公开(公告)号：US07402872B2

公开(公告)日：2008-07-22

申请号：US11336160

申请日：2006-01-20

申请人： Anand S. Murthy ,  Glenn A. Glass ,  Andrew N. Westmeyer ,  Michael L. Hattendorf ,  Tahir Ghani

发明人： Anand S. Murthy ,  Glenn A. Glass ,  Andrew N. Westmeyer ,  Michael L. Hattendorf ,  Tahir Ghani

IPC分类号： H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113

CPC分类号： H01L29/7834 ,  H01L29/665 ,  H01L29/66636

摘要： A method is described for manufacturing an n-MOS semiconductor transistor. Recesses are formed in a semiconductor substrate adjacent a gate electrode structure. Silicon is embedded in the recesses via a selective epitaxial growth process. The epitaxial silicon is in-situ alloyed with substitutional carbon and in-situ doped with phosphorus. The silicon-carbon alloy generates a uniaxial tensile strain in the channel region between the source and drain, thereby increasing electron channel mobility and the transistor's drive current. The silicon-carbon alloy decreases external resistances by reducing contact resistance between source/drain and silicide regions and by reducing phosphorous diffusivity, thereby permitting closer placement of the transistor's source/drain and channel regions.

摘要翻译： 描述了制造n-MOS半导体晶体管的方法。 在与栅电极结构相邻的半导体衬底中形成凹部。 硅通过选择性外延生长工艺嵌入凹槽中。 外延硅与替代原位合金化并原位掺磷。 硅碳合金在源极和漏极之间的沟道区域中产生单轴拉伸应变，从而增加电子通道迁移率和晶体管的驱动电流。 硅碳合金通过降低源极/漏极和硅化物区域之间的接触电阻并且通过减少磷扩散性来降低外部电阻，从而允许晶体管的源极/漏极和沟道区域更接近地放置。

公开(公告)号：US09728464B2

公开(公告)日：2017-08-08

申请号：US13560513

申请日：2012-07-27

申请人： Glenn A. Glass ,  Daniel B. Aubertine ,  Anand S. Murthy ,  Gaurav Thareja ,  Tahir Ghani

发明人： Glenn A. Glass ,  Daniel B. Aubertine ,  Anand S. Murthy ,  Gaurav Thareja ,  Tahir Ghani

IPC分类号： H01L21/335 ,  H01L21/8238 ,  H01L29/10

CPC分类号： H01L21/823807 ,  H01L21/823814 ,  H01L21/823821 ,  H01L21/8258 ,  H01L29/1054

摘要： Techniques are disclosed for customization of fin-based transistor devices to provide a diverse range of channel configurations and/or material systems within the same integrated circuit die. In accordance with one example embodiment, sacrificial fins are removed and replaced with custom semiconductor material of arbitrary composition and strain suitable for a given application. In one such case, each of a first set of the sacrificial fins is recessed or otherwise removed and replaced with a p-type material, and each of a second set of the sacrificial fins is recessed or otherwise removed and replaced with an n-type material. The p-type material can be completely independent of the process for the n-type material, and vice-versa. Numerous other circuit configurations and device variations are enabled using the techniques provided herein.

公开(公告)号：US20130285155A1

公开(公告)日：2013-10-31

申请号：US13976074

申请日：2011-12-20

申请人： Glenn A. Glass ,  Anand S. Murthy ,  Tahir Ghani

发明人： Glenn A. Glass ,  Anand S. Murthy ,  Tahir Ghani

IPC分类号： H01L27/092

CPC分类号： H01L29/78618 ,  H01L21/76805 ,  H01L21/76886 ,  H01L21/76895 ,  H01L21/823807 ,  H01L21/823814 ,  H01L21/823821 ,  H01L21/823871 ,  H01L27/092 ,  H01L27/0924 ,  H01L29/0669 ,  H01L29/0673 ,  H01L29/0847 ,  H01L29/1037 ,  H01L29/267 ,  H01L29/41791 ,  H01L29/42392 ,  H01L29/66545 ,  H01L29/78 ,  H01L29/78654 ,  H01L29/78684 ,  H01L29/78696

摘要： Techniques are disclosed for forming transistor devices having reduced parasitic contact resistance relative to conventional devices. In some example embodiments, the techniques can be used to implement the contacts of MOS transistors of a CMOS device, where an intermediate III-V semiconductor material layer is provided between the p-type and n-type source/drain regions and their respective contact metals to significantly reduce contact resistance. The intermediate III-V semiconductor material layer may have a small bandgap (e.g., lower than 0.5 eV) and/or otherwise be doped to provide the desired conductivity. The techniques can be used on numerous transistor architectures (e.g., planar, finned, and nanowire transistors), including strained and unstrained channel structures.

