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    LAMINATE POLISHING PAD
    1.
    发明申请
    LAMINATE POLISHING PAD 审中-公开
    层压抛光垫

    公开(公告)号：US20130012107A1

    公开(公告)日：2013-01-10

    申请号：US13636967

    申请日：2011-03-11

    申请人： Atsushi Kazuno

    发明人： Atsushi Kazuno

    IPC分类号： B24D11/00 ,  H01L21/304

    CPC分类号： B24B37/22 ,  B24B37/26

    摘要： An object of the invention is to provide a laminate polishing pad having a polishing layer and a cushion layer, which resist peeling. A laminate polishing pad including: a polishing layer with no region passing therethrough; an adhesive member; and a cushion layer placed on the polishing layer with the adhesive member interposed therebetween, wherein the back side of the polishing layer has at least one non-adhering region X continuously extending from a central region of the polishing layer to a peripheral end of the polishing layer, and/or the adhesive member has at least one non-adhering region Y continuously extending from a central region of the adhesive member to a peripheral end of the adhesive member.

    摘要翻译： 本发明的目的是提供一种具有抗剥离的抛光层和缓冲层的层压抛光垫。 一种层压抛光垫，包括：没有区域通过的抛光层; 粘合剂; 以及缓冲层，其中所述粘合剂构件设置在所述抛光层上，其中所述抛光层的背面具有至少一个从所述抛光层的中心区域延伸到所述抛光的外周端的非粘附区域X 层和/或粘合构件具有从粘合构件的中心区域连续延伸到粘合构件的外周端的至少一个非粘附区域Y。

    POLISHING PAD
    3.
    发明申请
    POLISHING PAD 有权
    抛光垫

    公开(公告)号：US20110053377A1

    公开(公告)日：2011-03-03

    申请号：US12531005

    申请日：2008-03-12

    申请人： Kazuyuki Ogawa ,  Atsushi Kazuno ,  Tsuyoshi Kimura ,  Tetsuo Shimomura

    发明人： Kazuyuki Ogawa ,  Atsushi Kazuno ,  Tsuyoshi Kimura ,  Tetsuo Shimomura

    IPC分类号： H01L21/306 ,  B24D11/00

    CPC分类号： H01L21/30625 ,  B24B37/205

    摘要： An object of the present invention is to provide a polishing pad that is prevented from causing an end-point detection error due to a reduction in light transmittance from the early stage to the final stage of the process, and to provide a method of producing a semiconductor device with the polishing pad. The present invention is directed to a polishing pad, comprising a polishing layer comprising a polishing region and a light-transmitting region, wherein a polishing side surface of the light-transmitting region is subjected to a surface roughness treatment, and the light-transmitting region has a light transmittance of 40% to 60% at a wavelength of 600 nm before use.

    摘要翻译： 本发明的目的是提供一种抛光垫，其防止由于从该工艺的早期阶段到最终阶段的透光率的降低导致终点检测误差，并且提供一种制造方法 具有抛光垫的半导体器件。 本发明涉及一种抛光垫，其包括：抛光层，包括抛光区域和透光区域，其中对所述透光区域的抛光侧表面进行表面粗糙度处理，并且所述光透射区域 使用前在600nm的波长下的透光率为40％〜60％。

    Polishing pad and semiconductor device manufacturing method
    4.
    发明授权
    Polishing pad and semiconductor device manufacturing method 有权
    抛光垫和半导体器件的制造方法

    公开(公告)号：US07731568B2

    公开(公告)日：2010-06-08

    申请号：US10598717

    申请日：2004-10-20

    申请人： Tetsuo Shimomura ,  Masahiko Nakamori ,  Takatoshi Yamada ,  Kazuyuki Ogawa ,  Atsushi Kazuno ,  Masahiro Watanabe

    发明人： Tetsuo Shimomura ,  Masahiko Nakamori ,  Takatoshi Yamada ,  Kazuyuki Ogawa ,  Atsushi Kazuno ,  Masahiro Watanabe

