公开(公告)号：US20210335581A1

公开(公告)日：2021-10-28

申请号：US16855559

申请日：2020-04-22

Applicant: APPLIED MATERIALS, INC.

Inventor： Sarath BABU ,  Ananthkrishna JUPUDI ,  Yueh Sheng OW ,  Junqi WEI ,  Kelvin Tai Ming BOH ,  Kang ZHANG ,  Yuichi WADA

IPC: H01J37/32

Abstract: Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber, includes: a top plate having a central recess disposed in an upper surface thereof; a channel extending from an outer portion of the top plate to the central recess; a plurality of holes disposed through the top plate from a bottom surface of the recess to a lower surface of the top plate; a cover plate configured to be coupled to the top plate and to form a seal along a periphery of the central recess such that the covered recess forms a plenum within the top plate; and a tubular body extending down from the lower surface of the top plate and surrounding the plurality of holes, the tubular body further configured to surround a substrate support.

公开(公告)号：US20210233802A1

公开(公告)日：2021-07-29

申请号：US17227354

申请日：2021-04-11

Applicant: APPLIED MATERIALS, INC.

Inventor： Felix DENG ,  Yueh Sheng OW ,  Tuck Foong KOH ,  Nuno Yen-Chu CHEN ,  Yuichi WADA ,  Sree Rangasai V. KESAPRAGADA ,  Clinton GOH

IPC: H01L21/762 ,  H01L21/67

Abstract: Methods and apparatus for cleaving a substrate in a semiconductor chamber. The semiconductor chamber pressure is adjusted to a process pressure, a substrate is then heated to a nucleation temperature of ions implanted in the substrate, the temperature of the substrate is then adjusted below the nucleation temperature of the ions, and the temperature is maintained until cleaving of the substrate occurs. Microwaves may be used to provide heating of the substrate for the processes. A cleaving sensor may be used for detection of successful cleaving by detecting pressure changes, acoustic emissions, changes within the substrate, and/or residual gases given off by the implanted ions when the cleaving occurs.

公开(公告)号：US20210001520A1

公开(公告)日：2021-01-07

申请号：US16919736

申请日：2020-07-02

Applicant: APPLIED MATERIALS, INC.

Inventor： Tuck Foong KOH ,  Chien-Kang HSIUNG ,  Yueh Sheng OW ,  Felix DENG ,  Yue CUI ,  Nuno Yen-Chu CHEN ,  Ananthkrishna JUPUDI ,  Clinton GOH ,  Vinodh RAMACHANDRAN

IPC: B29C35/08 ,  H05B6/80 ,  H05B6/70 ,  H05B6/68

Abstract: Methods and apparatus for curing a substrate or polymer using variable microwave frequency are provided herein. In some embodiments, a method of curing a substrate or polymer using variable microwave frequency includes: contacting a substrate or polymer with a plurality of predetermined discontinuous microwave energy bandwidths or a plurality of predetermined discontinuous microwave energy frequencies to cure the substrate or polymer.

公开(公告)号：US20210335582A1

公开(公告)日：2021-10-28

申请号：US16857828

申请日：2020-04-24

Applicant: APPLIED MATERIALS, INC.

Inventor： Yueh Sheng OW ,  Yuichi WADA ,  Junqi WEI ,  Kang ZHANG ,  Ananthkrishna JUPUDI ,  Sarath BABU ,  Kok Seong TEO ,  Kok Wei TAN

IPC: H01J37/32 ,  H01L21/67

Abstract: Apparatus and methods use a unique process kit to protect a processing volume of a process chamber. The process kit includes a shield with a frame configured to be insertable into a shield and a foil liner composed of a metallic material that is attachable to the frame at specific points. The specific attachment points are spaced apart to produce an amount of flexibility based on a malleability of the metallic material. The amount of flexibility ranges from approximately 2.5 to approximately 4.5.

公开(公告)号：US20210217656A1

公开(公告)日：2021-07-15

申请号：US17217179

申请日：2021-03-30

Applicant: APPLIED MATERIALS, INC.