摘要翻译： 公开了用于形成相对于常规器件具有降低的寄生接触电阻的晶体管器件的技术。 在一些示例性实施例中，该技术可以用于实现CMOS器件的MOS晶体管的触点，其中在p型和n型源极/漏极区之间提供中间III-V半导体材料层及其各自的触点 金属显着降低接触电阻。 中间III-V半导体材料层可以具有小的带隙（例如，低于0.5eV）和/或以其它方式被掺杂以提供期望的导电性。 这些技术可以用于许多晶体管架构（例如，平面，鳍状和纳米线晶体管），包括应变和无约束通道结构。

公开(公告)号：US20130277752A1

公开(公告)日：2013-10-24

申请号：US13976075

申请日：2011-12-20

申请人： Glenn A. Glass ,  Anand S. Murthy ,  Tahir Ghani

发明人： Glenn A. Glass ,  Anand S. Murthy ,  Tahir Ghani

IPC分类号： H01L27/092 ,  H01L21/8238

CPC分类号： H01L27/0922 ,  H01L21/28185 ,  H01L21/28525 ,  H01L21/28575 ,  H01L21/76814 ,  H01L21/823814 ,  H01L21/823821 ,  H01L21/8258 ,  H01L23/535 ,  H01L27/0605 ,  H01L27/0924 ,  H01L29/0669 ,  H01L29/0847 ,  H01L29/16 ,  H01L29/165 ,  H01L29/20 ,  H01L29/267 ,  H01L29/41725 ,  H01L29/41783 ,  H01L29/41791 ,  H01L29/42392 ,  H01L29/517 ,  H01L29/66545 ,  H01L29/6659 ,  H01L29/66636 ,  H01L29/7834 ,  H01L29/7848 ,  H01L2924/0002 ,  H01L2924/00

摘要： Techniques are disclosed for forming low contact resistance transistor devices. A p-type germanium layer is provided between p-type source/drain regions and their respective contact metals, and an n-type III-V semiconductor material layer is provided between n-type source/drain regions and their respective contact metals. The n-type III-V semiconductor material layer may have a small bandgap (e.g.,

公开(公告)号：US20160086951A1

公开(公告)日：2016-03-24

申请号：US14948083

申请日：2015-11-20

申请人： Seiyon Kim ,  Kelin J. Kuhn ,  Tahir Ghani ,  Anand S. Murthy ,  Annalisa Cappellani ,  Stephen M. Cea ,  Rafael Rios ,  Glenn A. Glass

发明人： Seiyon Kim ,  Kelin J. Kuhn ,  Tahir Ghani ,  Anand S. Murthy ,  Annalisa Cappellani ,  Stephen M. Cea ,  Rafael Rios ,  Glenn A. Glass

IPC分类号： H01L27/092 ,  H01L21/8238 ,  H01L29/423 ,  H01L29/06 ,  H01L29/10

CPC分类号： H01L21/823821 ,  B82Y10/00 ,  H01L21/8238 ,  H01L21/823807 ,  H01L21/823828 ,  H01L21/84 ,  H01L21/845 ,  H01L27/092 ,  H01L27/0924 ,  H01L27/12 ,  H01L27/1203 ,  H01L27/1211 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/1033 ,  H01L29/42356 ,  H01L29/42392 ,  H01L29/66439 ,  H01L29/775 ,  H01L29/7853

摘要： Complimentary metal-oxide-semiconductor nanowire structures are described. For example, a semiconductor structure includes a first semiconductor device. The first semiconductor device includes a first nanowire disposed above a substrate. The first nanowire has a mid-point a first distance above the substrate and includes a discrete channel region and source and drain regions on either side of the discrete channel region. A first gate electrode stack completely surrounds the discrete channel region of the first nanowire. The semiconductor structure also includes a second semiconductor device. The second semiconductor device includes a second nanowire disposed above the substrate. The second nanowire has a mid-point a second distance above the substrate and includes a discrete channel region and source and drain regions on either side of the discrete channel region. The first distance is different from the second distance. A second gate electrode stack completely surrounds the discrete channel region of the second nanowire.

