在元件体的外表面上，并通过烘烤导电膏形成。 在第一电极层上通过Ni电镀形成第二电极层。 第三电极层通过在第二电极层上的Sn电镀或Sn合金镀层形成。 第二电极层的厚度设定在5μm以上且小于8μm的范围内。
-
公开(公告)号：US20060138019A1
公开(公告)日：2006-06-29
申请号：US11313620
申请日：2005-12-22
IPC分类号： B65D85/00
CPC分类号： H05K13/0084 , Y10S206/813
摘要： The present invention is an electronic component series, comprising a carrier tape which has a plurality of storage recesses cyclically arranged along the longitudinal direction, electronic components to be stored in the plurality of storage recesses, a cover tape established to cover the plurality of storage recesses of the carrier tape, and a pair of adhesive regions which adhere to the carrier tape and to the cover tape, and extend along the longitudinal direction of the carrier tape so as to enclose the plurality of storage recesses from both sides, wherein the adhesive width of the pair of adhesive regions is cyclically increased in size corresponding to the storage recesses respectively. With this electronic component series, the difference in the peel strength of the cover tape between the first adhesive regions and the second adhesive regions can be sufficiently reduced.
-
公开(公告)号：US06958899B2
公开(公告)日：2005-10-25
申请号：US10801851
申请日：2004-03-17
CPC分类号： H01G4/228 , H01G2/065 , H05K3/3426 , H05K2201/10636 , H05K2201/10946 , Y02P70/611 , Y02P70/613
摘要： Terminal electrodes 11 and 12 of a main body 2 of a multilayer capacitor 1 are connected to electrode connection parts 21A and 22A of a pair of external terminals 21 and 22 formed by a metal material. At the bottom part of the electrode connection part 21A, an external connection part 21B connected to the electrode connection part 21A is formed. At the bottom part of the electrode connection part 22A, an external connection part 22B connected to the electrode connection part 22A is formed. The widths of the terminal electrodes 11 and 12 and the widths of the external connection parts 21B and 22B are substantially the same, but the widths of the electrode connection parts 21A and 22A are formed narrower. Due to this, propagation of vibration can be suppressed and generation of noise reduced.
摘要翻译： 多层电容器1的主体2的端子电极11和12连接到由金属材料形成的一对外部端子21和22的电极连接部分21A和22A。 在电极连接部21A的底部形成有与电极连接部21A连接的外部连接部21B。 在电极连接部22A的底部形成有与电极连接部22A连接的外部连接部22B。 端子电极11和12的宽度和外部连接部分21B和22B的宽度基本相同，但是电极连接部分21A和22A的宽度形成得更窄。 由此，可以抑制振动的传播，降低噪声的产生。
-
-
-
-
-
-
-
-
-
搜索结果
34 条记录 (耗时 0.028 秒)
