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公开(公告)号：US06221694B1
公开(公告)日：2001-04-24
申请号：US09343080
申请日：1999-06-29
申请人： Anilkumar C. Bhatt , Michael J. Cummings , Thomas R. Miller , Kristen A. Stauffer , Michael Wozniak
发明人： Anilkumar C. Bhatt , Michael J. Cummings , Thomas R. Miller , Kristen A. Stauffer , Michael Wozniak
IPC分类号： H01L2144
CPC分类号： H01L21/4803 , H01L21/4846 , H01L21/486 , H01L23/13 , H01L23/49805 , H01L24/45 , H01L24/48 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/181 , H05K1/021 , H05K1/182 , H05K3/0061 , H05K3/427 , H05K2201/09554 , H05K2201/09981 , H05K2203/049 , H01L2224/05599 , H01L2924/00
摘要： A method of making a circuitized substrate which may be utilized as a chip carrier structure. The method involves the steps of providing a dielectric member and routing out a preselected portion of the base member to form an aperture. Metallization of the dielectric member and the walls of the aperture then occurs, followed by circuitization of the surfaces of the dielectric member. Direct metallization of the aperture walls eliminates many manufacturing steps previously required to metallize the aperture walls.
摘要翻译： 制造可用作芯片载体结构的电路化衬底的方法。 该方法包括以下步骤：提供电介质构件并布置出基底构件的预选部分以形成孔。 然后发生电介质构件和孔的壁的金属化，随后电介质构件的表面被电路化。 孔壁的直接金属化消除了先前为孔壁金属化所需的许多制造步骤。
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公开(公告)号：US06188027B1
公开(公告)日：2001-02-13
申请号：US09345474
申请日：1999-06-30
IPC分类号： H01K909
CPC分类号： H05K3/0094 , H05K3/385 , H05K2201/0959 , Y10S428/901 , Y10T428/24273 , Y10T428/24917 , Y10T428/249985
摘要： An electronic structure, and associated method of formation, in which a plated metallic layer such as a copper layer, of a plated through hole (PTH) is adhesively coupled to holefill material distributed within the PTH. The holefill material includes a resin such as an epoxy and optionally includes a particulate component such as a copper powder. The adhesive coupling is accomplished by forming an adhesion promoter film on the plated metallic layer such that the adhesion promoter film is bonded to the resin. The adhesion promoter film may include a metallic oxide layer such as layer containing cupric oxide and cuprous oxide, which could be formed from bathing the PTH in a solution of sodium chlorite. Application of a reducing solution of dimethylamine borane to the cuprous oxide layer would convert some of the cuprous oxide to cupric oxide in the metallic oxide layer. Another possibility for an adhesion promoter film is an organometallic layer such as a layer that includes a chemical complex of metal and an organic corrosion inhibitor. Useful organic corrosion inhibitors for this purpose include triazoles, tetrazoles, and imidazoles. The organometallic layer could be formed from bathing the PTH in a bath of hydrogen peroxide, sulfuric acid, and an organic corrosion inhibitor.
摘要翻译： 将电镀通孔（PTH）的电镀金属层（例如铜层）粘合地耦合到分布在PTH内的孔填充材料的电子结构及其相关联的形成方法。 孔填充材料包括诸如环氧树脂的树脂，并且任选地包括诸如铜粉末的颗粒组分。 通过在电镀金属层上形成粘合促进剂膜，使粘合促进剂膜与树脂结合，实现粘接剂的连接。 粘合促进剂膜可以包括金属氧化物层，例如含有氧化铜和氧化亚铜的层，其可以通过在亚氯酸钠溶液中洗涤PTH而形成。 将二甲胺硼烷的还原溶液应用于氧化亚铜层将将一些氧化亚铜转化为金属氧化物层中的氧化铜。 粘合促进剂膜的另一种可能性是有机金属层，例如包含金属和有机缓蚀剂的化学络合物的层。 用于此目的的有用的有机腐蚀抑制剂包括三唑，四唑和咪唑。 可以通过在过氧化氢，硫酸和有机腐蚀抑制剂的浴中洗涤PTH来形成有机金属层。
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公开(公告)号：US06537608B2
公开(公告)日：2003-03-25
申请号：US09752915
申请日：2001-01-02
IPC分类号： B05D512
CPC分类号： H05K3/0094 , H05K3/385 , H05K2201/0959 , Y10S428/901 , Y10T428/24273 , Y10T428/24917 , Y10T428/249985
摘要： A method of forming an electronic structure, including adhesively coupling a plated metallic layer (e.g. a copper layer) of a plated through hole (PTH) to holefill material (e.g., epoxy resin) distributed within the PTH. The adhesive coupling utilizes an adhesion promoter film on the plated metallic layer such that the adhesion promoter film is bonded to the resin. The adhesion promoter film may include a metallic oxide layer such as a layer containing cupric oxide and cuprous oxide, which could be formed from bathing a PTH plated with copper in a solution of sodium chlorite. The adhesion promoter film may alternatively include an organometallic layer such as a layer that includes a chemical complex of metal and an organic corrosion inhibitor. The organometallic layer could be formed from bathing the PTH in a bath of hydrogen peroxide, sulfuric acid, and the organic corrosion inhibitor.