摘要翻译： 描述了免费的金属氧化物半导体纳米线结构。 例如，半导体结构包括第一半导体器件。 第一半导体器件包括设置在衬底之上的第一纳米线。 第一纳米线具有在衬底上方的第一距离的中点，并且包括在离散通道区域的任一侧上的离散沟道区域和源极和漏极区域。 第一栅极电极堆叠完全包围第一纳米线的离散通道区域。 半导体结构还包括第二半导体器件。 第二半导体器件包括设置在衬底上方的第二纳米线。 第二纳米线在衬底上方具有第二距离的中点，并且包括在离散通道区域的任一侧上的离散沟道区域和源极和漏极区域。 第一距离与第二距离不同。 第二栅极电极堆叠完全围绕第二纳米线的离散通道区域。

公开(公告)号：US20150060945A1

公开(公告)日：2015-03-05

申请号：US14535387

申请日：2014-11-07

申请人： Anand S. Murthy ,  Glenn A. Glass ,  Tahir Ghani ,  Ravi Pillarisetty ,  Niloy Mukherjee ,  Jack T. Kavalieros ,  Roza Kotlyar ,  Willy Rachmady ,  Mark Y. Liu

发明人： Anand S. Murthy ,  Glenn A. Glass ,  Tahir Ghani ,  Ravi Pillarisetty ,  Niloy Mukherjee ,  Jack T. Kavalieros ,  Roza Kotlyar ,  Willy Rachmady ,  Mark Y. Liu

IPC分类号： H01L29/36 ,  H01L21/02 ,  H01L29/78 ,  H01L29/66 ,  H01L29/165 ,  H01L29/08

CPC分类号： H01L29/0676 ,  H01L21/02532 ,  H01L21/28512 ,  H01L21/28525 ,  H01L21/3215 ,  H01L21/76831 ,  H01L23/535 ,  H01L27/092 ,  H01L27/0924 ,  H01L29/0615 ,  H01L29/0847 ,  H01L29/086 ,  H01L29/165 ,  H01L29/167 ,  H01L29/36 ,  H01L29/41791 ,  H01L29/42392 ,  H01L29/45 ,  H01L29/456 ,  H01L29/4966 ,  H01L29/66477 ,  H01L29/66545 ,  H01L29/6659 ,  H01L29/66628 ,  H01L29/66636 ,  H01L29/66681 ,  H01L29/66931 ,  H01L29/7785 ,  H01L29/78 ,  H01L29/7816 ,  H01L29/7833 ,  H01L29/7848 ,  H01L29/785 ,  H01L29/7851

摘要： Techniques are disclosed for forming transistor devices having source and drain regions with high concentrations of boron doped germanium. In some embodiments, an in situ boron doped germanium, or alternatively, boron doped silicon germanium capped with a heavily boron doped germanium layer, are provided using selective epitaxial deposition in the source and drain regions and their corresponding tip regions. In some such cases, germanium concentration can be, for example, in excess of 50 atomic % and up to 100 atomic %, and the boron concentration can be, for instance, in excess of 1E20 cm−3. A buffer providing graded germanium and/or boron concentrations can be used to better interface disparate layers. The concentration of boron doped in the germanium at the epi-metal interface effectively lowers parasitic resistance without degrading tip abruptness. The techniques can be embodied, for instance, in planar or non-planar transistor devices.

摘要翻译： 公开了用于形成具有高掺杂硼掺杂锗的源区和漏区的晶体管器件的技术。 在一些实施例中，使用在源极和漏极区域及其对应的尖端区域中的选择性外延沉积来提供原位硼掺杂锗或者掺杂有硼掺杂锗层的硼掺杂硅锗。 在一些这样的情况下，锗浓度可以例如超过50原子％且高达100原子％，并且硼浓度可以例如超过1E20cm-3。 可以使用提供梯度锗和/或硼浓度的缓冲液来更好地接合不同的层。 锗在外延金属界面掺杂的硼的浓度有效地降低了寄生电阻而不降低尖端突然性。 这些技术可以例如在平面或非平面晶体管器件中实现。

公开(公告)号：US20130248999A1

公开(公告)日：2013-09-26

申请号：US13990224

申请日：2011-09-30

申请人： Glenn A. Glass ,  Anand S. Murthy ,  Tahir Ghani

发明人： Glenn A. Glass ,  Anand S. Murthy ,  Tahir Ghani

IPC分类号： H01L29/36

CPC分类号： H01L29/36 ,  G11C7/1051 ,  G11C16/0483 ,  G11C16/08 ,  G11C16/12 ,  G11C16/24 ,  G11C16/3418 ,  G11C16/3431 ,  G11C16/3445 ,  G11C16/3459 ,  G11C2216/14 ,  H01L21/28518 ,  H01L21/28525 ,  H01L21/76814 ,  H01L29/41783 ,  H01L29/41791 ,  H01L29/45 ,  H01L29/66545 ,  H01L29/66628 ,  H01L29/66636 ,  H01L29/66795 ,  H01L29/7833 ,  H01L29/7848 ,  H01L29/785