    IPC分类号： B24B7/00 ,  B24B7/19 ,  B24B5/00 ,  B24B29/00 ,  B24D11/00

    CPC分类号： B24B37/205 ,  H01L21/30625

    摘要： The object of the invention is to provide a polishing pad capable of maintaining high-precision end-point optical detection over a long period from the start of use to the end of use even if polishing is performed with an alkaline or acid slurry, as well as a method of manufacturing a semiconductor device with this polishing pad. The polishing pad of the invention is used in chemical mechanical polishing and has a polishing region and a light-transmitting region, wherein the light-transmitting region satisfies that the difference ΔT (ΔT=T0−T1) (%) between T0 and T1 is within 10(%) over the whole range of measurement wavelengths of from 400 to 700 nm, wherein T1 is the light transmittance (%) of the light-transmitting region measured at the measurement wavelength λ after dipping for 24 hours in a KOH aqueous solution at pH 11 or an H2O2 aqueous solution at pH 4 and T0 is the light-transmittance (%) measured at the measurement wavelength λ before the dipping.

    摘要翻译： 本发明的目的是提供一种抛光垫，即使在用碱性或酸性浆料进行研磨的同时，也能够在从使用开始到使用结束的长时间内保持高精度的端点光学检测 作为使用该研磨垫的半导体装置的制造方法。 本发明的抛光垫用于化学机械抛光，并具有抛光区域和透光区域，其中透光区域满足以下区别：Dgr; T（＆Dgr; T = T0-T1）（％） T0和T1在400〜700nm的测量波长的整个范围内在10（％）以内，其中T1是在浸渍24小时后在测量波长λ测量的透光区域的透光率（％） pH为11的KOH水溶液或pH4的H 2 O 2水溶液，T0为在浸渍前测定的波长λ下测定的透光率（％）。

    Polishing pad
    6.
    发明授权
    Polishing pad 有权
    抛光垫

    公开(公告)号：US08993648B2

    公开(公告)日：2015-03-31

    申请号：US12439154

    申请日：2007-08-16

    申请人： Yoshiyuki Nakai ,  Tsuyoshi Kimura ,  Atsushi Kazuno ,  Kazuyuki Ogawa ,  Tetsuo Shimomura

    发明人： Yoshiyuki Nakai ,  Tsuyoshi Kimura ,  Atsushi Kazuno ,  Kazuyuki Ogawa ,  Tetsuo Shimomura

    IPC分类号： C08G18/00 ,  B24B37/24 ,  B24D3/26 ,  C08G18/10 ,  C08G18/48 ,  C08G18/66 ,  C08G18/72

    CPC分类号： B24B37/24 ,  B24B29/00 ,  B24D3/26 ,  B24D3/32 ,  C08G18/10 ,  C08G18/14 ,  C08G18/4854 ,  C08G18/6674 ,  C08G18/724 ,  C08G18/7831 ,  C08G18/3814 ,  C08G18/792

    摘要： A polishing pad capable of maintaining a high level of dimensional stability during absorption of moisture or water includes a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of an isocyanate-terminated prepolymer (A), a polymerized diisocyanate, and a chain extender, and the isocyanate-terminated prepolymer (A) includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol. A method for manufacturing such a polishing pad includes mixing a first component containing an isocyanate-terminated prepolymer with a second component containing a chain extender and curing the mixture to form a polyurethane foam. The pad so made is used in the manufacture of semiconductor devices.

    摘要翻译： 能够在吸收水分或水的同时维持高水平的尺寸稳定性的抛光垫包括：抛光层，其包括具有细孔的聚氨酯泡沫，其中聚氨酯泡沫包括异氰酸酯封端的预聚物（A）的反应的固化产物， 聚合二异氰酸酯和扩链剂，异氰酸酯封端的预聚物（A）包括异氰酸酯单体，高分子量多元醇（a）和低分子量多元醇。 制造这种抛光垫的方法包括将含有异氰酸酯封端的预聚物的第一组分与含有扩链剂的第二组分混合并固化该混合物以形成聚氨酯泡沫。 如此制成的焊盘用于制造半导体器件。

    Polishing pad
    9.
    发明授权
    Polishing pad 有权
    抛光垫

    公开(公告)号：US07871309B2

    公开(公告)日：2011-01-18

    申请号：US11720964

    申请日：2005-12-08

    申请人： Kazuyuki Ogawa ,  Tetsuo Shimomura ,  Atsushi Kazuno ,  Yoshiyuki Nakai ,  Masahiro Watanabe ,  Takatoshi Yamada ,  Masahiko Nakamori

