公开(公告)号：US09897276B2

公开(公告)日：2018-02-20

申请号：US13218980

申请日：2011-08-26

申请人： Antony P. Van De Ven ,  Christopher Hussell ,  Ronan P. Letoquin ,  Zongjie Yuan ,  Tao Tong ,  Peter Guschl

发明人： Antony P. Van De Ven ,  Christopher Hussell ,  Ronan P. Letoquin ,  Zongjie Yuan ,  Tao Tong ,  Peter Guschl

IPC分类号： F21V3/04 ,  F21K9/232 ,  F21K9/64 ,  H01L25/075 ,  F21V29/77 ,  F21Y115/10

CPC分类号： F21V3/04 ,  F21K9/232 ,  F21K9/64 ,  F21V3/0615 ,  F21V3/0625 ,  F21V3/08 ,  F21V3/12 ,  F21V29/773 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L2924/00

摘要： A lighting device comprising a solid-state light source, and a diffuser configured for color mixing of the light from the solid-state light source and spatially separated therefrom, the diffuser comprising at least one phosphor material. Methods of fabricating a lighting device having a reduced total amount of phosphor comprising combining an amount of phosphor with a diffuser structure.

公开(公告)号：US20070262339A1

公开(公告)日：2007-11-15

申请号：US11739307

申请日：2007-04-24

申请人： Christopher Hussell ,  Michael Bergmann ,  Brian Collins ,  David Emerson

发明人： Christopher Hussell ,  Michael Bergmann ,  Brian Collins ,  David Emerson

IPC分类号： H01L33/00 ,  H01L29/22

CPC分类号： H01L33/502 ,  C09K11/7731 ,  C09K11/7734 ,  C09K11/7774 ,  G02B6/0023 ,  G02B6/0068 ,  G02B6/0073 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/01322 ,  H01L2933/0091 ,  Y02B20/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting diode is disclosed. The diode includes a package support and a semiconductor chip on the package support, with the chip including an active region that emits light in the visible portion of the spectrum. Metal contacts are in electrical communication with the chip on the package. A substantially transparent encapsulant covers the chip in the package. A phosphor in the encapsulant emits a frequency in the visible spectrum different from the frequency emitted by the chip and in response to the wavelength emitted by the chip. A display element is also disclosed that combines the light emitting diode and a planar display element. The combination includes a substantially planar display element with the light emitting diode positioned on the perimeter of the display element and with the package support directing the output of the diode substantially parallel to the plane of the display element.

摘要翻译： 公开了一种发光二极管。 二极管包括封装支撑件和封装支撑件上的半导体芯片，其中芯片包括在光谱的可见部分中发光的有源区域。 金属触点与封装上的芯片电连通。 基本上透明的密封剂覆盖封装中的芯片。 密封剂中的荧光体发射可见光谱中与芯片发射的频率不同的频率，并响应芯片发出的波长。 还公开了组合发光二极管和平面显示元件的显示元件。 该组合包括基本上平面的显示元件，其中发光二极管位于显示元件的周边上，并且封装支撑件引导二极管的输出基本上平行于显示元件的平面。

公开(公告)号：US08866169B2

公开(公告)日：2014-10-21

申请号：US12757891

申请日：2010-04-09

申请人： David Emerson ,  Brian Collins ,  Michael Bergmann ,  John Edmond ,  Eric Tarsa ,  Peter Andrews ,  Bernd Keller ,  Christopher Hussell ,  Amber Salter

发明人： David Emerson ,  Brian Collins ,  Michael Bergmann ,  John Edmond ,  Eric Tarsa ,  Peter Andrews ,  Bernd Keller ,  Christopher Hussell ,  Amber Salter

IPC分类号： H01L33/48 ,  H01L33/62 ,  H01L33/64 ,  H01L33/58 ,  H01L33/20 ,  H01L33/54

CPC分类号： H01L33/58 ,  H01L33/20 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/01019 ,  H01L2924/01087 ,  H01L2924/00014

摘要： A light emitter package having increased feature sizes for improved luminous flux and efficacy. An emitter chip is disposed on a submount with a lens that covers the emitter chip. In some cases, the ratio of the width of the light emitter chip to the width of said lens in a given direction is 0.5 or greater. Increased feature sizes allow the package to emit light more efficiently. Some packages include submounts having square dimensions greater than 3.5 mm used in conjunction with larger emitter chips. Materials having higher thermal conductivities are used to fabricate the submounts, providing the package with better thermal management.

摘要翻译： 具有增加的特征尺寸以提高光通量和功效的光发射器封装。 发射极芯片设置在具有覆盖发射极芯片的透镜的基座上。 在一些情况下，发光芯片的宽度与所述透镜在给定方向上的宽度的比率为0.5或更大。 增加的特征尺寸使包装更有效地发光。 一些包装包括具有大于3.5mm的正方形尺寸的底座，与较大的发射器芯片结合使用。 使用具有较高热导率的材料来制造底座，为封装提供更好的热管理。

公开(公告)号：US20100252851A1

公开(公告)日：2010-10-07

申请号：US12757891

申请日：2010-04-09

申请人： David Emerson ,  Brian Collins ,  Michael Bergmann ,  John Edmond ,  Eric Tarsa ,  Peter Andrews ,  Bernd Keller ,  Christopher Hussell ,  Amber Salter

发明人： David Emerson ,  Brian Collins ,  Michael Bergmann ,  John Edmond ,  Eric Tarsa ,  Peter Andrews ,  Bernd Keller ,  Christopher Hussell ,  Amber Salter

IPC分类号： H01L33/58

CPC分类号： H01L33/58 ,  H01L33/20 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/01019 ,  H01L2924/01087 ,  H01L2924/00014

摘要： A light emitter package having increased feature sizes for improved luminous flux and efficacy. An emitter chip is disposed on a submount with a lens that covers the emitter chip. In some cases, the ratio of the width of the light emitter chip to the width of said lens in a given direction is 0.5 or greater. Increased feature sizes allow the package to emit light more efficiently. Some packages include submounts having dimensions greater than 3.5 mm square used in conjunction with larger emitter chips. Materials having higher thermal conductivities are used to fabricate the submounts, providing the package with better thermal management.

摘要翻译： 具有增加的特征尺寸以提高光通量和功效的光发射器封装。 发射极芯片设置在具有覆盖发射极芯片的透镜的基座上。 在一些情况下，发光芯片的宽度与所述透镜在给定方向上的宽度的比率为0.5或更大。 增加的特征尺寸使包装更有效地发光。 一些包装包括尺寸大于3.5mm见方的底座，与较大的发射器芯片结合使用。 使用具有较高热导率的材料来制造底座，为封装提供更好的热管理。