Method and apparatus for detection of particle size in a fluid

    公开(公告)号:US11353389B2

    公开(公告)日:2022-06-07

    申请号:US17033521

    申请日:2020-09-25

    Abstract: Examples disclosed herein relate to system and method for detecting the size of a particle in a fluid. The system includes a conduit for transporting a fluid and a sample area. Some of the fluid passes through the sample area. A first imaging device has an optical lens and a digital detector. A laser source emits a first laser beam. The digital detector generates a metric of an initial intensity of a scattered light that passes through the optical lens. The scattered light is scattered from particles passing through the sample area, and includes light from the first laser beam, which passes through the sample area. A controller outputs a corrected particle intensity based upon a comparison of the initial intensity to data representative of intensity of a focused and defocused particle. The corrected particle intensity generates a corrected metric corresponding to an actual size of the particles.

    Methods and systems to measure properties of products on a moving blade in electronic device manufacturing machines

    公开(公告)号:US11609183B2

    公开(公告)日:2023-03-21

    申请号:US16996579

    申请日:2020-08-18

    Abstract: Implementations disclosed describe an optical inspection device comprising a source of light to direct a light beam to a location on a surface of a wafer, the wafer being transported from a processing chamber, wherein the light beam is to generate, a reflected light, an optical sensor to collect a first data representative of a direction of the first reflected light, collect a second data representative of a plurality of values characterizing intensity of the reflected light at a corresponding one of a plurality of wavelengths, and a processing device, in communication with the optical sensor, to determine, using the first data, a position of the surface of the wafer; retrieve calibration data, and determine, using the position of the surface of the wafer, the second data, and the calibration data, a characteristic representative of a quality of the wafer.

    METHODS AND SYSTEMS TO MEASURE PROPERTIES OF PRODUCTS ON A MOVING BLADE IN ELECTRONIC DEVICE MANUFACTURING MACHINES

    公开(公告)号:US20220057323A1

    公开(公告)日:2022-02-24

    申请号:US16996579

    申请日:2020-08-18

    Abstract: Implementations disclosed describe an optical inspection device comprising a source of light to direct a light beam to a location on a surface of a wafer, the wafer being transported from a processing chamber, wherein the light beam is to generate, a reflected light, an optical sensor to collect a first data representative of a direction of the first reflected light, collect a second data representative of a plurality of values characterizing intensity of the reflected light at a corresponding one of a plurality of wavelengths, and a processing device, in communication with the optical sensor, to determine, using the first data, a position of the surface of the wafer; retrieve calibration data, and determine, using the position of the surface of the wafer, the second data, and the calibration data, a characteristic representative of a quality of the wafer.

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