    发明人： Kazuyuki Ogawa ,  Tetsuo Shimomura ,  Atsushi Kazuno ,  Yoshiyuki Nakai ,  Masahiro Watanabe ,  Takatoshi Yamada ,  Masahiko Nakamori

    IPC分类号： B24B1/00 ,  B24D11/00

    CPC分类号： B24B37/205 ,  Y10T428/24339 ,  Y10T428/24992

    摘要： It is an object of the invention to provide a polishing pad capable of high precision optical detection of an endpoint during polishing in progress and prevention of slurry leakage from between a polishing region and a light-transmitting region during the use thereof even after the polishing pad has been used for a long period. It is a second object of the invention to provide a polishing pad capable of suppression of deterioration of polishing characteristics (such as in-plane uniformity) and generation of scratches due to a difference in behavior of a polishing region and a light-transmitting region during polishing. It is a third object of the invention to provide a polishing pad having a polishing region and a light-transmitting region with a concentration of a specific metal equal to or lower than a specific value (threshold value).

    摘要翻译： 本发明的目的是提供一种抛光垫，其能够在抛光过程中对端点进行高精度光学检测，并且即使在抛光垫之后也可防止在使用期间抛光区域和透光区域之间的浆料泄漏 已被使用了很长时间。 本发明的第二个目的是提供一种能够抑制抛光特性（例如面内均匀性）劣化的抛光垫以及由于抛光区域和透光区域的行为差异而产生的划痕 抛光。 本发明的第三个目的是提供一种具有抛光区域和特定金属浓度等于或低于特定值（阈值）的透光区域的抛光垫。

    POLISHING PAD
    10.
    发明申请
    POLISHING PAD 有权
    抛光垫

    公开(公告)号：US20100015893A1

    公开(公告)日：2010-01-21

    申请号：US12439135

    申请日：2007-08-22

    申请人： Atsushi Kazuno ,  Tetsuo Shimomura ,  Yoshiyuki Nakai ,  Kazuyuki Ogawa ,  Tsuyoshi Kimura

    发明人： Atsushi Kazuno ,  Tetsuo Shimomura ,  Yoshiyuki Nakai ,  Kazuyuki Ogawa ,  Tsuyoshi Kimura

    IPC分类号： B24B1/00 ,  C08G18/10 ,  C08G18/82

    CPC分类号： B24B37/24 ,  B24D3/26 ,  C08G18/12 ,  C08G18/4238 ,  C08G18/4854 ,  C08G18/664 ,  C08G18/6674 ,  C08G18/724 ,  C08G18/7621 ,  C08J9/30 ,  C08J2375/04 ,  C08L83/00 ,  C08G18/3243

    摘要： An object of the invention is to provide a polishing pad having excellent planarization performance and wear resistance and to provide a method for manufacture thereof. The invention is directed to a polishing pad including a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam is a cured product of a reaction of (1) an isocyanate-terminated prepolymer (A) that is capable of reacting with 4,4′-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan δ peak temperature of 100° C. or more, (2) an isocyanate-terminated prepolymer (B) that is capable of reacting with 4,4′-methylenebis(o-chloroaniline) to form a non-foamed polyurethane having a tan δ peak temperature of 40° C. or less, and (3) 4,4′-methylenebis(o-chloroaniline), and the isocyanate-terminated prepolymers (A) and (B) are mixed in an (A)/(B) ratio of 50/50 to 90/10 (by wt %).

    摘要翻译： 本发明的目的是提供一种具有优异的平坦化性能和耐磨性的抛光垫，并提供其制造方法。 本发明涉及一种抛光垫，其包括具有细小细胞的聚氨酯泡沫的抛光层，其中聚氨酯泡沫是（1）能够与4反应的异氰酸酯封端的预聚物（A）的反应的固化产物 4'-亚甲基双（邻氯苯胺），形成tanδ峰值温度为100℃以上的非发泡聚氨酯，（2）异氰酸酯封端的预聚物（B），其能够与4， 4'-亚甲基双（邻氯苯胺），形成tanδ峰值温度为40℃以下的非发泡聚氨酯，（3）4,4'-亚甲基双（邻氯苯胺），异氰酸酯 - 封端的预聚物（A）和（B）以50/50至90/10（重量％）的（A）/（B）比混合。