摘要： Techniques are disclosed for forming transistor devices having reduced parasitic contact resistance relative to conventional devices. The techniques can be implemented, for example, using a standard contact stack such as a series of metals on, for example, silicon or silicon germanium (SiGe) source/drain regions. In accordance with one example such embodiment, an intermediate boron doped germanium layer is provided between the source/drain and contact metals to significantly reduce contact resistance. Numerous transistor configurations and suitable fabrication processes will be apparent in light of this disclosure, including both planar and non-planar transistor structures (e.g., FinFETs), as well as strained and unstrained channel structures. Graded buffering can be used to reduce misfit dislocation. The techniques are particularly well-suited for implementing p-type devices, but can be used for n-type devices if so desired.

公开(公告)号：US08994104B2

公开(公告)日：2015-03-31

申请号：US13990224

申请日：2011-09-30

申请人： Glenn A. Glass ,  Anand S. Murthy ,  Tahir Ghani

发明人： Glenn A. Glass ,  Anand S. Murthy ,  Tahir Ghani

IPC分类号： H01L29/36 ,  G11C7/10 ,  G11C16/04 ,  G11C16/12 ,  G11C16/24 ,  G11C16/34 ,  H01L21/285 ,  H01L29/417 ,  H01L29/45 ,  H01L29/66 ,  H01L29/78 ,  G11C16/08 ,  H01L21/768

CPC分类号： H01L29/36 ,  G11C7/1051 ,  G11C16/0483 ,  G11C16/08 ,  G11C16/12 ,  G11C16/24 ,  G11C16/3418 ,  G11C16/3431 ,  G11C16/3445 ,  G11C16/3459 ,  G11C2216/14 ,  H01L21/28518 ,  H01L21/28525 ,  H01L21/76814 ,  H01L29/41783 ,  H01L29/41791 ,  H01L29/45 ,  H01L29/66545 ,  H01L29/66628 ,  H01L29/66636 ,  H01L29/66795 ,  H01L29/7833 ,  H01L29/7848 ,  H01L29/785

摘要： Techniques are disclosed for forming transistor devices having reduced parasitic contact resistance relative to conventional devices. The techniques can be implemented, for example, using a standard contact stack such as a series of metals on, for example, silicon or silicon germanium (SiGe) source/drain regions. In accordance with one example such embodiment, an intermediate boron doped germanium layer is provided between the source/drain and contact metals to significantly reduce contact resistance. Numerous transistor configurations and suitable fabrication processes will be apparent in light of this disclosure, including both planar and non-planar transistor structures (e.g., FinFETs), as well as strained and unstrained channel structures. Graded buffering can be used to reduce misfit dislocation. The techniques are particularly well-suited for implementing p-type devices, but can be used for n-type devices if so desired.

摘要翻译： 公开了用于形成相对于常规器件具有降低的寄生接触电阻的晶体管器件的技术。 这些技术可以例如使用例如硅或硅锗（SiGe）源极/漏极区域上的一系列金属的标准接触堆叠来实现。 根据这种实施例的一个示例，在源极/漏极和接触金属之间提供中间硼掺杂锗层以显着降低接触电阻。 根据本公开，包括平面和非平面晶体管结构（例如，FinFET）以及应变和非限制的通道结构，许多晶体管配置和合适的制造工艺将是显而易见的。 分级缓冲可用于减少错配错位。 这些技术特别适用于实现p型器件，但如果需要，可以用于n型器件。

公开(公告)号：US08901537B2

公开(公告)日：2014-12-02

申请号：US12975278

申请日：2010-12-21

申请人： Anand S. Murthy ,  Glenn A. Glass ,  Tahir Ghani ,  Ravi Pillarisetty ,  Niloy Mukherjee ,  Jack T. Kavalieros ,  Roza Kotlyar ,  Willy Rachmady ,  Mark Y. Liu

发明人： Anand S. Murthy ,  Glenn A. Glass ,  Tahir Ghani ,  Ravi Pillarisetty ,  Niloy Mukherjee ,  Jack T. Kavalieros ,  Roza Kotlyar ,  Willy Rachmady ,  Mark Y. Liu

