公开(公告)号：US20030034617A1

公开(公告)日：2003-02-20

申请号：US10218170

申请日：2002-08-13

Applicant: APPLIED MATERIALS, INC.

Inventor： Bernardo Donoso ,  Yeuk-Fai Edwin Mok

IPC: B32B031/00

CPC classification number: H01L21/6831 ,  B25B11/005 ,  H01L21/6838 ,  H01L21/68785 ,  Y10T279/11

Abstract: A wafer chuck is provided, having a wafer chucking surface, and a plunger consisting either of a body that extends at least partially along the outer perimeter of the wafer chucking surface, or a plurality of pins positioned outside the wafer chucking surface. The plunger may be normally biased to extend past the wafer chucking surface and/or may be adapted not to rotate with the wafer chucking surface. The plunger bias may be achieved via one or more vacuum bellows.

Abstract translation: 提供具有晶片夹持表面的晶片卡盘和由至少部分地沿晶片夹持表面的外周延伸的主体或位于晶片夹持表面外部的多个引脚组成的柱塞。 柱塞可以通常被偏压以延伸通过晶片夹持表面和/或可适于不与晶片夹持表面一起旋转。 柱塞偏压可以通过一个或多个真空波纹管实现。

公开(公告)号：US20040016637A1

公开(公告)日：2004-01-29

申请号：US10616284

申请日：2003-07-08

Applicant: APPLIED MATERIALS, INC.

Inventor： Michael X. Yang ,  Ming Xi ,  Russell C. Ellwanger ,  Eric B. Britcher ,  Bernardo Donoso ,  Lily L. Pang ,  Svetlana Sherman ,  Henry Ho ,  Anh N. Nguyen ,  Alexander N. Lerner ,  Allen L. D'Ambra ,  Arulkumar Shanmugasundram ,  Tetsuya Ishikawa ,  Yevgeniy Rabinovich ,  Dmitry Lubomirsky ,  Yeuk-Fai Edwin Mok ,  Son T. Nguyen

IPC: C25D017/00

CPC classification number: H01L21/6719 ,  A23D7/00 ,  A23D7/005 ,  A23D7/01 ,  A23J7/00 ,  B08B3/02 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D17/02 ,  C25D21/02 ,  C25D21/08 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/68 ,  H01L21/6838 ,  H01L21/68707

Abstract: Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.

Abstract translation: 本发明的实施方案通常提供电化学电镀系统。 电镀系统包括位于与主机处理平台连通的基板装载站，位于主机上的至少一个基板镀覆单元，位于主机上的至少一个基板斜面清洁单元，以及与 主机和加载站中的至少一个，层叠基板退火站中的每个室具有加热板，冷却板和基板传送机器人。

公开(公告)号：US20030141673A1

公开(公告)日：2003-07-31

申请号：US10057114

申请日：2002-01-25

Applicant: Applied Materials, Inc.

Inventor： Donald J. K. Olgado ,  Bernardo Donoso ,  Alexander Lerner

IPC: B25B011/00 ,  B23Q003/00

CPC classification number: H01L21/6838 ,  B23B31/307 ,  B25B11/005 ,  Y10T279/11

Abstract: In a first aspect, a rotary vacuum-chuck is provided that may hold a substrate such as a silicon wafer for rotation. The vacuum-chuck includes a hollow rotary shaft and a chuck mounted on the hollow rotary shaft and having a surface adapted to support a substrate. The chuck has one or more openings in fluid communication with the hollow rotary shaft. A venturi is formed near an end of the hollow rotary shaft to apply vacuum to the hollow rotary shaft and the openings in the chuck surface. No seal is required between the end of the hollow rotary shaft and a surrounding stationary block.

Abstract translation: 在第一方面中，提供一种旋转式真空吸盘，其可以保持诸如硅晶片的基板旋转。 真空吸盘包括中空旋转轴和安装在中空旋转轴上并具有适于支撑基底的表面的卡盘。 卡盘具有与中空旋转轴流体连通的一个或多个开口。 在中空旋转轴的端部附近形成文丘里管，以向空心旋转轴和卡盘表面中的开口施加真空。 在空心旋转轴的端部和周围的固定块之间不需要密封。

公开(公告)号：US20020092917A1

公开(公告)日：2002-07-18

申请号：US09759390

申请日：2001-01-12

Applicant: Applied Materials, Inc.

