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    Methods and apparatus for rapidly cooling a substrate
    2.
    发明授权
    Methods and apparatus for rapidly cooling a substrate 有权

    公开(公告)号：US09779971B2

    公开(公告)日：2017-10-03

    申请号：US14251134

    申请日：2014-04-11

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Jallepally Ravi ,  Steven V. Sansoni ,  Kirankumar Savandaiah

    IPC: H01L21/67

    CPC classification number: H01L21/67109

    Abstract: Embodiments of methods and apparatus for rapidly cooling a substrate are provided herein. In some embodiments, a cooling chamber for cooling a substrate includes a chamber body having an inner volume; a substrate support disposed in the chamber and having a support surface to support a substrate; a plate disposed in the chamber body opposite the substrate support, wherein the substrate support and the plate are movable with respect to each other between a first position and a second position, wherein when in the first position the substrate support and the plate are disposed away from each other such that the support surface is exposed to a first volume within the inner volume, wherein when in the second position the substrate support and the plate are disposed adjacent to each other such that the support surface is exposed to a second volume within the inner volume, and wherein the second volume is smaller than the first volume; a plurality of flow channels disposed in one or more of the plate or the substrate support to flow a coolant; and a gas inlet to provide a gas into the second volume.

    Process kit shield for plasma enhanced processing chamber
    3.
    发明授权
    Process kit shield for plasma enhanced processing chamber 有权
    用于等离子体增强处理室的工艺套件屏蔽

    公开(公告)号：US09343274B2

    公开(公告)日：2016-05-17

    申请号：US14178146

    申请日：2014-02-11

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Muhammad Rasheed ,  Donny Young ,  Kirankumar Savandaiah ,  Uday Pai

    IPC: C23C14/56 ,  C23C14/34 ,  C23C16/44 ,  C23C14/35 ,  H01J37/34 ,  H01J37/32 ,  H01J19/54

    CPC classification number: H01J37/3411 ,  C23C14/34 ,  C23C14/35 ,  C23C14/564 ,  C23C16/44 ,  H01J19/54 ,  H01J37/32495 ,  Y10T428/12528

    Abstract: Apparatus for processing substrates is disclosed herein. In some embodiments, an apparatus includes a first shield having a first end, a second end, and one or more first sidewalls disposed between the first and second ends, wherein the first end is configured to interface with a first support member of a process chamber to support the first shield in a position such that the one or more first sidewalls surround a first volume of the process chamber; and a second shield having a first end, a second end, and one or more second sidewalls disposed between the first and second ends of the second shield and about the first shield, wherein the first end of the second shield is configured to interface with a second support member of the process chamber to support the second shield such that the second shield contacts the first shield to form a seal therebetween.

    Abstract translation: 本文公开了用于处理衬底的设备。 在一些实施例中，一种装置包括具有第一端，第二端和设置在第一和第二端之间的一个或多个第一侧壁的第一屏蔽，其中第一端构造成与处理室的第一支撑构件 以将所述第一屏蔽件支撑在使得所述一个或多个第一侧壁围绕所述处理室的第一体积的位置; 以及第二屏蔽，其具有设置在所述第二屏蔽件的第一端和第二端之间并且围绕所述第一屏蔽的第一端，第二端和一个或多个第二侧壁，其中所述第二屏蔽的所述第一端被配置为与 处理室的第二支撑构件以支撑第二屏蔽，使得第二屏蔽件接触第一屏蔽件以在其间形成密封。

    Target retaining apparatus
    6.
    发明授权
    Target retaining apparatus 有权

    公开(公告)号：US10199204B2

    公开(公告)日：2019-02-05

    申请号：US14600915

    申请日：2015-01-20

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Srinivasa Yedla ,  Sundarapandian Reddy ,  Uday Pai ,  Kirankumar Savandaiah ,  Thanh X. Nguyen ,  Muhammad M. Rasheed ,  Jallepally Ravi

    IPC: H01J37/34

    Abstract: Embodiments of target retaining apparatus and substrate processing chambers incorporating same are provided herein. In some embodiments, a target retaining apparatus includes a housing including a first slot and a second slot; a cam movably disposed in the housing, wherein movement of the cam is constrained along the first slot; a retaining arm movably coupled to the cam, wherein movement of the retaining arm is constrained along the second slot; a linking member including a first end rotatably coupled to the cam and a second end rotatably coupled to the retaining arm; and a biasing element biasing the cam towards a first position in which the retaining arm extends away from the housing.

    Selectively groundable cover ring for substrate process chambers
    7.
    发明授权
    Selectively groundable cover ring for substrate process chambers 有权
    用于基板处理室的选择性可底座盖环

    公开(公告)号：US09472443B2

    公开(公告)日：2016-10-18

    申请号：US13831363

    申请日：2013-03-14

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Muhammad M. Rasheed ,  Kirankumar Savandaiah ,  William Johanson ,  Zhenbin Ge ,  Goichi Yoshidome

    IPC: C23C14/34 ,  H01L21/687 ,  H01J37/32 ,  C23C14/50

    CPC classification number: H01L21/68735 ,  C23C14/34 ,  C23C14/50 ,  H01J37/32651 ,  H01J37/32715

    Abstract: Embodiments of a process kit for substrate process chambers are provided herein. In some embodiments, a process kit for a substrate process chamber may include a ring having a body and a lip extending radially inward from the body, wherein the body has a first annular channel formed in a bottom of the body; an annular conductive shield having a lower inwardly extending ledge that terminates in an upwardly extending portion configured to interface with the first annular channel of the ring; and a conductive member electrically coupling the ring to the conductive shield when the ring is disposed on the conductive shield.

    Abstract translation: 本文提供了用于基板处理室的处理套件的实施例。 在一些实施例中，用于衬底处理室的处理套件可以包括具有本体和从主体径向向内延伸的唇缘的环，其中主体具有形成在主体的底部中的第一环形通道; 环形导电屏蔽件，其具有下部向内延伸的凸缘，其终止于构造成与环的第一环形通道相接合的向上延伸部分; 以及当所述环设置在所述导电屏蔽上时，所述导电构件将所述环电耦合到所述导电屏蔽层。

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