摘要:
A photosensitive insulating resin composition includes a block copolymer, a crosslinking agent, a photosensitive compound, and a solvent. The block copolymer includes a first structural unit shown by a following formula (1) and a second structural unit shown by a following formula (2), wherein R1 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R2 represents an alkyl group having 1 to 4 carbon atoms.
摘要:
A photosensitive insulating resin composition includes a block copolymer, a crosslinking agent, a photosensitive compound, and a solvent. The block copolymer includes a first structural unit shown by a following formula (1) and a second structural unit shown by a following formula (2), wherein R1 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R2 represents an alkyl group having 1 to 4 carbon atoms.
摘要:
A photosensitive insulating resin composition capable of forming an interlayer insulating film, or planarized film, or surface protective film, or insulating film for high-density mount substrate excelling in properties, such as resolution, adherence, thermal impact, electrical insulation, patterning performance and elongation; a hardening product thereof; and a circuit board equipped with the hardening product. There is provided a positive photosensitive insulating resin composition comprising an alkali-soluble resin; a compound having a quinonediazido group; and crosslinked resin particles of a particulate copolymer whose 20 to 90 mol % constituent is derived from a hydroxylated and/or carboxylated monomer.
摘要:
Disclosed is a positive photosensitive insulating resin composition including: (A) an alkali soluble resin, (B) a compound having a quinonediazide group, and (C) an epoxy resin having a softening point of not lower than 30° C.; and a cured product which is obtained by curing the composition. The cured product obtained by curing the composition is excellent in resolution, electrical insulation, thermal shock resistance and adhesion, and exhibits reduced deformation after post-baking.
摘要:
An object of the present invention is to provide a cured product which is excellent in characteristics such as an electric insulation property, a heat impact resistance, an adhesive property and the like and to provide a photosensitive insulation resin composition from which the above cured product can be obtained and which is suited to uses such as an interlayer insulation film, a surface protecting layer and the like in semiconductor elements. The photosensitive insulation resin composition according to the present invention is characterized by comprising (A) a copolymer comprising 10 to 99 mole % of a constitutional unit (A1) represented by the following Formula (1) and 90 to 1 mole % of a constitutional unit (A2) represented by the following Formula (2) (provided that the total of all constitutional units constituting the above copolymer (A) is 100 mole %): (wherein R1 represents an alkyl group having 1 to 4 carbon atoms, an alkoxy group or an aryl group; R2 represents a hydrogen atom or methyl; m is an integer of 1 to 3, and n is an integer of 0 to 3; and m+n≦5; R3 represents an alkyl group having 1 to 4 carbon atoms, an alkoxy group or an aryl group; R4 represents a hydrogen atom or methyl; and k is an integer of 0 to 3), (B) a compound (B1) having an oxetanyl group, (C) a photosensitive acid generator, (D) a solvent and (F) cross-linked fine particles.
摘要翻译:本发明的目的是提供一种电绝缘性,耐热冲击性,粘合性等特性优异的固化物,并提供一种感光绝缘树脂组合物,其中上述固化产物可由 可以得到并适用于半导体元件中的层间绝缘膜,表面保护层等的用途。 本发明的感光性绝缘性树脂组合物的特征在于,包含(A)由下述通式(1)表示的结构单元(A1)和10〜99摩尔%的由下式(1)表示的结构单元(A1)和90〜1摩尔% (A2)(条件是构成上述共聚物(A)的全部构成单元的总量为100摩尔%):(其中,R1表示碳原子数1〜4的烷基,烷氧基 或芳基; R 2表示氢原子或甲基; m表示1〜3的整数,n表示0〜3的整数,m + n <= 5,R 3表示碳原子数1〜4的烷基 原子,烷氧基或芳基; R4表示氢原子或甲基; k表示0〜3的整数),(B)具有氧杂环丁烷基的化合物(B1),(C)感光性酸发生剂, (D)溶剂和(F)交联的细颗粒。
摘要:
A photosensitive insulating resin composition capable of forming an interlayer insulating film, or planarized film, or surface protective film, or insulating film for high-density mount substrate excelling in properties, such as resolution, adherence, thermal impact, electrical insulation, patterning performance and elongation; a hardening product thereof; and a circuit board equipped with the hardening product. There is provided a positive photosensitive insulating resin composition comprising an alkali-soluble resin; a compound having a quinonediazido group; and crosslinked resin particles of a particulate copolymer whose 20 to 90 mol % constituent is derived from a hydroxylated and/or carboxylated monomer.
摘要:
Disclosed is a positive photosensitive insulating resin composition including: (A) an alkali soluble resin, (B) a compound having a quinonediazide group, and (C) an epoxy resin having a softening point of not lower than 30° C.; and a cured product which is obtained by curing the composition. The cured product obtained by curing the composition is excellent in resolution, electrical insulation, thermal shock resistance and adhesion, and exhibits reduced deformation after post-baking.
摘要:
The objective of the present invention is to provide a photosensitive insulating resin composition which is highly sensitive to g-line and h-line and enables to form a surface-protecting film, an interlayer insulation film and a planarized film that are excellent in various properties including resolution, electrical insulation property and thermal shock resistance, a cured product and an electronic component having the cured product. The present photosensitive insulating resin composition comprises an alkali-soluble resin having a phenolic hydroxyl group, a radiation sensitive acid generator comprising an s-triazine derivative represented by the following general formula (1), and a crosslinking agent. [In the formula (1), R is hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an alkoxyl group having 1 to 4 carbon atoms, X is a halogen atom and Y is oxygen atom or sulfur atom.]
摘要:
The objective of the present invention is to provide a photosensitive insulating resin composition which is highly sensitive to g-line and h-line and enables to form a surface-protecting film, an interlayer insulation film and a planarized film that are excellent in various properties including resolution, electrical insulation property and thermal shock resistance, a cured product and an electronic component having the cured product. The present photosensitive insulating resin composition comprises an alkali-soluble resin having a phenolic hydroxyl group, a radiation sensitive acid generator comprising an s-triazine derivative represented by the following general formula (1), and a crosslinking agent. [In the formula (1), R is hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an alkoxyl group having 1 to 4 carbon atoms, X is a halogen atom and Y is oxygen atom or sulfur atom.]
摘要:
A compound synthesis method includes bonding a first compound to a substrate to form a first film. A second film is formed on the first film using an acid-transfer composition including (A) a polymer that includes a structural unit shown by a following formula (1) and a structural unit shown by a following formula (2), (B) a photoacid generator shown by a following formula (3), and (C) a sensitizer shown by a following formula (4). The second film is exposed to remove the protecting group from the first compound under an exposed area of the second film. An acid generated in the exposed area of the second film is transferred to the first film. The second film after being exposed is removed. A second compound is bonded to the first compound from which the protecting group has been removed.