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公开(公告)号：US10236683B2
公开(公告)日：2019-03-19
申请号：US15256409
申请日：2016-09-02
申请人： Apple Inc.
发明人： Roderick D. Bacon , Nagendra Bage Jayaraj , Derek J. DiCarlo , Chi Kin Ho , Xingqun Li , Jahan C. Minoo , Surya Musunuri , Tony Chi Wang Ng , Carlos Ribas , Ching Yu John Tam , Evan J. Thompson , Daniel C. Wagman , Di Zhao , Robert D. Zupke
IPC分类号： H02H9/04 , H01R13/66 , H01R13/713 , H01R24/60 , G06F13/40 , H04L12/40 , H01R107/00
摘要： A voltage of a first pin that is one of several pins of an external connector of a system is measured, while the first pin is un-driven except for being pulled to ground through a first resistance, and a second pin of the external connector is being used as a power supply rail of the system. The measured voltage is compared to a short circuit threshold and in response to that threshold being exceeded, the power supply voltage on the second pin is reduced. In such an embodiment, no test stimulus needs to be applied to any of the pins of the external connector. Other embodiments are also described and claimed.
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公开(公告)号：US20140085850A1
公开(公告)日：2014-03-27
申请号：US13627989
申请日：2012-09-26
申请人： Apple Inc.
发明人： Xingqun Li , Carlos Ribas , Dennis R. Pyper , James H. Foster , Joseph R. Fisher, JR. , Scott P. Mullins , Sean A. Mayo , Wyeman Chen
CPC分类号： H05K1/181 , H01L2224/16235 , H01L2924/15159 , H01L2924/15192 , H01L2924/15311 , H01L2924/19103 , H05K1/0231 , H05K1/0233 , H05K1/11 , H05K1/115 , H05K1/183 , H05K1/185 , H05K3/284 , H05K3/303 , H05K3/4614 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/1006 , H05K2201/10378 , H05K2201/10454 , H05K2201/10515 , H05K2201/10522 , H05K2201/1053 , H05K2201/10537 , H05K2201/10636 , H05K2201/10734 , H05K2203/1316 , H05K2203/1327 , Y02P70/611 , Y10T29/49146
摘要： Electronic devices may contain electrical systems in which electrical components are mounted on a substrate such as a printed circuit board. The electrical components may include surface mount technology components. Multiple surface mount technology components may be stacked on top of each other and beside each other to form an electrical component that minimizes the amount of area that is consumed on a printed circuit board. Noise suppression circuits and other circuits may be implemented using stacked surface mount technology components. Surface mount technology components placed on the printed circuit board may be pushed together and subsequently injection molded to form packed component groups. An integrated circuit may be mounted to the printed circuit board via an interposer and may cover components mounted to the printed circuit board. An integrated circuit may be mounted over a recessed portion of the printed circuit board on which components are mounted.
摘要翻译： 电子设备可以包含其中电气部件安装在诸如印刷电路板的基板上的电气系统。 电气部件可以包括表面贴装技术部件。 多个表面贴装技术部件可以堆叠在彼此的顶部并且彼此相邻以形成使得在印刷电路板上消耗的面积的量最小化的电气部件。 噪声抑制电路和其他电路可以使用堆叠的表面贴装技术部件来实现。 放置在印刷电路板上的表面贴装技术部件可以一起推入并随后注射成型以形成包装的部件组。 集成电路可以经由插入件安装到印刷电路板，并且可以覆盖安装到印刷电路板的部件。 集成电路可以安装在印刷电路板的安装组件的凹部上。
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公开(公告)号：US11095119B2
公开(公告)日：2021-08-17
申请号：US16259983
申请日：2019-01-28
申请人： Apple Inc.
发明人： Roderick D. Bacon , Nagendra Bage Jayaraj , Derek J. DiCarlo , Chi Kin Ho , Xingqun Li , Jahan C. Minoo , Surya Musunuri , Tony Chi Wang Ng , Carlos Ribas , Ching Yu John Tam , Evan J. Thompson , Daniel C. Wagman , Di Zhao , Robert D. Zupke
IPC分类号： H02H9/04 , G06F13/40 , H04L12/40 , H01R13/66 , H01R13/713 , H01R24/60 , H01R107/00
摘要： A voltage of a first pin that is one of several pins of an external connector of a system is measured, while the first pin is un-driven except for being pulled to ground through a first resistance, and a second pin of the external connector is being used as a power supply rail of the system. The measured voltage is compared to a short circuit threshold and in response to that threshold being exceeded, the power supply voltage on the second pin is reduced. In such an embodiment, no test stimulus needs to be applied to any of the pins of the external connector. Other embodiments are also described and claimed.
