APPARATUS FOR VACUUM PROCESSING OF A SUBSTRATE, SYSTEM FOR VACUUM PROCESSING OF A SUBSTRATE, AND METHOD FOR TRANSPORTATION OF A SUBSTRATE CARRIER AND A MASK CARRIER IN A VACUUM CHAMBER

    公开(公告)号:US20200083452A1

    公开(公告)日:2020-03-12

    申请号:US15743614

    申请日:2017-02-24

    摘要: The present disclosure provides an apparatus (200) for vacuum processing of a substrate (10). The apparatus (200) includes a vacuum chamber, a first track arrangement (110) configured for transportation of a substrate carrier (120), a second track arrangement (130) configured for transportation of a mask carrier (140), and a holding arrangement configured for positioning the substrate carrier (120) and the mask carrier (140) with respect to each other. The first track arrangement (110) includes a first portion configured to support the substrate carrier (120) at a first end (12) of the substrate (10) and a second portion configured to support the substrate carrier (120) at a second end (14) of the substrate (10) opposite the first end (12) of the substrate (10). The second track arrangement (120) includes a further first portion configured to support the mask carrier (140) at a first end (22) of a mask (20) and a further second portion configured to support the mask carrier (140) at a second end (24) of the mask (20) opposite the first end (22) of the mask (20). A first distance (D) between the first portion and the second portion of the first track arrangement (110) and a second distance (D′) between the further first portion and the further second portion of the second track arrangement (130) are essentially the same.

    APPARATUS FOR PROVIDING A LIQUEFIED MATERIAL, DOSAGE SYSTEM AND METHOD FOR DOSING A LIQUEFIED MATERIAL

    公开(公告)号:US20220228251A1

    公开(公告)日:2022-07-21

    申请号:US17563242

    申请日:2021-12-28

    摘要: A vapor deposition apparatus is provided. The vapor deposition apparatus includes a tank for providing a liquefied material, a first unit having an alterable first volume, the first unit including a first actuator and including a first line to be in fluid communication with the tank. Further, the vapor deposition apparatus includes a second unit having an alterable second volume, the second unit including a second actuator and including a second line to be in fluid communication with the tank. The vapor deposition apparatus includes an evaporation arrangement, the evaporation arrangement being in fluid communication with the first unit and the second unit. The first actuator and the second actuator are configured to alternatingly provide a force to the alterable first volume and the alterable second volume for providing the liquefied material to the evaporation arrangement.

    FLANGED JOINT AND METHOD OF FLUIDLY CONNECTING TWO COMPONENTS

    公开(公告)号:US20220090713A1

    公开(公告)日:2022-03-24

    申请号:US17025268

    申请日:2020-09-18

    摘要: A flanged joint is described. The flanged joint has a first flange member with a first sealing surface and a second flange member with a second sealing surface. The flanged joint further has a hollow-metal gasket between the first flange member and the second flange member, and a spacer between the first flange member and the second flange member. The spacer defines a minimum distance between the first flange member and the second flange member. The flanged joint can be configured to seal a metal-conveying volume.

    METHODS OF OPERATING A VACUUM PROCESSING SYSTEM

    公开(公告)号:US20200243768A1

    公开(公告)日:2020-07-30

    申请号:US15760661

    申请日:2017-03-17

    摘要: A method of operating a vacuum processing system with a main transportation path along which substrates can be transported in a main transportation direction is described. The method includes routing a substrate out of the main transportation path into a first deposition module for depositing a first material on the substrate; routing the substrate out of the main transportation path into a second deposition module for depositing a second material on the substrate; and routing the substrate out of the main transportation path into one or more further deposition modules for depositing one or more further materials on the substrate. Further, various methods of operating one or more rotation modules of vacuum processing system configured for depositing two or more materials on a plurality of substrates are described.