IPC分类号： H01L21/285 ,  H01L29/165 ,  H01L29/167 ,  H01L29/49 ,  H01L29/78 ,  H01L29/66 ,  H01L29/45

CPC分类号： H01L29/0676 ,  H01L21/02532 ,  H01L21/28512 ,  H01L21/28525 ,  H01L21/3215 ,  H01L21/76831 ,  H01L23/535 ,  H01L27/092 ,  H01L27/0924 ,  H01L29/0615 ,  H01L29/0847 ,  H01L29/086 ,  H01L29/165 ,  H01L29/167 ,  H01L29/36 ,  H01L29/41791 ,  H01L29/42392 ,  H01L29/45 ,  H01L29/456 ,  H01L29/4966 ,  H01L29/66477 ,  H01L29/66545 ,  H01L29/6659 ,  H01L29/66628 ,  H01L29/66636 ,  H01L29/66681 ,  H01L29/66931 ,  H01L29/7785 ,  H01L29/78 ,  H01L29/7816 ,  H01L29/7833 ,  H01L29/7848 ,  H01L29/785 ,  H01L29/7851

摘要： Techniques are disclosed for forming transistor devices having source and drain regions with high concentrations of boron doped germanium. In some embodiments, an in situ boron doped germanium, or alternatively, boron doped silicon germanium capped with a heavily boron doped germanium layer, are provided using selective epitaxial deposition in the source and drain regions and their corresponding tip regions. In some such cases, germanium concentration can be, for example, in excess of 50 atomic % and up to 100 atomic %, and the boron concentration can be, for instance, in excess of 1E20 cm−3. A buffer providing graded germanium and/or boron concentrations can be used to better interface disparate layers. The concentration of boron doped in the germanium at the epi-metal interface effectively lowers parasitic resistance without degrading tip abruptness. The techniques can be embodied, for instance, in planar or non-planar transistor devices.

摘要翻译： 公开了用于形成具有高掺杂硼掺杂锗的源区和漏区的晶体管器件的技术。 在一些实施例中，使用在源极和漏极区域及其对应的尖端区域中的选择性外延沉积来提供原位硼掺杂锗或者掺杂有硼掺杂锗层的硼掺杂硅锗。 在一些这样的情况下，锗浓度可以例如超过50原子％且高达100原子％，并且硼浓度可以例如超过1E20cm-3。 可以使用提供梯度锗和/或硼浓度的缓冲液来更好地接合不同的层。 锗在外延金属界面掺杂的硼的浓度有效地降低了寄生电阻而不降低尖端突然性。 这些技术可以例如在平面或非平面晶体管器件中实现。

公开(公告)号：US20130240989A1

公开(公告)日：2013-09-19

申请号：US13990238

申请日：2011-09-30

申请人： Glenn A. Glass ,  Anand S. Murthy ,  Tahir Ghani

发明人： Glenn A. Glass ,  Anand S. Murthy ,  Tahir Ghani

IPC分类号： H01L29/167

CPC分类号： H01L29/0676 ,  H01L21/02532 ,  H01L21/28512 ,  H01L21/28525 ,  H01L21/3215 ,  H01L21/76831 ,  H01L23/535 ,  H01L27/092 ,  H01L27/0924 ,  H01L29/0615 ,  H01L29/0847 ,  H01L29/086 ,  H01L29/165 ,  H01L29/167 ,  H01L29/36 ,  H01L29/41791 ,  H01L29/42392 ,  H01L29/45 ,  H01L29/456 ,  H01L29/4966 ,  H01L29/66477 ,  H01L29/66545 ,  H01L29/6659 ,  H01L29/66628 ,  H01L29/66636 ,  H01L29/66681 ,  H01L29/66931 ,  H01L29/7785 ,  H01L29/78 ,  H01L29/7816 ,  H01L29/7833 ,  H01L29/7848 ,  H01L29/785 ,  H01L29/7851

摘要： Techniques are disclosed for forming transistor devices having reduced parasitic contact resistance relative to conventional devices. The techniques can be implemented, for example, using a standard contact stack such as a series of metals on, for example, silicon or silicon germanium (SiGe) source/drain regions. In accordance with one example such embodiment, an intermediate boron doped germanium layer is provided between the source/drain and contact metals to significantly reduce contact resistance. Numerous transistor configurations and suitable fabrication processes will be apparent in light of this disclosure, including both planar and non-planar transistor structures (e.g., FinFETs), as well as strained and unstrained channel structures. Graded buffering can be used to reduce misfit dislocation. The techniques are particularly well-suited for implementing p-type devices, but can be used for n-type devices if so desired.