Inventor： Felix DENG ,  Yueh Sheng OW ,  Tuck Foong KOH ,  Nuno Yen-Chu CHEN ,  Yuichi WADA ,  Sree Rangasai V. KESAPRAGADA ,  Clinton GOH

IPC: H01L21/762 ,  H01L21/67

Abstract: Methods and apparatus for cleaving a substrate in a semiconductor chamber. The semiconductor chamber pressure is adjusted to a process pressure, a substrate is then heated to a nucleation temperature of ions implanted in the substrate, the temperature of the substrate is then adjusted below the nucleation temperature of the ions, and the temperature is maintained until cleaving of the substrate occurs. Microwaves may be used to provide heating of the substrate for the processes. A cleaving sensor may be used for detection of successful cleaving by detecting pressure changes, acoustic emissions, changes within the substrate, and/or residual gases given off by the implanted ions when the cleaving occurs.

公开(公告)号：US20180240666A1

公开(公告)日：2018-08-23

申请号：US15959008

申请日：2018-04-20

Applicant: Applied Materials, Inc.

Inventor： Loke Yuen WONG ,  Ke CHANG ,  Yueh Sheng OW ,  Ananthkrishna JUPUDI ,  Glen T. MORI ,  Aksel KITOWSKI ,  Arkajit Roy BARMAN

IPC: H01L21/02 ,  C23C16/511 ,  H01L21/3105 ,  C23C14/22 ,  H01L21/67 ,  C23C16/46

CPC classification number: H01L21/02345 ,  C23C14/22 ,  C23C16/46 ,  C23C16/511 ,  H01L21/02118 ,  H01L21/02266 ,  H01L21/0234 ,  H01L21/31058 ,  H01L21/67115

Abstract: Methods and apparatus for processing a substrate are described herein. A vacuum multi-chamber deposition tool can include a degas chamber with both a heating mechanism and a variable frequency microwave source. The methods described herein use variable frequency microwave radiation to increased quality and speed of the degas process without damaging the various components.

公开(公告)号：US20170117146A1

公开(公告)日：2017-04-27

申请号：US15399614

申请日：2017-01-05

Applicant: Applied Materials, Inc.

Inventor： Loke Yuen WONG ,  Ke CHANG ,  Yueh Sheng OW ,  Ananthkrishna JUPUDI ,  Glen T. MORI ,  Aksel KITOWSKI ,  Arkajit Roy BARMAN

IPC: H01L21/02 ,  C23C16/511 ,  C23C14/22 ,  C23C16/46 ,  H01L21/3105 ,  H01L21/67

CPC classification number: H01L21/02345 ,  C23C14/22 ,  C23C16/46 ,  C23C16/511 ,  H01L21/02118 ,  H01L21/02266 ,  H01L21/0234 ,  H01L21/31058 ,  H01L21/67115

Abstract: Methods and apparatus for processing a substrate are described herein. A vacuum multi-chamber deposition tool can include a degas chamber with both a heating mechanism and a variable frequency microwave source. The methods described herein use variable frequency microwave radiation to increased quality and speed of the degas process without damaging the various components.

公开(公告)号：US20150056819A1

公开(公告)日：2015-02-26

申请号：US14322484

申请日：2014-07-02

Applicant: Applied Materials, Inc.

Inventor： Loke Yuen WONG ,  Ke CHANG ,  Yueh Sheng OW ,  Ananthkrishna JUPUDI ,  Glen T. MORI ,  Aksel KITOWSKI ,  Arkajit Roy BARMAN

IPC: H01L21/02

CPC classification number: H01L21/02345 ,  C23C14/22 ,  C23C16/46 ,  C23C16/511 ,  H01L21/02118 ,  H01L21/02266 ,  H01L21/0234 ,  H01L21/31058 ,  H01L21/67115

Abstract: Methods and apparatus for processing a substrate are described herein. A vacuum multi-chamber deposition tool can include a degas chamber with both a heating mechanism and a variable frequency microwave source. The methods described herein use variable frequency microwave radiation to increased quality and speed of the degas process without damaging the various components.

Abstract translation: 本文描述了用于处理衬底的方法和设备。 真空多室沉积工具可以包括具有加热机构和可变频率微波源的脱气室。 本文描述的方法使用可变频率微波辐射来提高脱气过程的质量和速度，而不损害各种组分。