公开(公告)号：US20140085850A1

公开(公告)日：2014-03-27

申请号：US13627989

申请日：2012-09-26

申请人： Apple Inc.

发明人： Xingqun Li ,  Carlos Ribas ,  Dennis R. Pyper ,  James H. Foster ,  Joseph R. Fisher, JR. ,  Scott P. Mullins ,  Sean A. Mayo ,  Wyeman Chen

IPC分类号： H05K1/18 ,  H05K3/30 ,  H05K1/11

CPC分类号： H05K1/181 ,  H01L2224/16235 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19103 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/11 ,  H05K1/115 ,  H05K1/183 ,  H05K1/185 ,  H05K3/284 ,  H05K3/303 ,  H05K3/4614 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10378 ,  H05K2201/10454 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10537 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2203/1316 ,  H05K2203/1327 ,  Y02P70/611 ,  Y10T29/49146

摘要： Electronic devices may contain electrical systems in which electrical components are mounted on a substrate such as a printed circuit board. The electrical components may include surface mount technology components. Multiple surface mount technology components may be stacked on top of each other and beside each other to form an electrical component that minimizes the amount of area that is consumed on a printed circuit board. Noise suppression circuits and other circuits may be implemented using stacked surface mount technology components. Surface mount technology components placed on the printed circuit board may be pushed together and subsequently injection molded to form packed component groups. An integrated circuit may be mounted to the printed circuit board via an interposer and may cover components mounted to the printed circuit board. An integrated circuit may be mounted over a recessed portion of the printed circuit board on which components are mounted.

摘要翻译： 电子设备可以包含其中电气部件安装在诸如印刷电路板的基板上的电气系统。 电气部件可以包括表面贴装技术部件。 多个表面贴装技术部件可以堆叠在彼此的顶部并且彼此相邻以形成使得在印刷电路板上消耗的面积的量最小化的电气部件。 噪声抑制电路和其他电路可以使用堆叠的表面贴装技术部件来实现。 放置在印刷电路板上的表面贴装技术部件可以一起推入并随后注射成型以形成包装的部件组。 集成电路可以经由插入件安装到印刷电路板，并且可以覆盖安装到印刷电路板的部件。 集成电路可以安装在印刷电路板的安装组件的凹部上。

公开(公告)号：US20140218045A1

公开(公告)日：2014-08-07

申请号：US13762224

申请日：2013-02-07

申请人： APPLE INC.

发明人： Eugene L. Shoykhet ,  Brian C. Menzel ,  Yehonatan Perez ,  Joseph R. Fisher, JR. ,  Jahan C. Minoo ,  Kevin M. Keeler

IPC分类号： G01R31/04

CPC分类号： G06F13/4081

摘要： Techniques for detecting mating and un-mating of a first connector with a second connector include providing a pulsed voltage signal at a contact of the second connector and measuring a rate of rise of voltage at the contact. If the measured voltage at the contact exceeds a threshold voltage during the time the pulsed voltage signal is applied, then it is concluded that the first connector is not present and not mated with the second connector. If the measured voltage is lower than or equal to the threshold voltage during the time of application of the voltage pulse, it is concluded that the first connector is present and mated with the second connector.

摘要翻译： 用于检测第一连接器与第二连接器的配合和不匹配的技术包括在第二连接器的接触处提供脉冲电压信号并测量接触处的电压上升率。 如果在施加脉冲电压信号的时间内接触点处的测量电压超过阈值电压，则得出结论，第一连接器不存在并且不与第二连接器配合。 如果在施加电压脉冲期间测量的电压低于或等于阈值电压，则得出结论，第一连接器存在并与第二连接器配合。