摘要翻译： 一种形成电子结构的方法，包括将电镀通孔（PTH）的电镀金属层（例如铜层）粘附到分布在PTH内的孔填充材料（例如环氧树脂）。 粘合剂偶联剂在镀金属层上使用粘合促进剂膜，使粘合促进剂膜与树脂结合。 粘合促进剂膜可以包括金属氧化物层，例如含有氧化铜和氧化亚铜的层，其可以通过在亚氯酸钠溶液中洗涤镀铜的PTH来形成。 粘合促进剂膜可以替代地包括有机金属层，例如包含金属和有机腐蚀抑制剂的化学络合物的层。 有机金属层可以通过在过氧化氢，硫酸和有机腐蚀抑制剂的浴中洗涤PTH而形成。
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公开(公告)号：US06775907B1
公开(公告)日：2004-08-17
申请号：US09661738
申请日：2000-09-14
IPC分类号： H01K310
CPC分类号： H05K3/426 , H05K3/108 , H05K3/181 , H05K3/381 , H05K2203/1152 , H05K2203/122 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167
摘要： The present invention teaches a simplified process for fabricating high density printed wiring boards using a semi-additive process. Steps required to achieve this objective include adhering an electroless plated copper commoning layer to a surface roughened dielectric substrate. Subsequently, the commoning layer is photolithographically personalized by covering the commoning layer with a resist and then uncovering predetermined areas of the aforementioned commoning layer. Consequently, the semi-additive method involves electroplating copper onto the uncovered areas of the commoning layer, thereby generating copper features and circuitry. Finally, the semi-additive process requires the stripping of the remaining photoresist, and the unplated electroless copper layer is etched in order to electronically isolate the copper features and circuitry lines.
摘要翻译： 本发明教导了使用半添加法制造高密度印刷线路板的简化方法。 实现这一目标所需的步骤包括将化学镀铜共同层粘附到表面粗糙化的电介质基底上。 随后，通过用抗蚀剂覆盖共用层，然后露出上述公共层的预定区域，通过光刻来个性化普通层。 因此，半添加方法涉及将铜电镀到公共层的未覆盖区域上，由此产生铜特征和电路。 最后，半添加工艺需要剥离剩余的光致抗蚀剂，并且蚀刻未镀覆的无电镀铜层以便电绝缘铜特征和电路线。
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公开(公告)号：US06212769B1
公开(公告)日：2001-04-10
申请号：US09343077
申请日：1999-06-29
IPC分类号： H05K330
CPC分类号： H05K3/426 , H05K3/108 , H05K3/181 , H05K3/381 , H05K2203/1152 , H05K2203/122 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167
摘要： The present invention teaches a simplified process for fabricating high density printed wiring boards using a semi-additive process. A roughened copper foil is laminated to a dielectric substrate. The foil is subsequently removed from the dielectric to create a roughened, irregular surface on the dielectric substrate. Vertical angle through holes and blind holes are formed in the substrate. A uniform copper commoning layer is electrolessly plated to the roughened dielectric substrate and through holes. A photoresist is applied on the surface of the electroless plated layer and irradiated through a mask having printed circuit features. After developing the photoresist the uncovered electroless layer is electrolytically plated to create the final features and circuitry. After stripping the remaining photoresist the unplated electroless copper layer is etched to electronically isolate the copper features and circuitry lines.
摘要翻译： 本发明教导了使用半添加法制造高密度印刷线路板的简化方法。 将粗糙化的铜箔层叠到电介质基板上。 随后从电介质中去除箔以在电介质基底上产生粗糙的不规则表面。 在基板上形成垂直角通孔和盲孔。 将均匀的铜共同层无电镀在粗糙化的电介质基片和通孔上。 将光致抗蚀剂施加在化学镀层的表面上并通过具有印刷电路特征的掩模照射。 在显影光致抗蚀剂之后，未覆盖的化学镀层被电解以产生最终特征和电路。 在剥离剩余的光致抗蚀剂之后，蚀刻未镀覆的无电解铜层以电绝缘铜特征和电路线。
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