公开(公告)号：US20040206623A1

公开(公告)日：2004-10-21

申请号：US10826489

申请日：2004-04-16

Applicant: Applied Materials, Inc.

Inventor： Allen L. D'Ambra ,  Arulkumar Shanmugasundram ,  Michael X. Yang ,  Yevgeniy (Eugene) Rabinovich ,  Dmitry Lubomirsky

IPC: C25D017/00

CPC classification number: C25D17/00

Abstract: Embodiments of the invention generally provide a fluid delivery system for an electrochemical plating platform. The fluid delivery system is configured to supply multiple chemistries to multiple plating cells with minimal bubble formation in the fluid delivery system. The system includes a solution mixing system, a fluid distribution manifold in communication with the solution mixing system, a plurality of fluid conduits in fluid communication with the fluid distribution manifold, and a plurality of fluid tanks, each of the plurality of fluid tanks being in fluid communication with at least one of the plurality of fluid conduits.

Abstract translation: 本发明的实施方案通常提供用于电化学电镀平台的流体输送系统。 流体输送系统被配置为在流体输送系统中以最小的气泡形成向多个电镀单元提供多个化学物质。 该系统包括溶液混合系统，与溶液混合系统连通的流体分配歧管，与流体分配歧管流体连通的多个流体导管和多个流体箱，多个流体箱中的每一个处于 与多个流体导管中的至少一个流体连通。

公开(公告)号：US20040016637A1

公开(公告)日：2004-01-29

申请号：US10616284

申请日：2003-07-08

Applicant: APPLIED MATERIALS, INC.

Inventor： Michael X. Yang ,  Ming Xi ,  Russell C. Ellwanger ,  Eric B. Britcher ,  Bernardo Donoso ,  Lily L. Pang ,  Svetlana Sherman ,  Henry Ho ,  Anh N. Nguyen ,  Alexander N. Lerner ,  Allen L. D'Ambra ,  Arulkumar Shanmugasundram ,  Tetsuya Ishikawa ,  Yevgeniy Rabinovich ,  Dmitry Lubomirsky ,  Yeuk-Fai Edwin Mok ,  Son T. Nguyen

IPC: C25D017/00

CPC classification number: H01L21/6719 ,  A23D7/00 ,  A23D7/005 ,  A23D7/01 ,  A23J7/00 ,  B08B3/02 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D17/02 ,  C25D21/02 ,  C25D21/08 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/68 ,  H01L21/6838 ,  H01L21/68707

Abstract: Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.

Abstract translation: 本发明的实施方案通常提供电化学电镀系统。 电镀系统包括位于与主机处理平台连通的基板装载站，位于主机上的至少一个基板镀覆单元，位于主机上的至少一个基板斜面清洁单元，以及与 主机和加载站中的至少一个，层叠基板退火站中的每个室具有加热板，冷却板和基板传送机器人。

公开(公告)号：US20040074777A1

公开(公告)日：2004-04-22

申请号：US10273539

申请日：2002-10-18

Applicant: Applied Materials, Inc.

Inventor： Dmitry Lubomirsky ,  Michael X. Yang ,  Girish A. Dixit ,  Vincent E. Burkhart ,  Allen L. D'Ambra ,  Yeuk-Fai Edwin Mok ,  Harald Herchen

IPC: C25D005/48

CPC classification number: C25D7/12 ,  C25D21/00 ,  H01L21/2885

Abstract: A method for cleaning the electrical contact areas or substrate contact areas of an electrochemical plating contact ring is provided. Embodiments of the method include positioning a substrate on a substrate support member having one or more electrical contacts, chemically plating a metal layer on at least a portion of a surface of the substrate, removing the processed substrate from the support member, and cleaning the one or more electrical contacts with a vapor mixture comprising an alcohol. In another aspect, the method includes spraying the vapor mixture on the electrical contacts while rotating the substrate support member.

Abstract translation: 提供了一种用于清洁电化学电镀接触环的电接触区域或衬底接触区域的方法。 该方法的实施例包括将基板定位在具有一个或多个电触点的基板支撑构件上，在基板表面的至少一部分上化学镀覆金属层，从处理基板移除经处理的基板，并清洁该基板 或更多的与包含醇的蒸汽混合物的电接触。 在另一方面，该方法包括在旋转衬底支撑构件的同时将蒸气混合物喷射到电触点上。

公开(公告)号：US20030000841A1

公开(公告)日：2003-01-02

申请号：US10217872

申请日：2002-08-13

Applicant: Applied Materials, Inc.

Inventor： Joseph J. Stevens ,  Yevgeniy Rabinovich ,  Sandy S. Chao ,  Mark R. Denome ,  Allen L. D'Ambra ,  Donald J. Olgado

IPC: C25D021/12 ,  C25C003/16 ,  C25C003/20 ,  C25B009/00 ,  C25B015/00 ,  C25D003/38 ,  B23H003/02 ,  B23H007/14 ,  H01L021/445 ,  H01L021/288 ,  B23H007/04 ,  C25F007/00 ,  C25D017/00 ,  C25B009/04 ,  C25D005/02 ,  C25D005/00

CPC classification number: C25D21/14 ,  C25D7/123 ,  C25D17/001 ,  C25D21/18

Abstract: A system is provided in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electrochemical deposition tool platform. The smaller flow is diverted to a dosing unit which may be on a separate platform. The dosing unit in one embodiment comprises a pressurized flow line.

Abstract translation: 提供了一种系统，其中较小的沉积溶液流从在电化学沉积工具平台上流动的较大流动的沉积溶液转移。 较小的流量被转移到可以在单独平台上的计量单元。 在一个实施例中的计量单元包括加压流动管线。