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公开(公告)号：US09743522B2
公开(公告)日：2017-08-22
申请号：US13627989
申请日：2012-09-26
申请人： Apple Inc.
发明人： Xingqun Li , Carlos Ribas , Dennis R. Pyper , James H. Foster , Joseph R. Fisher, Jr. , Scott P. Mullins , Sean A. Mayo , Wyeman Chen
CPC分类号： H05K1/181 , H01L2224/16235 , H01L2924/15159 , H01L2924/15192 , H01L2924/15311 , H01L2924/19103 , H05K1/0231 , H05K1/0233 , H05K1/11 , H05K1/115 , H05K1/183 , H05K1/185 , H05K3/284 , H05K3/303 , H05K3/4614 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/1006 , H05K2201/10378 , H05K2201/10454 , H05K2201/10515 , H05K2201/10522 , H05K2201/1053 , H05K2201/10537 , H05K2201/10636 , H05K2201/10734 , H05K2203/1316 , H05K2203/1327 , Y02P70/611 , Y10T29/49146
摘要： Electronic devices may contain electrical systems in which electrical components are mounted on a substrate such as a printed circuit board. The electrical components may include surface mount technology components. Multiple surface mount technology components may be stacked on top of each other and beside each other to form an electrical component that minimizes the amount of area that is consumed on a printed circuit board. Noise suppression circuits and other circuits may be implemented using stacked surface mount technology components. Surface mount technology components placed on the printed circuit board may be pushed together and subsequently injection molded to form packed component groups. An integrated circuit may be mounted to the printed circuit board via an interposer and may cover components mounted to the printed circuit board. An integrated circuit may be mounted over a recessed portion of the printed circuit board on which components are mounted.
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公开(公告)号：US20190173276A1
公开(公告)日：2019-06-06
申请号：US16259983
申请日：2019-01-28
申请人： Apple Inc.
发明人： Roderick D. Bacon , Nagendra Bage Jayaraj , Derek J. DiCarlo , Chi Kin Ho , Xingqun Li , Jahan C. Minoo , Surya Musunuri , Tony Chi Wang Ng , Carlos Ribas , Ching Yu John Tam , Evan J. Thompson , Daniel C. Wagman , Di Zhao , Robert D. Zupke
摘要： A voltage of a first pin that is one of several pins of an external connector of a system is measured, while the first pin is un-driven except for being pulled to ground through a first resistance, and a second pin of the external connector is being used as a power supply rail of the system. The measured voltage is compared to a short circuit threshold and in response to that threshold being exceeded, the power supply voltage on the second pin is reduced. In such an embodiment, no test stimulus needs to be applied to any of the pins of the external connector. Other embodiments are also described and claimed.
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公开(公告)号：US20170358922A1
公开(公告)日：2017-12-14
申请号：US15256409
申请日：2016-09-02
申请人： Apple Inc.
发明人： Roderick D. Bacon , Nagendra Bage Jayaraj , Derek J. DiCarlo , Chi Kin Ho , Xingqun Li , Jahan C. Minoo , Surya Musunuri , Tony Chi Wang Ng , Carlos Ribas , Ching Yu John Tam , Evan J. Thompson , Daniel C. Wagman , Di Zhao , Robert D. Zupke
IPC分类号： H02H9/04 , H01R24/60 , H01R13/66 , H01R13/713 , H01R107/00
CPC分类号： H02H9/04 , G06F13/4068 , H01R13/6683 , H01R13/713 , H01R24/60 , H01R2107/00 , H04L12/40045 , Y02D10/14 , Y02D10/151
摘要： A voltage of a first pin that is one of several pins of an external connector of a system is measured, while the first pin is un-driven except for being pulled to ground through a first resistance, and a second pin of the external connector is being used as a power supply rail of the system. The measured voltage is compared to a short circuit threshold and in response to that threshold being exceeded, the power supply voltage on the second pin is reduced. In such an embodiment, no test stimulus needs to be applied to any of the pins of the external connector. Other embodiments are also described and claimed.
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