Inventor： Alexander Sou-Kang Ko ,  Bernardo Donoso

IPC: B08B003/02

CPC classification number: H01L21/67051 ,  B05B15/62 ,  B08B3/02

Abstract: A method and an apparatus is provided that may fix a point at which an etchant or a fluid sprayed from a nozzle impacts a substrate. By fixing a first angle measured between the inventive nozzle and a substrate support and fixing a process height of a nozzle relative to a substrate support, a second angle, measured between a fluid sprayed from the nozzle and a line tangent to a substrate support, may vary without affecting the fluid impact point.

Abstract translation: 提供了一种方法和装置，其可以固定从喷嘴喷射的蚀刻剂或流体撞击基底的点。 通过固定在本发明的喷嘴和基板支撑件之间测量的第一角度并且固定喷嘴相对于基板支撑件的处理高度，在从喷嘴喷射的流体和与基板支撑件相切的直线之间测量的第二角度可以 改变而不影响流体冲击点。

公开(公告)号：US20040206373A1

公开(公告)日：2004-10-21

申请号：US10680616

申请日：2003-10-06

Applicant: Applied Materials, Inc.

Inventor： Bernardo Donoso ,  Tetsuya Ishikawa ,  Lily L. Pang ,  Svetlana Sherman

IPC: B08B003/02

CPC classification number: H01L21/67051 ,  B08B3/02 ,  C25D21/08 ,  H01L21/67028 ,  H01L21/67034

Abstract: Embodiments of the invention generally provide a substrate spin rinse dry cell that may be used in a semiconductor processing system. The cell generally includes a cell body defining an interior processing volume, and a rotatable substrate support member positioned in the processing volume. The rotatable substrate support member includes a rotatable hub assembly having a plurality of upstanding substrate engaging members extending therefrom, and a central member positioned radially inward of the plurality of upstanding substrate engaging members, the central member having a plurality of backside fluid dispensing nozzles and at least one backside gas dispensing nozzle positioned thereon. The cell further includes at least one frontside fluid dispensing nozzle positioned to dispense a rinsing fluid onto an upper surface of a substrate supported by the substrate support member, and at least one frontside gas dispensing nozzle positioned to dispense a drying gas into the processing volume, the drying gas being directed toward the upper substrate surface.

Abstract translation: 本发明的实施方案通常提供可用于半导体处理系统的底物旋转漂洗干细胞。 电池通常包括限定内部处理容积的电池体和位于处理容积中的可旋转衬底支撑构件。 可旋转的基板支撑构件包括可旋转的毂组件，其具有从其延伸的多个直立的基板接合构件和位于多个直立的基板接合构件的径向内侧的中心构件，中心构件具有多个后侧流体分配喷嘴 位于其上的至少一个后侧气体分配喷嘴。 细胞还包括至少一个前侧流体分配喷嘴，其定位成将冲洗流体分配到由基板支撑构件支撑的基板的上表面上，以及至少一个前侧气体分配喷嘴，其定位成将干燥气体分配到处理体积中， 干燥气体被引向上基板表面。

公开(公告)号：US20030036273A1

公开(公告)日：2003-02-20

申请号：US10219198

申请日：2002-08-13

Applicant: Applied Materials, Inc.

Inventor： Bernardo Donoso

IPC: H01L021/302 ,  H01L021/461

CPC classification number: H01L21/6708 ,  B08B3/02 ,  H01L21/67051

Abstract: In a first aspect, a system is provided that includes (1) a substrate support adapted to hold and rotate a substrate; (2) a source of fluid adapted to supply fluid to a surface of a substrate held by the substrate support; and (3) a shield positioned to capture fluid supplied by the source of fluid and displaced from a substrate held and rotated by the substrate support. The shield includes a radiused surface adapted to carry the captured fluid away from the substrate held by the substrate support. Apparatus and methods in accordance with this and other aspects also are provided.

Abstract translation: 在第一方面，提供了一种系统，其包括（1）适于保持和旋转衬底的衬底支撑件; （2）适于将流体供应到由所述基板支撑件保持的基板的表面的流体源; 和（3）定位成捕获由流体源供应并从由基板支撑件保持和旋转的基板移位的流体的屏蔽。 护罩包括适于将捕获的流体远离由衬底支撑件保持的衬底携带的圆角表面。 还提供了根据这个和其它方面的装置和方法。